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1. 发明申请

US20110071396A1 ULTRASONIC PROBE, METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC APPARATUS 审中-公开
标题翻译：超声探头及其制造方法及超声波诊断装置
公开(公告)号：US20110071396A1
公开(公告)日：2011-03-24
申请号：US12992683
申请日：2009-05-13
申请人： Shuzo Sano , Yasuhiro Yoshimura , Tatsuya Nagata , Makoto Fukada , Akifumi Sako
发明人： Shuzo Sano , Yasuhiro Yoshimura , Tatsuya Nagata , Makoto Fukada , Akifumi Sako
IPC分类号： A61B8/14 , G10K9/12 , H04R31/00
CPC分类号： B06B1/0292 , A61B8/06 , A61B8/13 , A61B8/4455 , G01N29/2406 , Y10T29/49005
摘要： An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.
摘要翻译：超声波探头设置有具有多个换能器元件的CMUT芯片，该多个换能器元件根据用于发送和接收超声波的偏置电压来改变机电耦合系数或灵敏度，形成在CMUT芯片的超声照射侧上的导电层，布置在CMUT芯片的超声波照射侧的声透镜，与声透镜的超声波照射侧相反的方向形成的绝缘层，存储CMUT芯片的壳体单元，其中导电层和绝缘层用粘合剂和声透镜固定，其中绝缘层由至少包含氧化硅或对二甲苯的材料形成，以防止粘合剂的溶剂浸入粘附部分。

2. 发明授权

US08551003B2 Ultrasonic probe and ultrasonic diagnosis device 有权
标题翻译：超声波探头和超声波诊断装置
公开(公告)号：US08551003B2
公开(公告)日：2013-10-08
申请号：US12602119
申请日：2008-05-14
申请人： Makoto Fukada , Shuzo Sano , Akifumi Sako
发明人： Makoto Fukada , Shuzo Sano , Akifumi Sako
IPC分类号： A61B8/00
CPC分类号： B06B1/0292
摘要： An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.
摘要翻译：提供了能够提高操作者的电气安全性的超声波探头和超声波诊断装置。超声波探头2在安装基板43和外壳25之间具有绝缘部62.由于可以防止来自超声波探头2的内部装置的漏电，因此能够提高操作者的超声波探头2的电气安全性。在cMUT芯片20的超声波辐射侧设置有导电膜61，并且沿着绝缘构件62设置导电构件63.导电膜61和导电构件63通过导电构件64连接。封闭具有接地电位的空间由导电膜61，导电构件63和连接到地的同轴电缆55形成。超声波探头2的主要部件或体电路被包含在具有接地电位的封闭空间中并与外部电隔离。

3. 发明申请

US20100242612A1 ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME 有权
标题翻译：超声波探头和超声波诊断装置
公开(公告)号：US20100242612A1
公开(公告)日：2010-09-30
申请号：US12744020
申请日：2008-11-21
申请人： Shuzo Sano , Makoto Fukada , Akifumi Sako
发明人： Shuzo Sano , Makoto Fukada , Akifumi Sako
IPC分类号： G01N29/00
CPC分类号： G01N29/2406 , A61B8/06 , B06B1/0292 , G01N29/326 , G01N2291/044 , G01N2291/106
摘要： An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.
摘要翻译：一种超声波探头，包括具有机电耦合系数或灵敏度根据偏置电压而变化并发送/接收超声波的多个振荡元件的cMUT芯片，设置在cMUT芯片的超声波发送/接收侧的声透镜，提供给cMUT芯片相对于声透镜的相对表面的背衬层，以及设置在背衬层和cMUT芯片之间的衬底。超声波探头还包括用于抑制由于基板和背衬层之间的温度变化引起的线膨胀系数的差异而产生的热应力的热应力抑制装置。

4. 发明授权

US08408063B2 Ultrasonic probe, and ultrasonic diagnostic apparatus using the same 有权
标题翻译：超声波探头和使用其的超声波诊断装置
公开(公告)号：US08408063B2
公开(公告)日：2013-04-02
申请号：US12744020
申请日：2008-11-21
申请人： Shuzo Sano , Makoto Fukada , Akifumi Sako
发明人： Shuzo Sano , Makoto Fukada , Akifumi Sako
IPC分类号： G01N29/00
CPC分类号： G01N29/2406 , A61B8/06 , B06B1/0292 , G01N29/326 , G01N2291/044 , G01N2291/106
摘要： An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.
摘要翻译：一种超声波探头，包括具有机电耦合系数或灵敏度根据偏置电压而变化并发送/接收超声波的多个振荡元件的cMUT芯片，设置在cMUT芯片的超声波发送/接收侧的声透镜，提供给cMUT芯片相对于声透镜的相对表面的背衬层，以及设置在背衬层和cMUT芯片之间的衬底。超声波探头还包括用于抑制由于基板和背衬层之间的温度变化引起的线膨胀系数的差异而产生的热应力的热应力抑制装置。

5. 发明申请

US20100154547A1 ULTRASONIC PROBE AND ULTRASONIC DIAGNOSIS DEVICE 有权
标题翻译：超声探头和超声诊断装置
公开(公告)号：US20100154547A1
公开(公告)日：2010-06-24
申请号：US12602119
申请日：2008-05-14
申请人： Makoto Fukada , Shuzo Sano , Akifumi Sako
发明人： Makoto Fukada , Shuzo Sano , Akifumi Sako
IPC分类号： G01N29/24
CPC分类号： B06B1/0292
摘要： An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.
摘要翻译：提供了能够提高操作者的电气安全性的超声波探头和超声波诊断装置。超声波探头2在安装基板43和外壳25之间具有绝缘部62.由于可以防止来自超声波探头2的内部装置的漏电，因此能够提高操作者的超声波探头2的电气安全性。在cMUT芯片20的超声波辐射侧设置有导电膜61，并且沿着绝缘构件62设置导电构件63.导电膜61和导电构件63通过导电构件64连接。封闭具有接地电位的空间由导电膜61，导电构件63和连接到地的同轴电缆55形成。超声波探头2的主要部件或体电路被包含在具有接地电位的封闭空间中并与外部电隔离。

6. 发明申请

US20100036257A1 ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME 有权
标题翻译：超声波探头和超声波诊断装置
公开(公告)号：US20100036257A1
公开(公告)日：2010-02-11
申请号：US12513858
申请日：2007-11-06
申请人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/00
CPC分类号： A61B8/4281 , A61B8/4455 , A61B8/4483 , B06B1/0292 , H04R19/005
摘要： Provided is an ultrasonic probe including: a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves; an acoustic lens arranged above the cMUT chip: and a backing layer arranged below the cMUT chip.Electric leakage preventing means is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip.The electric leakage preventing means is, for example, an insulating layer such as a ground layer.By using such a structure, it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.
摘要翻译：本发明提供一种超声波探头，包括：cMUT芯片，具有多个振动元件，其机电耦合系数或灵敏度根据偏置电压而变化，并且发送和接收超声波; 布置在cMUT芯片上方的声透镜;以及布置在cMUT芯片下方的背衬层。在声透镜的超声波发射/接收表面侧或声透镜和cMUT芯片之间设置防漏电装置。漏电防止装置例如是诸如接地层的绝缘层。通过使用这样的结构，能够提供能够防止从超声波探头向被检体的电泄漏以提高电气安全性的超声波探头和使用该探针的超声波诊断装置。

7. 发明授权

US08540640B2 Ultrasonic probe and method for manufacturing the same and ultrasonic diagnostic device 有权
标题翻译：超声波探头及其制造方法及超声波诊断装置
公开(公告)号：US08540640B2
公开(公告)日：2013-09-24
申请号：US12525353
申请日：2008-02-27
申请人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/14
CPC分类号： G01N29/2406 , B06B1/0292 , G01N29/0654 , G01N29/221 , G01N2291/106
摘要： An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20).
摘要翻译：超声波探头（2）包括cMUT芯片（20），其具有多个振动元件，其机电耦合系数或灵敏度根据偏置电压而变化，并且发送/接收超声波; 设置在cMUT芯片（20）的超声波辐射侧的声透镜（26）; 设置在所述cMUT芯片（20）背面的用于吸收超声波传播的背衬层（22）; 从cMUT芯片（20）的周边部分到背衬层（22）的侧面设置的电连接部分（柔性基板（72）），并且具有与cMUT芯片的电极连接的信号图案（20）; 以及用于容纳cMUT芯片（20），声透镜（26），背层（22）和电布线部分（柔性基板（72））的外壳（超声波探头盖（25））。地电位的接地层（导电膜（76））设置在cMUT芯片（20）的超声波辐射侧。

8. 发明授权

US08758253B2 Ultrasonic probe and ultrasonic diagnostic apparatus using the same 有权
标题翻译：超声波探头和超声波诊断仪使用相同
公开(公告)号：US08758253B2
公开(公告)日：2014-06-24
申请号：US12513858
申请日：2007-11-06
申请人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/14 , A61B8/00
CPC分类号： A61B8/4281 , A61B8/4455 , A61B8/4483 , B06B1/0292 , H04R19/005
摘要： An ultrasonic probe is disclosed which includes a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves, an acoustic lens arranged above the cMUT chip, and a backing layer arranged below the cMUT chip. An electric leakage preventing unit is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip. The electric leakage preventing unit can be, for example, an insulating layer such as a ground layer. Such a structure makes it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.
摘要翻译：公开了一种超声波探头，其包括具有多个振动元件的cMUT芯片，其中机电耦合系数或灵敏度根据偏置电压而变化，并且发送和接收超声波，布置在cMUT芯片上方的声透镜，以及布置在在cMUT芯片之下。在声透镜的超声波发送/接收表面侧或声透镜和cMUT芯片之间设置漏电防止单元。防漏电单元可以是例如绝缘层，例如接地层。通过这样的结构，能够提供能够防止从超声波探头向被检体的漏电以提高电气安全性的超声波探头以及使用该探针的超声波诊断装置。

9. 发明授权

US5026664A Method of providing a semiconductor IC device with an additional conduction path 失效
标题翻译：提供具有附加传导路径的半导体IC器件的方法
公开(公告)号：US5026664A
公开(公告)日：1991-06-25
申请号：US334145
申请日：1989-04-06
申请人： Mikio Hongo , Katsuro Mizukoshi , Shuzo Sano , Takashi Kamimura , Fumikazu Itoh , Akira Shimase , Satoshi Haraichi , Takahiko Takahashi
发明人： Mikio Hongo , Katsuro Mizukoshi , Shuzo Sano , Takashi Kamimura , Fumikazu Itoh , Akira Shimase , Satoshi Haraichi , Takahiko Takahashi
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/52
CPC分类号： H01L21/76838 , H01L21/32051 , H01L21/76892 , Y10S148/093
摘要： A semiconductor IC device having a substrate, a patterned conductor layer for interconnection of regions in the substrate and a passivation layer covering the device is provided with an additional conduction path of a pattern and/or part of the patterned conductor layer is removed for disconnection for the purpose of evaluation of the characteristics of the device. The additional conduction path is formed by forming a hole in the passivation layer to expose a part of the conductor layer, directing, in an atmosphere containing a metal compound gas, an ion beam onto the hole and onto a predetermined portion of the passivation layer on which the additional conduction path of a pattern is to be formed to thereby form a patterned film of the metal decomposed from the metal compound gas and forming an additional conductor on the patterned film. The provision of the additional conduction path and/or the removal of part of the patterned conductor layer is preformed in a chemical vapor deposition apparatus which includes a vacuum chamber and an ion beam radiation unit having a housing partitioned into, for example, first, second and third compartments. The ion beam radiation unit has an ion source placed in the first compartment, an ion beam focusing and deflecting device placed in the second compartment and pressure buffer constituted by the third compartment. The third compartment is coupled to and pneumatically isolated from the vacuum chamber for conducting an ion beam emitted from the ion source, passing the second compartment and ejected from the second compartment to the vacuum chamber.
摘要翻译：具有衬底，用于衬底中的区域的互连的图案化导体层和覆盖该器件的钝化层的半导体IC器件被设置有去除图案和/或图案化导体层的一部分的附加传导路径用于断开评估设备特点的目的。附加传导路径是通过在钝化层中形成一个孔而露出导体层的一部分而形成的，该导体层的一部分在包含金属化合物气体的气氛中引导离子束到孔上并延伸到钝化层的预定部分上其形成图案的附加传导路径，从而形成从金属化合物气体分解的金属的图案化膜，并在图案化膜上形成附加导体。提供额外的传导路径和/或去除图案化的导体层的一部分在化学气相沉积设备中预先形成，该化学气相沉积设备包括真空室和离子束辐射单元，该单元具有被分隔成例如第一，第二和第三个隔间。离子束辐射单元具有放置在第一隔室中的离子源，放置在第二隔室中的离子束聚焦和偏转装置以及由第三隔间构成的压力缓冲器。第三隔室与真空室联接并气动隔离，用于传导从离子源发射的离子束，通过第二隔室并从第二隔室喷射到真空室。

10. 发明申请

US20100179430A1 ULTRASONIC PROBE AND METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC DEVICE 有权
标题翻译：超声波探头及其制造方法及超声波诊断装置
公开(公告)号：US20100179430A1
公开(公告)日：2010-07-15
申请号：US12525353
申请日：2008-02-27
申请人： Shuzo Sano , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/00 , H04R31/00
CPC分类号： G01N29/2406 , B06B1/0292 , G01N29/0654 , G01N29/221 , G01N2291/106
摘要： An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20).
摘要翻译：超声波探头（2）包括cMUT芯片（20），其具有多个振动元件，其机电耦合系数或灵敏度根据偏置电压而变化，并且发送/接收超声波; 设置在cMUT芯片（20）的超声波辐射侧的声透镜（26）; 设置在所述cMUT芯片（20）背面的用于吸收超声波传播的背衬层（22）; 从cMUT芯片（20）的周边部分到背衬层（22）的侧面设置的电连接部分（柔性基板（72）），并且具有与cMUT芯片的电极连接的信号图案（20）; 以及用于容纳cMUT芯片（20），声透镜（26），背层（22）和电布线部分（柔性基板（72））的外壳（超声波探头盖（25））。地电位的接地层（导电膜（76））设置在cMUT芯片（20）的超声波辐射侧。

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