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1. 发明授权

US5421401A Compound clamp ring for semiconductor wafers 失效
标题翻译：用于半导体晶片的复合夹环
公开(公告)号：US5421401A
公开(公告)日：1995-06-06
申请号：US187231
申请日：1994-01-25
申请人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alan F. Morrison , Virendra V. S. Rana , James F. Roberts , Ashok K. Sinha , Simon Tam
发明人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alan F. Morrison , Virendra V. S. Rana , James F. Roberts , Ashok K. Sinha , Simon Tam
IPC分类号： C23C14/50 , C23C16/458 , H01L21/687 , F28F7/00 , C23C16/00
CPC分类号： H01L21/68721 , C23C14/50 , C23C16/4585 , Y10S269/903
摘要： A compound clamp ring secures a semiconductor wafer having a wafer flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the wafer pedestal to prevent leakage of coolant gases circulated at the backside of the wafer into the process environment. The clamp ring has an annular wafer clamp surface adapted to press a round portion of the wafer into sealing abutment with the wafer pedestal. A cavity formed in the clamp ring securely receives a comb-like array of resilient flexures that are adapted to apply a yieldable bias to the flat portion of the wafer to complete the seal between the wafer and the pedestal at the flat portion of the wafer; and encloses the flexures to shield the flexures from process gases.
摘要翻译：复合夹环在晶片处理期间将具有晶片平坦部分的半导体晶片固定到晶片基座，同时保持晶片边缘和晶片基座之间的连续密封，以防止在晶片背面循环的冷却剂气体泄漏到工艺环境中。夹紧环具有适于将晶圆的圆形部分压紧到与晶片基座密封抵接的环形晶片夹紧表面。形成在夹紧环中的空腔牢固地容纳弹性挠曲的梳状阵列，其适于对晶片的平坦部分施加可屈服的偏压，以在晶片的平坦部分处完成晶片和基座之间的密封; 并包围挠曲件以将工件气体的挠曲屏蔽。

2. 发明授权

US5316278A Clamping ring apparatus for processing semiconductor wafers 失效
标题翻译：用于处理半导体晶圆的夹紧环装置
公开(公告)号：US5316278A
公开(公告)日：1994-05-31
申请号：US947212
申请日：1992-09-18
申请人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alfred Mak , James F. Roberts , Simon W. Tam , Wen T. Chang
发明人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alfred Mak , James F. Roberts , Simon W. Tam , Wen T. Chang
IPC分类号： H01L21/687 , B25B1/00
CPC分类号： H01L21/68721 , Y10S269/903
摘要： An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.In one embodiment, the sidewalls of the slots are slanted with respect to the planar surface of the clamping ring means at an angle sufficient, with respect to the thickness of the clamping ring means and the width of the slot,, to prevent a ray or a particle from a plasma, traveling in a direction perpendicular to the plane of the surface of the clamping ring means from striking surfaces underlying the clamping ring means, through the slot.
摘要翻译：公开了一种改进的夹紧环装置，其包括夹紧环装置，用于可屈服地接合大致圆形的半导体晶片以将晶片周边夹持到支撑基座，以在晶片与面对晶片的基座的表面之间提供周边密封，通过在夹紧环中提供中心大致圆形的开口，以及从夹紧环装置中的中心开口径向向外延伸的一系列槽，从而将夹紧环装置的内部分成一系列可伸缩的手指向内延伸朝向夹紧环装置中的中心开口。在一个实施例中，槽的侧壁相对于夹紧环装置的平坦表面以相对于夹紧环装置的厚度和槽的宽度足够的角度倾斜以防止光线或来自等离子体的颗粒通过狭槽从垂直于夹紧环装置的表面的平面的方向通过夹紧环装置下方的冲击表面行进。

3. 发明授权

US5326725A Clamping ring and susceptor therefor 失效
标题翻译：夹环和感受器
公开(公告)号：US5326725A
公开(公告)日：1994-07-05
申请号：US31259
申请日：1993-03-11
申请人： Semyon Sherstinsky , Charles C. Harris , Mei Chang , Dale R. Du Bois , James F. Roberts , Susan Telford , Ronald L. Rose , Meng C. Tseng , Karl A. Littau
发明人： Semyon Sherstinsky , Charles C. Harris , Mei Chang , Dale R. Du Bois , James F. Roberts , Susan Telford , Ronald L. Rose , Meng C. Tseng , Karl A. Littau
IPC分类号： C23C16/04 , C23C16/44 , C23C16/455 , C23C16/458 , H01L21/687 , C23C16/00
CPC分类号： C23C16/45521 , C23C16/042 , C23C16/4585 , H01L21/68721 , H01L21/68735
摘要： A clamping ring having a downwardly extending finger that mates with a pocket in the periphery of a susceptor for supporting a wafer in a chemical vapor deposition chamber, provides alignment of the clamping ring, the wafer and the susceptor. A source of inert gas connected to the pocket provides a positive pressure in the pocket that prevents reactive gas in the chamber from reaching the edge and backside of the wafer. A source of vacuum connected to the susceptor support surface ensures good contact between the wafer and the susceptor.The clamping ring also has a lip extending over the top surface of the wafer having a rear surface that has a negative angle with respect to the upper surface of the clamping ring, providing a knife edge seal to the wafer, reducing the area of contact between the clamping ring and the wafer and providing a reduced area of thermal contact between the clamping ring and the wafer.
摘要翻译：具有向下延伸的指状物的夹紧环，其与基座的周边中的口相配合，用于在化学气相沉积室中支撑晶片，提供夹紧环，晶片和基座的对准。连接到口袋的惰性气体源在口袋中提供正压力，防止腔室中的反应性气体到达晶片的边缘和背面。连接到基座支撑表面的真空源确保了晶片和基座之间良好的接触。夹紧环还具有在晶片的顶表面上延伸的唇缘，其具有相对于夹紧环的上表面具有负角度的后表面，为晶片提供刀刃密封，从而减小了夹紧环和晶片，并且在夹紧环和晶片之间提供减小的热接触面积。

4. 发明授权

US6123864A Etch chamber 失效
标题翻译：蚀刻室
公开(公告)号：US6123864A
公开(公告)日：2000-09-26
申请号：US327126
申请日：1994-10-21
申请人： Simon W. Tam , Semyon Sherstinsky , Mei Chang , Alan Morrison , Ashok Sinha
发明人： Simon W. Tam , Semyon Sherstinsky , Mei Chang , Alan Morrison , Ashok Sinha
IPC分类号： H01L21/687 , H05H1/00
CPC分类号： H01L21/68721 , H01L21/68785 , H01J2237/022
摘要： A conventional plasma etch chamber is modified to reduce particulate generation in the chamber that contaminates the chamber and substrates mounted on a pedestal support being processed therein. A clamping ring cover in the chamber is made of ceramic. Grooves are machined into the cover and metal antennas can be mounted in the grooves to act as a getter for particles and pre-particle, non-volatile contaminants in the chamber. The clamping ring for the substrate being processed is also made of ceramic. Fewer particles are generated by ion bombardment using ceramic versus prior art clamping rings made of aluminum. Further, the cylinder clamping ring support which surrounds the pedestal support is fitted with a plurality of openings or windows to allow escape of purge gases that carry particles through the windows and into the adjoining exhaust system of the chamber and thus also away from the substrate being processed. Markedly fewer particles are deposited onto substrates using the modified plasma etch chamber of the invention than was found for unmodified chambers.
摘要翻译：修改常规等离子体蚀刻室以减少腔室中的颗粒产生，从而污染安装在其中处理的基座支撑件上的腔室和基底。腔室中的夹紧环盖由陶瓷制成。槽被加工成盖子，并且金属天线可以安装在凹槽中，以用作在室中的颗粒和预颗粒，非挥发性污染物的吸气剂。用于被处理的基板的夹紧环也由陶瓷制成。通过使用陶瓷的离子轰击产生的较少的颗粒与由铝制成的现有技术的夹紧环产生。此外，围绕基座支撑件的气缸夹紧环支撑装配有多个开口或窗口，以允许通过窗口携带颗粒的吹扫气体逸出并进入室的相邻排气系统，并且因此也远离基板处理。使用本发明的改进的等离子体蚀刻室，显着减少颗粒沉积到基板上，而不是未修改的室。

5. 发明授权

US06270621B1 Etch chamber 失效
标题翻译：蚀刻室
公开(公告)号：US06270621B1
公开(公告)日：2001-08-07
申请号：US09593018
申请日：2000-06-13
申请人： Simon W. Tam , Semyon Sherstinsky , Mei Chang , Alan Morrison , Ashok Sinha
发明人： Simon W. Tam , Semyon Sherstinsky , Mei Chang , Alan Morrison , Ashok Sinha
IPC分类号： H01L2100
CPC分类号： H01L21/68721 , H01J2237/022 , H01L21/68785
摘要： A conventional plasma etch chamber is modified to reduce particulate generation in the chamber that contaminates the chamber and substrates mounted on a pedestal support being processed therein. A clamping ring cover in the chamber is made of ceramic. Grooves are machined into the cover and metal antennas can be mounted in the grooves to act as a getter for particles and pre-particle, non-volatile contaminants in the chamber. The clamping ring for the substrate being processed is also made of ceramic. Fewer particles are generated by ion bombardment using ceramic versus prior art clamping rings made of aluminum. Further, the cylinder clamping ring support which surrounds the pedestal support is fitted with a plurality of openings or windows to allow escape of purge gases that carry particles through the windows and into the adjoining exhaust system of the chamber and thus also away from the substrate being processed. Markedly fewer particles are deposited onto substrates using the modified plasma etch chamber of the invention than was found for unmodified chambers.
摘要翻译：修改常规等离子体蚀刻室以减少腔室中的颗粒产生，从而污染安装在其中处理的基座支撑件上的腔室和基底。腔室中的夹紧环盖由陶瓷制成。槽被加工成盖子，并且金属天线可以安装在凹槽中，以用作在室中的颗粒和预颗粒，非挥发性污染物的吸气剂。用于被处理的基板的夹紧环也由陶瓷制成。通过使用陶瓷的离子轰击产生的较少的颗粒与由铝制成的现有技术的夹紧环产生。此外，围绕基座支撑件的气缸夹紧环支撑装配有多个开口或窗口，以允许通过窗口携带颗粒的吹扫气体逸出并进入室的相邻排气系统，并且因此也远离基板处理。使用本发明的改进的等离子体蚀刻室，显着减少颗粒沉积到基板上，而不是未修改的室。

6. 发明授权

US06557248B1 Method of fabricating an electrostatic chuck 失效
标题翻译：制造静电卡盘的方法
公开(公告)号：US06557248B1
公开(公告)日：2003-05-06
申请号：US09087332
申请日：1998-05-29
申请人： Shamouil Shamouilian , Manoocher Birang , John F. Cameron , Chandra Deshpandey , Alfred Goldspeil , Ron Northrup , Semyon Sherstinsky , Sasson Someth
发明人： Shamouil Shamouilian , Manoocher Birang , John F. Cameron , Chandra Deshpandey , Alfred Goldspeil , Ron Northrup , Semyon Sherstinsky , Sasson Someth
IPC分类号： H01R4300
CPC分类号： C23C16/45521 , C23C16/4586 , H01L21/67103 , H01L21/6831 , H01L21/6833 , H02N13/00 , Y10T29/49117 , Y10T279/23
摘要： A method of fabricating an electrostatic member 33 for holding a substrate 45 in a process chamber 80 containing erosive process gas. The method comprises the steps of forming an electrostatic member 33 comprising an insulator or dielectric layer 35 covering an electrically conductive layer, and shaping the electrostatic member 33 to form a dielectric covered electrode and an electrical connector 55 attached to the dielectric covered electrode 50 to conduct charge to the dielectric covered electrode 50.
摘要翻译：一种制造静电部件33的方法，用于将基板45保持在包含腐蚀性处理气体的处理室80中。该方法包括以下步骤：形成包括覆盖导电层的绝缘体或电介质层35的静电部件33，并且使静电部件33成形以形成介电覆盖电极和连接到电介质被覆电极50的电连接器55 充电到介电覆盖电极50。

7. 发明授权

US4627288A Bearing unloading mechanism for disc clamping unit 失效
标题翻译：圆盘夹紧单元的轴承卸载机构
公开(公告)号：US4627288A
公开(公告)日：1986-12-09
申请号：US764413
申请日：1985-08-12
申请人： Nahum Guzik , John L. Guerini , Semyon Sherstinsky
发明人： Nahum Guzik , John L. Guerini , Semyon Sherstinsky
IPC分类号： G11B17/028
CPC分类号： G11B17/0287
摘要： A bearing unloading mechanism for a disc clamping unit utilized in rigid disc certifiers or testers comprises a hollow spindle (12) containing a pulling rod (20) which slides in the spindle. The upper end of the pulling rod carries a clamping element (26) for clamping a disc (D) to be tested or certified. There is a first compression spring (32) arranged between a flange (30) at the lower end of rod (20) and second compression springs (56) between stationary casing (18) and a moveable casing (48) which is attached to a pneumatic cylinder (40), solenoid, or any other linear actuator. When the actuator is energized, the moveable casing moves down, compressing the second springs until the moveable casing comes into contact with an abutment flange (58) of the spindle. At this point the device continues to move the rod connected to the clamp up to the unclamped position. Since the device is applying an equal downward force, as well as an upward force, there is no force applied to the internal components of the bearings.
摘要翻译：用于刚性盘认证机或测试机中的盘夹紧单元的轴承卸载机构包括一个中空轴（12），其包含在主轴中滑动的拉杆（20）。拉杆的上端承载用于夹紧待测试或认证的盘（D）的夹紧元件（26）。第一压缩弹簧（32）设置在杆（20）的下端处的凸缘（30）和固定壳体（18）与可移动壳体（48）之间的第二压缩弹簧（56）之间，第一压缩弹簧气动缸（40），螺线管或任何其他线性执行器。当致动器通电时，可移动壳体向下移动，压缩第二弹簧，直到可动壳体与主轴的邻接凸缘（58）接触。此时，设备继续将连接到夹具的杆移动到未夹紧位置。由于装置施加相等的向下的力以及向上的力，因此不会对轴承的内部部件施加力。

8. 发明授权

US06726805B2 Pedestal with integral shield 有权
标题翻译：带整体护罩的基座
公开(公告)号：US06726805B2
公开(公告)日：2004-04-27
申请号：US10128983
申请日：2002-04-24
申请人： Karl Brown , Vineet Mehta , See-Eng Phan , Semyon Sherstinsky , Allen Lau
发明人： Karl Brown , Vineet Mehta , See-Eng Phan , Semyon Sherstinsky , Allen Lau
IPC分类号： H05H100
CPC分类号： H01L21/67069 , H01J37/321 , H01J37/32623
摘要： Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.
摘要翻译：通常，提供了用于支撑衬底的衬底支撑构件。在一个实施例中，用于支撑衬底的衬底支撑构件包括联接到下屏蔽的主体。主体具有适于支撑基板和下表面的上表面。下屏蔽件具有中心部分和唇部。唇缘设置在身体的径向外侧并朝向由第一表面限定的平面突出。唇缘与身体间隔开设置。下屏蔽适于与设置在处理室中的上屏蔽接口以限定基本上防止等离子体迁移到构件下方的迷宫间隙。在另一个实施例中，下屏蔽为等离子体提供短的RF接地返回路径。

9. 发明授权

US06464795B1 Substrate support member for a processing chamber 失效
标题翻译：用于处理室的基板支撑构件
公开(公告)号：US06464795B1
公开(公告)日：2002-10-15
申请号：US09563573
申请日：2000-05-03
申请人： Semyon Sherstinsky , Calvin Augason , Leonel A. Zuniga , Jun Zhao , Talex Sajoto , Leonid Selyutin , Joseph Yudovsky , Maitreyee Mahajani , Steve G. Ghanayem , Tai T. Ngo , Arnold Kholodenko
发明人： Semyon Sherstinsky , Calvin Augason , Leonel A. Zuniga , Jun Zhao , Talex Sajoto , Leonid Selyutin , Joseph Yudovsky , Maitreyee Mahajani , Steve G. Ghanayem , Tai T. Ngo , Arnold Kholodenko
IPC分类号： G23C1600
CPC分类号： C23C16/45521 , C23C16/4586 , H01L21/67109 , H01L21/6838 , H01L21/68785
摘要： A support member for supporting a substrate in a process chamber, the support member having a substrate support surface with one or more isolated recessed areas. A vacuum channel and a gas channel are formed in the support member along a common plane and are coupled to a vacuum source and gas source respectively. The gas channel comprises two or more concentrically disposed annular gas channels encompassing the vacuum channel. The vacuum channel is coupled to the support surface, and in particular to the one or more recessed areas, by a plurality of conduits. A portion of the conduits is disposed diametrically exterior to at least one of the annular gas channels and communicates with the vacuum channel via bypass channels.
摘要翻译：一种用于在处理室中支撑衬底的支撑构件，所述支撑构件具有具有一个或多个隔离的凹陷区域的衬底支撑表面。真空通道和气体通道沿着公共平面形成在支撑构件中，并且分别耦合到真空源和气体源。气体通道包括包围真空通道的两个或更多个同心设置的环形气体通道。真空通道由多个管道联接到支撑表面，特别是连接到一个或多个凹陷区域。导管的一部分沿直径设置在至少一个环形气体通道的外部，并通过旁通通道与真空通道连通。

10. 发明授权

US5671117A Electrostatic chuck 失效
标题翻译：静电吸盘
公开(公告)号：US5671117A
公开(公告)日：1997-09-23
申请号：US626667
申请日：1996-03-27
申请人： Semyon Sherstinsky , Shamouil Shamouilian , Manoocher Birang , Alfred Mak , Simon W. Tam
发明人： Semyon Sherstinsky , Shamouil Shamouilian , Manoocher Birang , Alfred Mak , Simon W. Tam
IPC分类号： B23Q3/15 , C23C16/458 , H01L21/00 , H01L21/683 , H02N13/00
CPC分类号： H02N13/00 , C23C16/4586 , H01L21/67109 , H01L21/6831 , H01L21/6833 , Y10T279/23 , Y10T29/49117
摘要： An electrostatic chuck for securing a semiconductor wafer on a pedestal having multiple apertures for the introduction of cooling gas beneath the wafer. The multiple apertures reduce overheating near the wafer edge and provide lower temperature gradients across the wafer. The wafer is held by electrostatic force against a laminate of an electrode layer sandwiched between two dielectric layers in such a way that the laminate presents a planar surface to the wafer for a substantial distance beyond the outer edge of the electrode layer. The laminate construction ensures that a large wafer area beyond the outer edge of the electrode is in contact with the laminate, to minimize cooling gas leakage near the edge, and provides a longer useful life by increasing the path length of dielectric material between the electrode layer and potentially damaging plasma material surrounding the chuck.
摘要翻译：一种用于将半导体晶片固定在具有多个孔的基座上以在晶片下方引入冷却气体的静电卡盘。多个孔径减小晶片边缘附近的过热，并在晶片上提供较低的温度梯度。晶片通过静电力抵抗夹在两个电介质层之间的电极层的层压体，使得层压体在晶片上呈现超过电极层的外边缘相当长的平面。层压结构确保了超过电极外边缘的大的晶片区域与层压体接触，以使边缘附近的冷却气体泄漏最小化，并且通过增加电极层之间的电介质材料的路径长度来提供更长的使用寿命并可能损坏卡盘周围的等离子体材料。

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