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    • 1. 发明授权
    • Semiconductor device manufacturing system and method of manufacturing semiconductor devices
    • 半导体器件制造系统和半导体器件的制造方法
    • US06349240B2
    • 2002-02-19
    • US09814871
    • 2001-03-23
    • Sumio OgawaMinoru UekiShinichi Hara
    • Sumio OgawaMinoru UekiShinichi Hara
    • G06F1900
    • H01L22/20H01L2924/0002Y10T29/41H01L2924/00
    • A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.
    • 提供了一种半导体器件制造系统,其中读取芯片位置信息而不从包装中去除树脂,从而可以快速识别和去除故障的原因,并且可以快速提高芯片的产量。 替换地址读取装置从在半导体器件被封装到封装中之后执行的测试中被确定为有故障的半导体器件中读取冗余地址。 芯片位置分析装置从这些冗余地址的组合估计有缺陷的半导体器件的批号,晶片号和芯片数。 故障分布映射设备根据这样获得的数据,对批次中每个晶片中的故障芯片的分布进行映射。 故障原因确定装置基于上述分布来识别哪个制造装置或处理步骤已经导致晶片过程中的故障。
    • 3. 发明授权
    • Semiconductor memory production system and semiconductor memory production method
    • 半导体存储器生产系统和半导体存储器生产方法
    • US06532182B2
    • 2003-03-11
    • US09811529
    • 2001-03-20
    • Sumio OgawaShinichi Hara
    • Sumio OgawaShinichi Hara
    • G11C700
    • H01L22/22H01L22/20H01L2924/0002Y02P90/10Y02P90/14H01L2924/00
    • A semiconductor memory production system is provided, capable of holding the data necessary for process analysis for each lot in chronological order using a small amount of information, and which enables production management based on data that has been stored previously without performing new measurements. The semiconductor memory production system comprises: an LSI tester 1 that tests semiconductor memory and outputs the addresses of memory cells for each chip and a pass/fail bitmap corresponding to these addresses, and a process defect estimating device 34 that extracts the bit addresses of fail bits from the bitmap, and determines replacement addresses of word lines and bit lines to be replaced by redundant word lines and redundant bit lines in the redundant memory section, and estimates process defects from statistical analysis of the distribution condition of each chip on each wafer. Through this estimated result, feedback to the manufacturing line/process step prevents from producing defects frequently.
    • 提供一种半导体存储器制造系统,其能够使用少量的信息按照时间顺序保存每个批次的处理分析所必需的数据,并且其能够基于先前已经存储的数据进行生产管理而不执行新的测量。 半导体存储器制造系统包括:LSI测试器1,其测试半导体存储器并输出每个芯片的存储单元的地址以及对应于这些地址的通过/失败位图;以及处理缺陷估计器34,其提取失败的位地址 并且确定要由冗余存储器部分中的冗余字线和冗余位线替换的字线和位线的替换地址,并且从每个晶片上每个芯片的分布条件的统计分析来估计处理缺陷。 通过这个估计结果,反馈到生产线/加工步骤防止频繁地产生缺陷。