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    • 5. 发明授权
    • Method of making memory cells with peripheral transistors
    • 制造具有外围晶体管的存储单元的方法
    • US5538912A
    • 1996-07-23
    • US370755
    • 1995-01-10
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • H01L21/8242H01L21/8246H01L21/8247H01L27/10H01L27/105H01L27/112H01L27/115H01L29/788H01L29/792
    • H01L27/10844H01L27/105H01L27/11517H01L27/11526
    • In a semiconductor memory device according to the present invention, a conductive layer is formed on a field oxide film in a boundary region on the main surface of a semiconductor substrate. A floating gate electrode, an interlayer insulating film, and a control gate electrode are formed on the semiconductor substrate in a memory cell array region with a gate insulating film interposed therebetween. A gate electrode is formed in a peripheral circuit region with the gate insulating film interposed therebetween. An interlayer insulating film is formed on the conductive layer, the gate electrode, and the control gate electrode. A contact hole is formed at a predetermined position of the interlayer insulating film. An interconnection layer is selectively formed on the interlayer insulating film including the inner surface of the contact hole. According to the present invention, it is possible to prevent formation of a concave portion on the surface of the field oxide film in the boundary region. It is also possible to protect the memory cell array region from an external noise by forming the conductive layer on the field oxide film in the boundary region and by fixing the potential of the conductive layer.
    • 在根据本发明的半导体存储器件中,在半导体衬底的主表面上的边界区域中的场氧化物膜上形成导电层。 在半导体衬底上形成有一个栅极绝缘膜和一个控制栅电极的存储单元阵列区域中,栅极绝缘膜插在其间。 栅极电极形成在外围电路区域中,栅极绝缘膜插入其间。 在导电层,栅电极和控制栅电极上形成层间绝缘膜。 在层间绝缘膜的预定位置处形成接触孔。 在包括接触孔的内表面的层间绝缘膜上选择性地形成布线层。 根据本发明,可以防止在边界区域的场氧化膜的表面上形成凹部。 也可以通过在边界区域的场氧化膜上形成导电层,并通过固定导电层的电位来保护存储单元阵列区域免受外部噪声的影响。
    • 6. 发明授权
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US5400278A
    • 1995-03-21
    • US114229
    • 1993-09-01
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • H01L21/8242H01L21/8246H01L21/8247H01L27/10H01L27/105H01L27/112H01L27/115H01L29/788H01L29/792
    • H01L27/10844H01L27/105H01L27/11517H01L27/11526
    • In a semiconductor memory device according to the present invention, a conductive layer is formed on a field oxide film in a boundary region on the main surface of a semiconductor substrate. A floating gate electrode, an interlayer insulating film, and a control gate electrode are formed on the semiconductor substrate in a memory cell array region with a gate insulating film interposed therebetween. A gate electrode is formed in a peripheral circuit region with the gate insulating film interposed therebetween. An interlayer insulating film is formed on the conductive layer, the gate electrode, and the control gate electrode. A contact hole is formed at a predetermined position of the interlayer insulating film. An interconnection layer is selectively formed on the interlayer insulating film including the inner surface of the contact hole. According to the present invention, it is possible to prevent formation of a concave portion on the surface of the field oxide film in the boundary region. It is also possible to protect the memory cell array region from an external noise by forming the conductive layer on the field oxide film in the boundary region and by fixing the potential of the conductive layer.
    • 在根据本发明的半导体存储器件中,在半导体衬底的主表面上的边界区域中的场氧化物膜上形成导电层。 在半导体衬底上形成有一个栅极绝缘膜和一个控制栅电极的存储单元阵列区域中,栅极绝缘膜插在其间。 栅极电极形成在外围电路区域中,栅极绝缘膜插入其间。 在导电层,栅电极和控制栅电极上形成层间绝缘膜。 在层间绝缘膜的预定位置处形成接触孔。 在包括接触孔的内表面的层间绝缘膜上选择性地形成布线层。 根据本发明,可以防止在边界区域的场氧化膜的表面上形成凹部。 也可以通过在边界区域的场氧化膜上形成导电层,并通过固定导电层的电位来保护存储单元阵列区域免受外部噪声的影响。
    • 10. 发明授权
    • Nonvolatile semiconductor memory device having reduced dependency of a source resistance on a position in an array
    • 非易失性半导体存储器件具有降低源极电阻对阵列中位置的依赖性
    • US07248500B2
    • 2007-07-24
    • US11329036
    • 2006-01-11
    • Satoru TamadaYuichi KunoriFumihiko Nitta
    • Satoru TamadaYuichi KunoriFumihiko Nitta
    • G11C16/28
    • G11C16/26
    • A dummy cell having a low threshold voltage is disposed in a memory cell array in alignment with a memory cell. A dummy cell with a low threshold voltage adjacent to a selected memory cell column is selected, and a source-side local bit line of the selected memory cell is coupled to a global bit line via such dummy cell. Since the source-side local bit line is coupled to a ground node at its both ends, source resistance of the memory cell can be reduced, and dependency of the source resistance of the memory cell on the position within the memory cell array can also be reduced. This allows for reducing dependency of source resistance of a memory cell on the position within the memory cell array and on the temperature in a nonvolatile semiconductor memory device.
    • 具有低阈值电压的虚拟单元被布置在与存储单元对准的存储单元阵列中。 选择与所选存储单元列相邻的具有低阈值电压的虚拟单元,并且所选择的存储单元的源极局部位线通过这样的虚设单元耦合到全局位线。 由于源极本地位线在其两端耦合到接地节点,所以可以减小存储器单元的源极电阻,并且存储单元的源极电阻对存储单元阵列内的位置的依赖性也可以是 减少 这允许减小存储器单元的源电阻对存储单元阵列内的位置和非易失性半导体存储器件中的温度的依赖性。