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    • 1. 发明授权
    • Positioning apparatus
    • 定位装置
    • US08740506B2
    • 2014-06-03
    • US13033253
    • 2011-02-23
    • Shogo OgakiTakashi AndoMasaru InoueTakeshi Shimoda
    • Shogo OgakiTakashi AndoMasaru InoueTakeshi Shimoda
    • B65G51/20
    • B65G51/03B65G47/525H01L41/25
    • A positioning apparatus includes a stage on which a piezoelectric element is set, a stop unit having a stop face to which the piezoelectric element set on the stage is pushed so that the piezoelectric element is positioned at a target position corresponding to an attaching part of, for example, a head suspension to which the piezoelectric element is attached, and a pushing unit to push the piezoelectric element toward the stop face, the pushing unit blowing a gas to push the piezoelectric element. The positioning apparatus is capable of correctly positioning the piezoelectric element to the target position without damaging the piezoelectric element.
    • 一种定位装置,包括设置有压电元件的台,具有止动面的停止单元,所述停止面被压入到设置在所述台上的所述压电元件,使得所述压电元件位于对应于所述平台的安装部的目标位置, 例如,安装有压电元件的磁头悬架以及将压电元件朝向止动面推压的推压单元,推压单元吹出气体来推压压电元件。 定位装置能够将压电元件正确地定位到目标位置而不损坏压电元件。
    • 2. 发明授权
    • Reflow bonding method and method of manufacturing head suspension
    • 回流焊接方法及其制造方法
    • US08317081B2
    • 2012-11-27
    • US12907406
    • 2010-10-19
    • Shogo OgakiTakashi AndoMasaru Inoue
    • Shogo OgakiTakashi AndoMasaru Inoue
    • B23K31/02
    • B23K3/04B23K1/0016G11B5/4833
    • A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.
    • 回流焊接方法通过分别在第一和第二布线构件上限定的第一和第二接合部中的至少一个上的回流焊料容易地将第一和第二布线构件接合在一起。 该方法包括:定位第一和第二布线构件,使得第一和第二接合部分彼此面对,并且夹在它们之间的焊料并且用加热器片的按压面从后面加热和加压第一和第二接合部分中的一个,从而 第一和第二接合部分彼此位于一起并且使得焊料被加热并且回流以将第一和第二配线构件结合在一起。
    • 8. 发明授权
    • Gate-last fabrication of quarter-gap MGHK FET
    • 最后制造四分之一MGHK FET
    • US08786030B2
    • 2014-07-22
    • US13570388
    • 2012-08-09
    • Takashi AndoKisik ChoiVijay NarayananTenko YamashitaJunli Wang
    • Takashi AndoKisik ChoiVijay NarayananTenko YamashitaJunli Wang
    • H01L21/02
    • H01L29/517H01L21/28079H01L21/28088H01L29/4958H01L29/4966H01L29/66545
    • A quarter-gap p-type field effect transistor (PFET) formed by gate-last fabrication includes a gate stack formed on a silicon substrate, the gate stack including: a high-k dielectric layer located on the silicon substrate; and a gate metal layer located over the high-k dielectric layer, the gate metal layer including titanium nitride and having a thickness of about 20 angstroms; and a metal contact formed over the gate stack. A quarter-gap n-type field effect transistor (NFET) formed by gate-last fabrication includes a gate stack formed on a silicon substrate, the gate stack including: a high-k dielectric layer located on the silicon substrate; and a first gate metal layer located over the high-k dielectric layer, the first gate metal layer including titanium nitride; and a metal contact formed over the gate stack.
    • 通过栅极最终制造形成的四分之一间隙p型场效应晶体管(PFET)包括形成在硅衬底上的栅极堆叠,所述栅极堆叠包括:位于硅衬底上的高k电介质层; 以及位于高k电介质层上方的栅极金属层,所述栅极金属层包括氮化钛并且具有约20埃的厚度; 以及形成在栅极堆叠上的金属接触。 通过栅极最后制造形成的四分之一间隙n型场效应晶体管(NFET)包括形成在硅衬底上的栅极堆叠,该栅极堆叠包括:位于硅衬底上的高k电介质层; 以及位于所述高k电介质层上方的第一栅极金属层,所述第一栅极金属层包括氮化钛; 以及形成在栅极堆叠上的金属接触。