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1. 发明授权

US4949164A Semiconductor cooling apparatus and cooling method thereof 失效
标题翻译：半导体冷却装置及其冷却方法
公开(公告)号：US4949164A
公开(公告)日：1990-08-14
申请号：US216704
申请日：1988-07-07
申请人： Shigeo Ohashi , Heikichi Kuwabara , Tadakatsu Nakajima , Wataru Nakayama , Motohiro Sato , Kenichi Kasai
发明人： Shigeo Ohashi , Heikichi Kuwabara , Tadakatsu Nakajima , Wataru Nakayama , Motohiro Sato , Kenichi Kasai
IPC分类号： H01L23/427
CPC分类号： H01L23/427 , H01L23/44 , H01L2924/0002
摘要： High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

2. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

3. 发明授权

US4977444A Semiconductor cooling apparatus 失效
标题翻译：半导体冷却装置
公开(公告)号：US4977444A
公开(公告)日：1990-12-11
申请号：US261639
申请日：1988-10-24
申请人： Tadakatsu Nakajima , Heikichi Kuwahara , Shigeo Ohashi , Motohiro Satoh , Toshihiro Yamada , Kenichi Kasai , Satomi Kobayashi , Akihide Watanabe
发明人： Tadakatsu Nakajima , Heikichi Kuwahara , Shigeo Ohashi , Motohiro Satoh , Toshihiro Yamada , Kenichi Kasai , Satomi Kobayashi , Akihide Watanabe
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/4735 , H01L2924/0002
摘要： Flexible cooling paths are connected to semiconductor elements which are heated members. A cooling apparatus comprises cooling blocks connected to cooling blocks, coolant flow paths through which the coolant flows, coolant branching mechanisms provided in the coolant flow paths and connecting mechanism for connecting the branching mechanism and the cooling blocks through O-rings. A part of coolant flowing through the cooling flow paths is introduced into the cooling blocks for the respective heated chips in order.
摘要翻译：柔性冷却路径连接到作为加热构件的半导体元件。冷却装置包括连接到冷却块的冷却块，冷却剂流过的冷却剂流路，设置在冷却剂流动路径中的冷却剂分支机构和用于通过O形环连接分支机构和冷却块的连接机构。流过冷却流路的冷却剂的一部分依次被引入各加热芯片的冷却块中。

4. 发明授权

US5959351A Liquid-cooled electronic device 失效
标题翻译：液冷电子设备
公开(公告)号：US5959351A
公开(公告)日：1999-09-28
申请号：US103227
申请日：1993-08-09
申请人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
发明人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
IPC分类号： H01L23/44 , F15D1/08 , H01L23/427 , H01L23/473 , H01L23/34
CPC分类号： F15D1/08 , H01L23/473 , F28F13/02 , H01L2924/0002
摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.
摘要翻译：公开了一种液冷电子装置。半导体器件安装在浸没在冷却液中的半导体模块的衬底上。在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在开始半导体器件通电的时间，从而稳定半导体器件的温度。

5. 发明授权

US5406807A Apparatus for cooling semiconductor device and computer having the same 失效
标题翻译：用于冷却半导体器件的设备和具有该器件的计算机
公开(公告)号：US5406807A
公开(公告)日：1995-04-18
申请号：US77109
申请日：1993-06-16
申请人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
发明人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
IPC分类号： H01L23/427 , F25D17/02
CPC分类号： H01L23/427 , H01L2924/0002 , Y10S165/908
摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.
摘要翻译：一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

6. 发明授权

US06890799B2 Device for sealing and cooling multi-chip modules 失效
标题翻译：密封和冷却多芯片模块的装置
公开(公告)号：US06890799B2
公开(公告)日：2005-05-10
申请号：US10338485
申请日：2003-01-07
申请人： Takahiro Daikoku , Kenichi Kasai , Toshitada Netsu , Koichi Koyano , Takayuki Uda
发明人： Takahiro Daikoku , Kenichi Kasai , Toshitada Netsu , Koichi Koyano , Takayuki Uda
IPC分类号： H01L23/10 , H01L23/473 , H01L21/48 , H01L23/34 , H05K7/20
CPC分类号： H01L23/10 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/01322 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/1626
摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
摘要翻译：根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。提供具有低热阻的导热护套。多芯片模块密封框架焊接到密封顶板的边缘。此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架对彼此。

7. 发明授权

US06213786B1 Electronic device and multi-pin connector therefor 失效
标题翻译：电子设备和多针连接器
公开(公告)号：US06213786B1
公开(公告)日：2001-04-10
申请号：US09632242
申请日：2000-08-03
申请人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
发明人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
IPC分类号： H01R1200
CPC分类号： H05K3/303 , H01R43/0256 , H05K7/1084 , H05K2201/09472 , H05K2201/10704 , H05K2203/0195 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , Y10T29/49149
摘要： A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.
摘要翻译：多针连接器具有固定焊接到印制板上所需位置的有底连接孔中的接触针，使得接触针以期望的形式排列而没有外壳。多针连接器可以在短时间内制造，并且可以具有任何间距，任意数量的销和任何形状。

8. 发明授权

US5866683A Isoelectric point markers for isoelectric focusing with fluorescence detection 失效
标题翻译：用于具有荧光检测的等电聚焦的等电点标记
公开(公告)号：US5866683A
公开(公告)日：1999-02-02
申请号：US623833
申请日：1996-03-29
申请人： Kiyohito Shimura , Kenichi Kasai , Hiroyuki Matsumoto , Hisayoshi Takamoto
发明人： Kiyohito Shimura , Kenichi Kasai , Hiroyuki Matsumoto , Hisayoshi Takamoto
IPC分类号： G01N21/64 , G01N27/447 , C07K7/00
CPC分类号： C07K1/28 , G01N21/6428 , G01N27/44726 , G01N27/44795 , G01N2410/02 , Y10S930/28
摘要： Provided are isoelectric point(pI) markers for isoelectric focusing with fluorescence detection. The markers are fluorescence-labeled oligopeptides which comprise a fluorescence dye bonded chemically to the amino group of N-terminal amino acid of oligopeptide. The marker shows its unique and narrow pI band(peak) in electrophoresis or isoelectric focusing. The markers can be designed to have appropriate pI value, and cover wide range of pI (3
摘要翻译：提供了用于具有荧光检测的等电聚焦的等电点（pI）标记。标记是荧光标记的寡肽，其包含与寡肽的N-末端氨基酸的氨基化学键合的荧光染料。该标记显示其在电泳或等电聚焦中的独特且窄的pI带（峰）。标记可以被设计成具有适当的pI值，并且覆盖pI（3

9. 发明授权

US5774334A Low thermal resistant, fluid-cooled semiconductor module 失效
标题翻译：低耐热，流体冷却的半导体模块
公开(公告)号：US5774334A
公开(公告)日：1998-06-30
申请号：US520338
申请日：1995-08-28
申请人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
发明人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
摘要翻译：半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。作为导热介质的液体封装在半导体模块中。半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

10. 发明申请

US20150276517A1 Mechanical Quantity Measuring Device 审中-公开
标题翻译：机械量测量装置
公开(公告)号：US20150276517A1
公开(公告)日：2015-10-01
申请号：US14403385
申请日：2012-05-25
申请人： Kisho Ashida , Hiroyuki Ohta , Hiromi Shimazu , Kenichi Kasai
发明人： Kisho Ashida , Hiroyuki Ohta , Hiromi Shimazu , Kenichi Kasai
IPC分类号： G01L1/22
CPC分类号： G01L1/2293 , G01L1/18 , G01L1/2243
摘要： A load cell including sensor chip (1) on which plural resistive elements rectangular in a plan view are formed, and a member (2) is provided on a front surface side of a semiconductor substrate made of silicon single crystal. The member (2) includes a load portion (3), a fixed pedestal portion (4), and a strain generation portion (5) that is spaced apart from the load portion (3) and the fixed pedestal portion (4), and arranged between the load portion (3) and the fixed pedestal portion (4). The sensor chip (1) is attached onto a front side surface (2a) of the strain generation portion (5) of the member (2) so that a direction of the silicon single crystal in the semiconductor substrate is parallel to a load direction, and a longitudinal direction of the plural resistive elements has an angle of 45° with respect to a load direction.
摘要翻译：一种传感器芯片（1）的测力传感器，其上形成有平面图中矩形的多个电阻元件，并且在由硅单晶制成的半导体衬底的正面侧设置有构件（2）。构件（2）包括负载部分（3），固定基座部分（4）和与负载部分（3）和固定基座部分（4）间隔开的应变产生部分（5），以及布置在负载部分（3）和固定基座部分（4）之间。传感器芯片（1）安装在构件（2）的应变产生部分（5）的前侧表面（2a）上，使得半导体衬底中的单晶硅的<100>方向平行于多个电阻元件的纵向方向相对于负载方向具有45°的角度。

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