基本信息:
- 专利标题： Mechanical Quantity Measuring Device
- 专利标题（中）：机械量测量装置
- 申请号：US14403385 申请日：2012-05-25
- 公开(公告)号：US20150276517A1 公开(公告)日：2015-10-01
- 发明人： Kisho Ashida , Hiroyuki Ohta , Hiromi Shimazu , Kenichi Kasai
- 申请人： Kisho Ashida , Hiroyuki Ohta , Hiromi Shimazu , Kenichi Kasai
- 申请人地址： JP Chiyoda-ku, Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Chiyoda-ku, Tokyo
- 国际申请： PCT/JP2012/063540 WO 20120525
- 主分类号： G01L1/22
- IPC分类号： G01L1/22
摘要：
A load cell including sensor chip (1) on which plural resistive elements rectangular in a plan view are formed, and a member (2) is provided on a front surface side of a semiconductor substrate made of silicon single crystal. The member (2) includes a load portion (3), a fixed pedestal portion (4), and a strain generation portion (5) that is spaced apart from the load portion (3) and the fixed pedestal portion (4), and arranged between the load portion (3) and the fixed pedestal portion (4). The sensor chip (1) is attached onto a front side surface (2a) of the strain generation portion (5) of the member (2) so that a direction of the silicon single crystal in the semiconductor substrate is parallel to a load direction, and a longitudinal direction of the plural resistive elements has an angle of 45° with respect to a load direction.
摘要（中）：
一种传感器芯片（1）的测力传感器，其上形成有平面图中矩形的多个电阻元件，并且在由硅单晶制成的半导体衬底的正面侧设置有构件（2）。 构件（2）包括负载部分（3），固定基座部分（4）和与负载部分（3）和固定基座部分（4）间隔开的应变产生部分（5），以及 布置在负载部分（3）和固定基座部分（4）之间。 传感器芯片（1）安装在构件（2）的应变产生部分（5）的前侧表面（2a）上，使得半导体衬底中的单晶硅的<100>方向平行于 多个电阻元件的纵向方向相对于负载方向具有45°的角度。