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1. 发明授权

US08551003B2 Ultrasonic probe and ultrasonic diagnosis device 有权
标题翻译：超声波探头和超声波诊断装置
公开(公告)号：US08551003B2
公开(公告)日：2013-10-08
申请号：US12602119
申请日：2008-05-14
申请人： Makoto Fukada , Shuzo Sano , Akifumi Sako
发明人： Makoto Fukada , Shuzo Sano , Akifumi Sako
IPC分类号： A61B8/00
CPC分类号： B06B1/0292
摘要： An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.
摘要翻译：提供了能够提高操作者的电气安全性的超声波探头和超声波诊断装置。超声波探头2在安装基板43和外壳25之间具有绝缘部62.由于可以防止来自超声波探头2的内部装置的漏电，因此能够提高操作者的超声波探头2的电气安全性。在cMUT芯片20的超声波辐射侧设置有导电膜61，并且沿着绝缘构件62设置导电构件63.导电膜61和导电构件63通过导电构件64连接。封闭具有接地电位的空间由导电膜61，导电构件63和连接到地的同轴电缆55形成。超声波探头2的主要部件或体电路被包含在具有接地电位的封闭空间中并与外部电隔离。

2. 发明授权

US08408063B2 Ultrasonic probe, and ultrasonic diagnostic apparatus using the same 有权
标题翻译：超声波探头和使用其的超声波诊断装置
公开(公告)号：US08408063B2
公开(公告)日：2013-04-02
申请号：US12744020
申请日：2008-11-21
申请人： Shuzo Sano , Makoto Fukada , Akifumi Sako
发明人： Shuzo Sano , Makoto Fukada , Akifumi Sako
IPC分类号： G01N29/00
CPC分类号： G01N29/2406 , A61B8/06 , B06B1/0292 , G01N29/326 , G01N2291/044 , G01N2291/106
摘要： An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.
摘要翻译：一种超声波探头，包括具有机电耦合系数或灵敏度根据偏置电压而变化并发送/接收超声波的多个振荡元件的cMUT芯片，设置在cMUT芯片的超声波发送/接收侧的声透镜，提供给cMUT芯片相对于声透镜的相对表面的背衬层，以及设置在背衬层和cMUT芯片之间的衬底。超声波探头还包括用于抑制由于基板和背衬层之间的温度变化引起的线膨胀系数的差异而产生的热应力的热应力抑制装置。

3. 发明申请

US20110071396A1 ULTRASONIC PROBE, METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC APPARATUS 审中-公开
标题翻译：超声探头及其制造方法及超声波诊断装置
公开(公告)号：US20110071396A1
公开(公告)日：2011-03-24
申请号：US12992683
申请日：2009-05-13
申请人： Shuzo Sano , Yasuhiro Yoshimura , Tatsuya Nagata , Makoto Fukada , Akifumi Sako
发明人： Shuzo Sano , Yasuhiro Yoshimura , Tatsuya Nagata , Makoto Fukada , Akifumi Sako
IPC分类号： A61B8/14 , G10K9/12 , H04R31/00
CPC分类号： B06B1/0292 , A61B8/06 , A61B8/13 , A61B8/4455 , G01N29/2406 , Y10T29/49005
摘要： An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.
摘要翻译：超声波探头设置有具有多个换能器元件的CMUT芯片，该多个换能器元件根据用于发送和接收超声波的偏置电压来改变机电耦合系数或灵敏度，形成在CMUT芯片的超声照射侧上的导电层，布置在CMUT芯片的超声波照射侧的声透镜，与声透镜的超声波照射侧相反的方向形成的绝缘层，存储CMUT芯片的壳体单元，其中导电层和绝缘层用粘合剂和声透镜固定，其中绝缘层由至少包含氧化硅或对二甲苯的材料形成，以防止粘合剂的溶剂浸入粘附部分。

4. 发明申请

US20100154547A1 ULTRASONIC PROBE AND ULTRASONIC DIAGNOSIS DEVICE 有权
标题翻译：超声探头和超声诊断装置
公开(公告)号：US20100154547A1
公开(公告)日：2010-06-24
申请号：US12602119
申请日：2008-05-14
申请人： Makoto Fukada , Shuzo Sano , Akifumi Sako
发明人： Makoto Fukada , Shuzo Sano , Akifumi Sako
IPC分类号： G01N29/24
CPC分类号： B06B1/0292
摘要： An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.
摘要翻译：提供了能够提高操作者的电气安全性的超声波探头和超声波诊断装置。超声波探头2在安装基板43和外壳25之间具有绝缘部62.由于可以防止来自超声波探头2的内部装置的漏电，因此能够提高操作者的超声波探头2的电气安全性。在cMUT芯片20的超声波辐射侧设置有导电膜61，并且沿着绝缘构件62设置导电构件63.导电膜61和导电构件63通过导电构件64连接。封闭具有接地电位的空间由导电膜61，导电构件63和连接到地的同轴电缆55形成。超声波探头2的主要部件或体电路被包含在具有接地电位的封闭空间中并与外部电隔离。

5. 发明申请

US20100242612A1 ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME 有权
标题翻译：超声波探头和超声波诊断装置
公开(公告)号：US20100242612A1
公开(公告)日：2010-09-30
申请号：US12744020
申请日：2008-11-21
申请人： Shuzo Sano , Makoto Fukada , Akifumi Sako
发明人： Shuzo Sano , Makoto Fukada , Akifumi Sako
IPC分类号： G01N29/00
CPC分类号： G01N29/2406 , A61B8/06 , B06B1/0292 , G01N29/326 , G01N2291/044 , G01N2291/106
摘要： An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.
摘要翻译：一种超声波探头，包括具有机电耦合系数或灵敏度根据偏置电压而变化并发送/接收超声波的多个振荡元件的cMUT芯片，设置在cMUT芯片的超声波发送/接收侧的声透镜，提供给cMUT芯片相对于声透镜的相对表面的背衬层，以及设置在背衬层和cMUT芯片之间的衬底。超声波探头还包括用于抑制由于基板和背衬层之间的温度变化引起的线膨胀系数的差异而产生的热应力的热应力抑制装置。

6. 发明申请

US20100036257A1 ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME 有权
标题翻译：超声波探头和超声波诊断装置
公开(公告)号：US20100036257A1
公开(公告)日：2010-02-11
申请号：US12513858
申请日：2007-11-06
申请人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/00
CPC分类号： A61B8/4281 , A61B8/4455 , A61B8/4483 , B06B1/0292 , H04R19/005
摘要： Provided is an ultrasonic probe including: a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves; an acoustic lens arranged above the cMUT chip: and a backing layer arranged below the cMUT chip.Electric leakage preventing means is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip.The electric leakage preventing means is, for example, an insulating layer such as a ground layer.By using such a structure, it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.
摘要翻译：本发明提供一种超声波探头，包括：cMUT芯片，具有多个振动元件，其机电耦合系数或灵敏度根据偏置电压而变化，并且发送和接收超声波; 布置在cMUT芯片上方的声透镜;以及布置在cMUT芯片下方的背衬层。在声透镜的超声波发射/接收表面侧或声透镜和cMUT芯片之间设置防漏电装置。漏电防止装置例如是诸如接地层的绝缘层。通过使用这样的结构，能够提供能够防止从超声波探头向被检体的电泄漏以提高电气安全性的超声波探头和使用该探针的超声波诊断装置。

7. 发明授权

US08758253B2 Ultrasonic probe and ultrasonic diagnostic apparatus using the same 有权
标题翻译：超声波探头和超声波诊断仪使用相同
公开(公告)号：US08758253B2
公开(公告)日：2014-06-24
申请号：US12513858
申请日：2007-11-06
申请人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/14 , A61B8/00
CPC分类号： A61B8/4281 , A61B8/4455 , A61B8/4483 , B06B1/0292 , H04R19/005
摘要： An ultrasonic probe is disclosed which includes a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves, an acoustic lens arranged above the cMUT chip, and a backing layer arranged below the cMUT chip. An electric leakage preventing unit is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip. The electric leakage preventing unit can be, for example, an insulating layer such as a ground layer. Such a structure makes it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.
摘要翻译：公开了一种超声波探头，其包括具有多个振动元件的cMUT芯片，其中机电耦合系数或灵敏度根据偏置电压而变化，并且发送和接收超声波，布置在cMUT芯片上方的声透镜，以及布置在在cMUT芯片之下。在声透镜的超声波发送/接收表面侧或声透镜和cMUT芯片之间设置漏电防止单元。防漏电单元可以是例如绝缘层，例如接地层。通过这样的结构，能够提供能够防止从超声波探头向被检体的漏电以提高电气安全性的超声波探头以及使用该探针的超声波诊断装置。

8. 发明授权

US08540640B2 Ultrasonic probe and method for manufacturing the same and ultrasonic diagnostic device 有权
标题翻译：超声波探头及其制造方法及超声波诊断装置
公开(公告)号：US08540640B2
公开(公告)日：2013-09-24
申请号：US12525353
申请日：2008-02-27
申请人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
发明人： Shuzo Sano , Akifumi Sako , Takashi Kobayashi , Mikio Izumi
IPC分类号： A61B8/14
CPC分类号： G01N29/2406 , B06B1/0292 , G01N29/0654 , G01N29/221 , G01N2291/106
摘要： An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20).
摘要翻译：超声波探头（2）包括cMUT芯片（20），其具有多个振动元件，其机电耦合系数或灵敏度根据偏置电压而变化，并且发送/接收超声波; 设置在cMUT芯片（20）的超声波辐射侧的声透镜（26）; 设置在所述cMUT芯片（20）背面的用于吸收超声波传播的背衬层（22）; 从cMUT芯片（20）的周边部分到背衬层（22）的侧面设置的电连接部分（柔性基板（72）），并且具有与cMUT芯片的电极连接的信号图案（20）; 以及用于容纳cMUT芯片（20），声透镜（26），背层（22）和电布线部分（柔性基板（72））的外壳（超声波探头盖（25））。地电位的接地层（导电膜（76））设置在cMUT芯片（20）的超声波辐射侧。

9. 发明申请

US20130031980A1 Ultrasonic Probe, Production Method Therefor, and Ultrasonic Diagnostic Apparatus 审中-公开
标题翻译：超声波探头及其制作方法及超声波诊断装置
公开(公告)号：US20130031980A1
公开(公告)日：2013-02-07
申请号：US13641695
申请日：2011-04-06
申请人： Akifumi Sako , Makoto Fukada , Kazunari Ishida
发明人： Akifumi Sako , Makoto Fukada , Kazunari Ishida
IPC分类号： G01N29/24 , B32B37/12
CPC分类号： B06B1/0292 , Y10T156/10
摘要： Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT (20) having vibratory elements that change the electromechanical coupling coefficient or sensitivity according to the bias voltage to be applied; a backing layer (22) adhered to the rear side of the ultrasonic transmission surface of the CMUT (20); and a thermal-stress balancing member (24) to be adhered to the backing layer (22) while being disposed facing the CMUT (20) in such a manner that the backing layer (22) is sandwiched therebetween so as to minimize the warpage of the CMUT (20) due to thermal stress produced between the CMUT (20).
摘要翻译：公开了一种超声波探头，其中由于在背衬层和CMUT之间的接合处产生的热应力引起的CMUT的翘曲最小化，从而提高了CMUT与背衬层之间的结合的耐久性。为了实现这一点，超声波探头设置有：具有根据要施加的偏置电压改变机电耦合系数或灵敏度的振动元件的CMUT（20）粘附到CMUT（20）的超声波传播表面的后侧的背衬层（22）; 以及在将背衬层（22）夹在其间的方式面对CMUT（20）设置的同时被粘附到背衬层（22）上的热应力平衡构件（24），以便最小化 CMUT（20）由于在CMUT（20）之间产生的热应力。

10. 发明授权

US09402598B2 Ultrasound probe and ultrasound diagnostic device using same 有权
标题翻译：超声波探头和超声诊断装置使用相同
公开(公告)号：US09402598B2
公开(公告)日：2016-08-02
申请号：US13817541
申请日：2011-08-19
申请人： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
发明人： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
IPC分类号： A61B8/00 , A61B8/14 , B06B1/02 , G10K11/00 , G01N29/24 , A61B8/08
CPC分类号： A61B8/4494 , A61B8/0883 , A61B8/0891 , A61B8/14 , A61B8/4444 , B06B1/0292 , G01N29/2456 , G10K11/002
摘要： In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.
摘要翻译：为了获得高分辨率超声波诊断图像，同时减少了照射到与超声波发送/接收装置的超声波发送方向相反的一侧的超声波的背面反射，公开了一种超声波探头，其中在其上设置有基板具有空腔，其间具有空腔的绝缘层，以及具有所述空腔和所述绝缘层之间的上层电极和下层电极，以形成超声波振动元件，所述基板由背衬保持，模数构件之间，并且在电极之间施加直流电压和交流电压以振动超声波振动元件，并且其中由衬底和低模量构件的机械阻抗具有与背衬的声阻抗基本相等的值。

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