会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Ultrasonic probe and method for manufacturing the same and ultrasonic diagnostic device
    • 超声波探头及其制造方法及超声波诊断装置
    • US08540640B2
    • 2013-09-24
    • US12525353
    • 2008-02-27
    • Shuzo SanoAkifumi SakoTakashi KobayashiMikio Izumi
    • Shuzo SanoAkifumi SakoTakashi KobayashiMikio Izumi
    • A61B8/14
    • G01N29/2406B06B1/0292G01N29/0654G01N29/221G01N2291/106
    • An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20).
    • 超声波探头(2)包括cMUT芯片(20),其具有多个振动元件,其机电耦合系数或灵敏度根据偏置电压而变化,并且发送/接收超声波; 设置在cMUT芯片(20)的超声波辐射侧的声透镜(26); 设置在所述cMUT芯片(20)背面的用于吸收超声波传播的背衬层(22); 从cMUT芯片(20)的周边部分到背衬层(22)的侧面设置的电连接部分(柔性基板(72)),并且具有与cMUT芯片的电极连接的信号图案 (20); 以及用于容纳cMUT芯片(20),声透镜(26),背层(22)和电布线部分(柔性基板(72))的外壳(超声波探头盖(25))。 地电位的接地层(导电膜(76))设置在cMUT芯片(20)的超声波辐射侧。
    • 2. 发明申请
    • ULTRASONIC PROBE AND METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC DEVICE
    • 超声波探头及其制造方法及超声波诊断装置
    • US20100179430A1
    • 2010-07-15
    • US12525353
    • 2008-02-27
    • Shuzo SanoTakashi KobayashiMikio Izumi
    • Shuzo SanoTakashi KobayashiMikio Izumi
    • A61B8/00H04R31/00
    • G01N29/2406B06B1/0292G01N29/0654G01N29/221G01N2291/106
    • An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20).
    • 超声波探头(2)包括cMUT芯片(20),其具有多个振动元件,其机电耦合系数或灵敏度根据偏置电压而变化,并且发送/接收超声波; 设置在cMUT芯片(20)的超声波辐射侧的声透镜(26); 设置在所述cMUT芯片(20)背面的用于吸收超声波传播的背衬层(22); 从cMUT芯片(20)的周边部分到背衬层(22)的侧面设置的电连接部分(柔性基板(72)),并且具有与cMUT芯片的电极连接的信号图案 (20); 以及用于容纳cMUT芯片(20),声透镜(26),背层(22)和电布线部分(柔性基板(72))的外壳(超声波探头盖(25))。 地电位的接地层(导电膜(76))设置在cMUT芯片(20)的超声波辐射侧。
    • 3. 发明申请
    • ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME
    • 超声波探头和超声波诊断装置
    • US20100036257A1
    • 2010-02-11
    • US12513858
    • 2007-11-06
    • Shuzo SanoAkifumi SakoTakashi KobayashiMikio Izumi
    • Shuzo SanoAkifumi SakoTakashi KobayashiMikio Izumi
    • A61B8/00
    • A61B8/4281A61B8/4455A61B8/4483B06B1/0292H04R19/005
    • Provided is an ultrasonic probe including: a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves; an acoustic lens arranged above the cMUT chip: and a backing layer arranged below the cMUT chip.Electric leakage preventing means is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip.The electric leakage preventing means is, for example, an insulating layer such as a ground layer.By using such a structure, it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.
    • 本发明提供一种超声波探头,包括:cMUT芯片,具有多个振动元件,其机电耦合系数或灵敏度根据偏置电压而变化,并且发送和接收超声波; 布置在cMUT芯片上方的声透镜;以及布置在cMUT芯片下方的背衬层。 在声透镜的超声波发射/接收表面侧或声透镜和cMUT芯片之间设置防漏电装置。 漏电防止装置例如是诸如接地层的绝缘层。 通过使用这样的结构,能够提供能够防止从超声波探头向被检体的电泄漏以提高电气安全性的超声波探头和使用该探针的超声波诊断装置。
    • 4. 发明授权
    • Ultrasonic probe and ultrasonic diagnostic apparatus using the same
    • 超声波探头和超声波诊断仪使用相同
    • US08758253B2
    • 2014-06-24
    • US12513858
    • 2007-11-06
    • Shuzo SanoAkifumi SakoTakashi KobayashiMikio Izumi
    • Shuzo SanoAkifumi SakoTakashi KobayashiMikio Izumi
    • A61B8/14A61B8/00
    • A61B8/4281A61B8/4455A61B8/4483B06B1/0292H04R19/005
    • An ultrasonic probe is disclosed which includes a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves, an acoustic lens arranged above the cMUT chip, and a backing layer arranged below the cMUT chip. An electric leakage preventing unit is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip. The electric leakage preventing unit can be, for example, an insulating layer such as a ground layer. Such a structure makes it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.
    • 公开了一种超声波探头,其包括具有多个振动元件的cMUT芯片,其中机电耦合系数或灵敏度根据偏置电压而变化,并且发送和接收超声波,布置在cMUT芯片上方的声透镜,以及布置在 在cMUT芯片之下。 在声透镜的超声波发送/接收表面侧或声透镜和cMUT芯片之间设置漏电防止单元。 防漏电单元可以是例如绝缘层,例如接地层。 通过这样的结构,能够提供能够防止从超声波探头向被检体的漏电以提高电气安全性的超声波探头以及使用该探针的超声波诊断装置。
    • 7. 发明授权
    • Apparatus and method for verifying custom IC
    • 用于验证定制IC的装置和方法
    • US07669090B2
    • 2010-02-23
    • US11419051
    • 2006-05-18
    • Hideyuki KitazonoToshifumi SatoNaotaka OdaToshiaki ItoMikio Izumi
    • Hideyuki KitazonoToshifumi SatoNaotaka OdaToshiaki ItoMikio Izumi
    • G01R31/28G11C29/00G01R31/26G06F11/00
    • G01R31/317
    • An apparatus for verifying a custom IC including a test pattern generating unit for generating a test pattern for verifying a function of the custom IC. The test pattern is output to a master IC and a test IC. The apparatus further includes a comparing unit connected to receive operation signals output from the master IC and the test IC for comparing the operation signals to see if the operation signals are agreed with each other and for generating a comparison signal based on a comparison result, a judging unit connected to receive the comparison signal for judging if there is any abnormality in the test IC and for outputting a judged signal based on a judged result, and a computer connected to receive the judged signal for displaying the judged result of the test IC.
    • 一种用于验证定制IC的装置,包括用于生成用于验证定制IC的功能的测试图案的测试图案生成单元。 测试模式输出到主IC和测试IC。 该装置还包括一个比较单元,连接到接收从主IC输出的操作信号和测试IC,用于比较操作信号,以观察操作信号是否彼此一致,并根据比较结果生成比较信号 连接的判断单元接收比较信号,以判断测试IC中是否存在异常,并根据判断结果输出判断信号;以及计算机,连接以接收用于显示测试IC的判断结果的判断信号。
    • 8. 发明申请
    • APPARATUS AND METHOD FOR VERIFYING CUSTOM IC
    • 用于验证定制IC的装置和方法
    • US20070271489A1
    • 2007-11-22
    • US11419051
    • 2006-05-18
    • Hideyuki KitazonoToshifumi SatoNaotaka OdaToshiaki ItoMikio Izumi
    • Hideyuki KitazonoToshifumi SatoNaotaka OdaToshiaki ItoMikio Izumi
    • G01R31/28
    • G01R31/317
    • An apparatus for verifying a custom IC including a test pattern generating unit for generating a test pattern for verifying a function of the custom IC. The test pattern is output to a master IC and a test IC. The apparatus further includes a comparing unit connected to receive operation signals output from the master IC and the test IC for comparing the operation signals to see if the operation signals are agreed with each other and for generating a comparison signal based on a comparison result, a judging unit connected to receive the comparison signal for judging if there is any abnormality in the test IC and for outputting a judged signal based on a judged result, and a computer connected to receive the judged signal for displaying the judged result of the test IC.
    • 一种用于验证定制IC的装置,包括用于生成用于验证定制IC的功能的测试图案的测试图案生成单元。 测试模式输出到主IC和测试IC。 该装置还包括一个比较单元,连接到接收从主IC输出的操作信号和测试IC,用于比较操作信号,以观察操作信号是否彼此一致,并根据比较结果生成比较信号 连接的判断单元接收比较信号,以判断测试IC中是否存在异常,并根据判断结果输出判断信号;以及计算机,连接以接收用于显示测试IC的判断结果的判断信号。