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    • 1. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08525195B2
    • 2013-09-03
    • US12873662
    • 2010-09-01
    • Hajime NagoKoichi TachibanaToshiki HikosakaShigeya KimuraShinya Nunoue
    • Hajime NagoKoichi TachibanaToshiki HikosakaShigeya KimuraShinya Nunoue
    • H01L33/02
    • H01L33/12B82Y20/00H01L33/04H01L33/32H01S5/34333
    • According to one embodiment, a semiconductor light emitting device includes n-type and p-type semiconductor layers, a light emitting portion, a multilayered structural body, and an n-side intermediate layer. The light emitting portion is provided between the semiconductor layers. The light emitting portion includes barrier layers containing GaN, and a well layer provided between the barrier layers. The well layer contains Inx1Ga1-x1N. The body is provided between the n-type semiconductor layer and the light emitting portion. The body includes: first layers containing GaN, and a second layer provided between the first layers. The second layer contains Inx2Ga1-x2N. Second In composition ratio x2 is not less than 0.6 times of first In composition ratio x1 and is lower than the first In composition x1. The intermediate layer is provided between the body and the light emitting portion and includes a third layer containing Aly1Ga1-y1N (0
    • 根据一个实施例,半导体发光器件包括n型和p型半导体层,发光部分,多层结构体和n侧中间层。 发光部分设置在半导体层之间。 发光部分包括含有GaN的阻挡层,以及设置在阻挡层之间的阱层。 阱层包含Inx1Ga1-x1N。 本体设置在n型半导体层和发光部之间。 主体包括:包含GaN的第一层,以及设置在第一层之间的第二层。 第二层包含Inx2Ga1-x2N。 第二组成比x2不小于第一In组成比x1的0.6倍,并且低于第一In组成x1。 中间层设置在主体和发光部分之间,并且包括含有Aly1Ga1-y1N(0
    • 3. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08525203B2
    • 2013-09-03
    • US12874510
    • 2010-09-02
    • Koichi TachibanaHajime NagoToshiki HikosakaShigeya KimuraShinya Nunoue
    • Koichi TachibanaHajime NagoToshiki HikosakaShigeya KimuraShinya Nunoue
    • H01L33/00
    • H01L33/145B82Y20/00H01L33/06H01L33/32H01S5/34333
    • According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, a light emitting portion, a first layer, a second layer, and an intermediate layer. The semiconductor layers include nitride semiconductor. The light emitting portion is provided between the n-type semiconductor layer and the p-type semiconductor layer and includes a quantum well layer. The first layer is provided between the light emitting portion and the p-type semiconductor layer and includes AlX1Ga1-x1N having first Al composition ratio x1. The second layer is provided between the first layer and the p-type semiconductor layer and includes Alx2Ga1-x2N having second Al composition ratio x2 higher than the first Al composition ratio x1. The intermediate layer is provided between the first layer and the light emitting portion and has a thickness not smaller than 3 nanometers and not larger than 8 nanometers and includes Inz1Ga1-z1N (0≦z1
    • 根据一个实施例,半导体发光器件包括n型半导体层,p型半导体层,发光部分,第一层,第二层和中间层。 半导体层包括氮化物半导体。 发光部分设置在n型半导体层和p型半导体层之间,并且包括量子阱层。 第一层设置在发光部和p型半导体层之间,并且包括具有第一Al组成比x1的AlX1Ga1-x1N。 第二层设置在第一层和p型半导体层之间,并且包括具有比第一Al组成比x1高的第二Al组成比x2的Al x2 Ga1-x2N。 中间层设置在第一层和发光部之间,并且具有不小于3纳米且不大于8纳米的厚度,并且包括Inz1Ga1-z1N(0 @ z1 <1)。
    • 6. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光器件
    • US20110198633A1
    • 2011-08-18
    • US12871285
    • 2010-08-30
    • Koichi TACHIBANAToshiki HikosakaShigeya KimuraHajime NagoShinya Nunoue
    • Koichi TACHIBANAToshiki HikosakaShigeya KimuraHajime NagoShinya Nunoue
    • H01L33/34
    • H01L33/06H01L33/32H01L33/325
    • According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting portion. The light emitting portion is provided between the semiconductor layers and includes barrier layers and well layers alternately stacked. An n-side end well layer which is closest to the n-type semiconductor layer contains InwnGa1-wnN and has a layer thickness twn. An n-side end barrier layer which is closest to the n-type semiconductor layer contains InbnGa1-bnN and has a layer thickness tbn. A p-side end well layer which is closest to the p-type semiconductor layer contains InwpGa1-wpN and has a layer thickness twp. A p-side end barrier layer which is closest to the p-type semiconductor contains InbpGa1-bpN and has a layer thickness tbp. A value of (wp×twp+bp×tbp)/(twp+tbp) is higher than (wn×twn+bn×tbn)/(twn+tbn) and is not higher than 5 times (wn×twn+bn×tbn)/(twn+tbn).
    • 根据一个实施例,半导体发光器件包括n型半导体层,p型半导体层和发光部分。 发光部分设置在半导体层之间,并且包括交替堆叠的势垒层和阱层。 最靠近n型半导体层的n侧端阱层包含InwnGa1-wnN并具有层厚度twn。 最靠近n型半导体层的n侧端势垒层包含InbnGa1-bnN并具有层厚度tbn。 最靠近p型半导体层的p侧端阱层包含InwpGa1-wpN,并具有层厚度twp。 最靠近p型半导体的p侧端势垒层包含InbpGa1-bpN,并具有层厚度tbp。 (wp×twp + bp×tbp)/(twp + tbp)的值高于(wn×twn + bn×tbn)/(twn + tbn),并且不高于5次(wn×twn + bn× tbn)/(twn + tbn)。
    • 8. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08895956B2
    • 2014-11-25
    • US13218827
    • 2011-08-26
    • Shigeya KimuraKoichi TachibanaHajime NagoShinya Nunoue
    • Shigeya KimuraKoichi TachibanaHajime NagoShinya Nunoue
    • H01L33/04H01L33/32H01L33/06
    • H01L33/06H01L33/32
    • According to one embodiment, a semiconductor light emitting device includes an n-type first semiconductor layer, a p-type second semiconductor layer and a light emitting layer. The light emitting layer is provided between the first and second semiconductor layers, and includes a plurality of barrier layers including a nitride semiconductor and a well layer provided between the barrier layers and including a nitride semiconductor containing In. The barrier layers and the well layer are stacked in a first direction from the second semiconductor layer toward the first semiconductor layer. The well layer has a p-side interface part and an n-side interface part. Each of the p-side and the n-side interface part include an interface with one of the barrier layers. A variation in a concentration of In in a surface perpendicular to the first direction of the p-side interface part is not more than that of the n-side interface part.
    • 根据一个实施例,半导体发光器件包括n型第一半导体层,p型第二半导体层和发光层。 发光层设置在第一和第二半导体层之间,并且包括多个阻挡层,包括氮化物半导体和设置在阻挡层之间的阱层,并且包括含有In的氮化物半导体。 阻挡层和阱层从第二半导体层向第一半导体层沿第一方向堆叠。 阱层具有p侧接口部和n侧接口部。 p侧和n侧接口部分中的每一个包括与阻挡层中的一个的界面。 在垂直于p侧接口部分的第一方向的表面中的In浓度的变化不大于n侧接口部分的浓度变化。
    • 9. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08674338B2
    • 2014-03-18
    • US12871285
    • 2010-08-30
    • Koichi TachibanaToshiki HikosakaShigeya KimuraHajime NagoShinya Nunoue
    • Koichi TachibanaToshiki HikosakaShigeya KimuraHajime NagoShinya Nunoue
    • H01L29/06H01L31/00
    • H01L33/06H01L33/32H01L33/325
    • According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting portion. The light emitting portion is provided between the semiconductor layers and includes barrier layers and well layers alternately stacked. An n-side end well layer which is closest to the n-type semiconductor layer contains InwnGa1-wnN and has a layer thickness twn. An n-side end barrier layer which is closest to the n-type semiconductor layer contains InbnGa1-bnN and has a layer thickness tbn. A p-side end well layer which is closest to the p-type semiconductor layer contains InwpGa1-wpN and has a layer thickness twp. A p-side end barrier layer which is closest to the p-type semiconductor contains InbpGa1-bpN and has a layer thickness tbp. A value of (wp×twp+bp×tbp)/(twp+tbp) is higher than (wn×twn+bn×tbn)/(twn+tbn) and is not higher than 5 times (wn×twn+bn×tbn)/(twn+tbn).
    • 根据一个实施例,半导体发光器件包括n型半导体层,p型半导体层和发光部分。 发光部分设置在半导体层之间,并且包括交替堆叠的势垒层和阱层。 最靠近n型半导体层的n侧端阱层包含InwnGa1-wnN并具有层厚度twn。 最靠近n型半导体层的n侧端势垒层包含InbnGa1-bnN并具有层厚度tbn。 最靠近p型半导体层的p侧端阱层包含InwpGa1-wpN,并具有层厚度twp。 最靠近p型半导体的p侧端势垒层包含InbpGa1-bpN,并具有层厚度tbp。 (wp×twp + bp×tbp)/(twp + tbp)的值高于(wn×twn + bn×tbn)/(twn + tbn),并且不高于5次(wn×twn + bn× tbn)/(twn + tbn)。