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    • 2. 发明授权
    • Semiconductor device manufacturing system and method of manufacturing semiconductor devices
    • 半导体器件制造系统和半导体器件的制造方法
    • US06349240B2
    • 2002-02-19
    • US09814871
    • 2001-03-23
    • Sumio OgawaMinoru UekiShinichi Hara
    • Sumio OgawaMinoru UekiShinichi Hara
    • G06F1900
    • H01L22/20H01L2924/0002Y10T29/41H01L2924/00
    • A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.
    • 提供了一种半导体器件制造系统,其中读取芯片位置信息而不从包装中去除树脂,从而可以快速识别和去除故障的原因,并且可以快速提高芯片的产量。 替换地址读取装置从在半导体器件被封装到封装中之后执行的测试中被确定为有故障的半导体器件中读取冗余地址。 芯片位置分析装置从这些冗余地址的组合估计有缺陷的半导体器件的批号,晶片号和芯片数。 故障分布映射设备根据这样获得的数据,对批次中每个晶片中的故障芯片的分布进行映射。 故障原因确定装置基于上述分布来识别哪个制造装置或处理步骤已经导致晶片过程中的故障。