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1. 发明授权

US5970322A Ultrahigh-frequency electronic component and method of manufacturing the same 失效
标题翻译：超高频电子元件及其制造方法
公开(公告)号：US5970322A
公开(公告)日：1999-10-19
申请号：US4447
申请日：1998-01-08
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/565 , H01L23/295 , H01L23/3135 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
摘要翻译：超高频电子元件具有封装在模制树脂封装中的超高频芯片。超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。还公开了一种制造超高频电子部件的方法。

2. 发明授权

US5904501A Hollow package manufacturing method 失效
标题翻译：空心包装制造方法
公开(公告)号：US5904501A
公开(公告)日：1999-05-18
申请号：US824459
申请日：1997-03-26
申请人： Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Kenji Uchida , Tsutomu Kubota , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka
发明人： Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Kenji Uchida , Tsutomu Kubota , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka
IPC分类号： H01L23/02 , H01L21/00 , H01L23/04 , H01L23/10 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/67126 , H01L23/10 , H01L2924/0002 , H01L2924/09701 , Y10S257/924
摘要： A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
摘要翻译：中空包装制造方法包括粘合剂铺展步骤，粘合剂施加步骤和盖子粘合步骤。在粘合剂铺展步骤中，将粘合剂铺展在圆桌上以均匀的厚度。在粘合剂涂布步骤中，具有底部的圆筒形盖的开口端面被推靠在圆台上以将粘合剂施加到盖上。在盖接合步骤中，将涂有粘合剂的盖子粘附到壳体上。还公开了一种中空包装制造装置。

3. 发明授权

US5889232A Ultrahigh-frequency electronic component 失效
标题翻译：超高频电子元件
公开(公告)号：US5889232A
公开(公告)日：1999-03-30
申请号：US855537
申请日：1997-05-13
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L23/28
CPC分类号： H01L21/565 , H01L23/295 , H01L23/3135 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
摘要翻译：超高频电子元件具有封装在模制树脂封装中的超高频芯片。超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。还公开了一种制造超高频电子部件的方法。

4. 发明授权

US6011303A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US6011303A
公开(公告)日：2000-01-04
申请号：US978648
申请日：1997-11-26
申请人： Junichi Tanaka , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Kenji Watanabe , Kenji Utida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Junichi Tanaka , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Kenji Watanabe , Kenji Utida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L23/48 , H01L23/02 , H01L23/04 , H01L23/31 , H01L23/50 , H01L23/66
CPC分类号： H01L23/315 , H01L23/66 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/30107
摘要： An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
摘要翻译：电子部件包括基板部分，堤部分，多个引线部件，锚定孔以及至少一对凹口。芯片支撑在基板部分上。堤部分形成在基片部分的周围以围绕芯片。多个引线构件由导电条片制成，并且每个引线构件具有电连接到芯片的内引线和延伸到外部的外引线。基板部分和堤部分用树脂一体地模制成包括引线部件，使得内引线和外引线固定到基片部分和堤部之间的连接部分。锚定孔形成在每个引导部件与堤部分接触的部分中，并且填充有树脂。一对切口形成在每个引导构件的两端以夹持锚定孔。

5. 发明授权

US5956574A Lead frame flash removing method and apparatus 失效
标题翻译：引线框架闪光去除方法和装置
公开(公告)号：US5956574A
公开(公告)日：1999-09-21
申请号：US808420
申请日：1997-02-28
申请人： Seiji Ichikawa , Junichi Tanaka , Tomoaki Hirokawa , Taku Sato , Tomoaki Kimura , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida , Kenji Watanabe , Tsutomu Noguti
发明人： Seiji Ichikawa , Junichi Tanaka , Tomoaki Hirokawa , Taku Sato , Tomoaki Kimura , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida , Kenji Watanabe , Tsutomu Noguti
IPC分类号： H01L21/56 , H01L21/48 , H01L23/50 , H01L21/44 , H01L21/50
CPC分类号： H01L21/4835 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/30107
摘要： In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.
摘要翻译：在引线框架闪光去除方法和装置中，引线框架与壳体一体地模制。在模制之后，将研磨剂混合水喷射到形成闪光的引线框架的表面。将引线框架浸入电解液中，施加直流电压施加在引线框架和电解液中的电极，由此对引线框架进行电解处理。在电解处理之后，将外力施加到引线框架的表面，从而去除闪光。

6. 发明授权

US5905301A Mold package for sealing a chip 失效
标题翻译：用于密封芯片的模具封装
公开(公告)号：US5905301A
公开(公告)日：1999-05-18
申请号：US792394
申请日：1997-02-03
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Junichi Tanaka , Taku Sato , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Junichi Tanaka , Taku Sato , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida
IPC分类号： H01L23/04 , H01L23/02 , H01L23/057 , H01L23/08 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/66 , H01L23/10 , H01L29/82
CPC分类号： H01L24/49 , H01L23/057 , H01L23/315 , H01L23/49541 , H01L23/49555 , H01L23/49861 , H01L23/66 , H01L2224/16245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/85201 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01067 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025
摘要： A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
摘要翻译：本发明的封装包括：通过树脂与引线框架整体模制的基座，安装在引线框架上的芯片和覆盖芯片并固定到基座的由树脂制成的盖。底座包括密封引线框架的基板部分，形成在所述基板部分的上表面的周边的框状的堤部分，其中插入在基板部分之间的引线框架的堤岸部分和锚定部分形成在插入在基板部分和堤岸部分之间的引线框架的一部分。芯片安装在由堤部分围绕的引线框架的区域上。盖子固定在银行部分。

7. 发明授权

US06467666B2 Method of producing a semiconductor device 失效
标题翻译：半导体装置的制造方法
公开(公告)号：US06467666B2
公开(公告)日：2002-10-22
申请号：US09870299
申请日：2001-05-30
申请人： Seiji Ichikawa , Tatsuo Tokue , Nobuo Nagano , Fumie Ogihara , Taku Sato
发明人： Seiji Ichikawa , Tatsuo Tokue , Nobuo Nagano , Fumie Ogihara , Taku Sato
IPC分类号： B65H2300
CPC分类号： H01L21/67092 , B28D5/0011 , H01L21/3043 , H01L21/78 , H05K1/0306 , H05K3/0052 , H05K2201/09036 , H05K2201/0909 , H05K2203/1572 , H05K2203/302 , Y10T225/12 , Y10T225/325
摘要： A method of producing a semiconductor device of the present invention is applicable to a multilayer wafer for leadless chip carrier packages and breaks it on a package basis. The method begins with a step of forming a generally V-shaped groove in one major surfaces of the wafer in the direction of thickness of the wafer. A weak, cleaving portion is formed in the other major surface of the wafer in alignment with the groove. A cleaving force is exerted on the wafer to thereby form a break in the cleaving portion, so that the wafer is caused to break from the groove toward the cleaving portion in the direction of thickness of the wafer. The cleaving portion may be replaced with a strong, non-cleaving portion, in which case the break is formed in the interface between the non-cleaving portion and the wafer due to a difference in cleaving force.
摘要翻译：本发明的半导体器件的制造方法可应用于无引线芯片载体封装的多层晶片，并以封装为基础将其破坏。该方法开始于在晶片的一个主表面上沿晶片厚度方向形成大致V形槽的步骤。在晶片的另一个主表面上与凹槽对准地形成弱的分离部分。切割力施加在晶片上，从而在裂开部分形成断裂，从而使得晶片在晶片的厚度方向上从凹槽向分裂部分断裂。切割部分可以用强的非分裂部分代替，在这种情况下，由于分裂力的差异，在非裂开部分和晶片之间的界面中形成断裂。

8. 发明授权

US08466566B2 Semiconductor device, method for manufacturing of semiconductor device, and switching circuit 有权
标题翻译：半导体装置，半导体装置的制造方法以及开关电路
公开(公告)号：US08466566B2
公开(公告)日：2013-06-18
申请号：US13077999
申请日：2011-04-01
申请人： Makoto Nakanishi , Tomoo Yamanouchi , Junichi Okayasu , Taku Sato , Daiju Terasawa , Masahiko Takikawa
发明人： Makoto Nakanishi , Tomoo Yamanouchi , Junichi Okayasu , Taku Sato , Daiju Terasawa , Masahiko Takikawa
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L29/0696 , H01L29/2003 , H01L29/42376 , H01L29/66462 , H01L29/7787 , H01L2924/0002 , H01L2924/00
摘要： It is an objective to provide a semiconductor device with low leak current. The semiconductor device includes a plurality of ground side electrodes and a plurality of signal side electrodes arranged on a semiconductor substrate in an alternating manner; a plurality of control electrodes arranged respectively between each pair of a ground side electrode and a signal side electrode; a ground side electrode connecting section that connects the ground side electrodes to each other; a signal side electrode connecting section that connects the signal side electrodes to each other; and ground side lead wiring and signal side lead wiring that extend respectively from a region near one end and a region near another end of an arranged electrode section, in which the ground side electrodes and the signal side electrodes are arranged in an arrangement direction, away from the arranged electrode group in the arrangement direction.
摘要翻译：提供具有低泄漏电流的半导体器件是目的。半导体器件包括交替地布置在半导体衬底上的多个接地侧电极和多个信号侧电极; 分别布置在每对接地侧电极和信号侧电极之间的多个控制电极; 将接地侧电极彼此连接的接地侧电极连接部; 信号侧电极连接部，其将信号侧电极彼此连接; 以及接地侧引线和信号侧引线，其分别从布置的电极部的靠近一端的区域和靠近另一端的区域延伸，其中接地侧电极和信号侧电极沿排列方向排列从排列的电极组沿排列方向。

9. 发明授权

US06731580B1 Disk unit with dual release mechanism for releasing cover retaining member 失效
标题翻译：具有释放盖保持构件的双释放机构的盘单元
公开(公告)号：US06731580B1
公开(公告)日：2004-05-04
申请号：US09666396
申请日：2000-09-20
申请人： Taku Sato , Hiroyuki Sato
发明人： Taku Sato , Hiroyuki Sato
IPC分类号： G11B500
CPC分类号： G11B17/032 , G11B33/027
摘要： A disk unit includes a loading portion that accommodates a recording medium, a main body unit that contains the loading portion, a cover rotatably attached to the main body unit and capable of moving between a closed position that covers the loading portion and a plurality of open positions that exposes the loading portion, a retaining member provided on the main body unit for retaining the cover in the closed position, a member for manually moving the retaining member to a release position at which the cover is released from retention in the closed position, a drive member activated in response to an eject signal, and a drive transmission mechanism that transmits a drive force of the drive member to the retaining member so as to move the retaining member to the release position.
摘要翻译：盘单元包括容纳记录介质的装载部分，容纳装载部分的主体单元，可旋转地附接到主体单元并能够在覆盖装载部分的关闭位置和多个打开状态之间移动的盖暴露加载部的位置，设置在主体单元上用于将盖保持在关闭位置的保持构件，用于将保持构件手动地移动到释放位置的构件，在该释放位置使盖从保持位置释放在关闭位置，驱动构件，其响应于弹出信号而被致动;以及驱动传递机构，其将所述驱动构件的驱动力传递到所述保持构件，以将所述保持构件移动到所述释放位置。

10. 发明申请

US20060147568A1 Blood pressure-lowering agent, vascular flexibility -improving agent and foods having these functions imparted thereto 审中-公开
标题翻译：血压降低剂，血管柔性改善剂和赋予其功能的食品
公开(公告)号：US20060147568A1
公开(公告)日：2006-07-06
申请号：US10542344
申请日：2004-01-16
申请人： Akihiko Takeuchi , Taku Sato , Hiroaki Yajima , Yutaka Miura , Keiji Kondo , Aruto Yoshida , Kiyoshi Yoshida , Junko Tomita
发明人： Akihiko Takeuchi , Taku Sato , Hiroaki Yajima , Yutaka Miura , Keiji Kondo , Aruto Yoshida , Kiyoshi Yoshida , Junko Tomita
IPC分类号： A61K36/185
CPC分类号： A61K36/185 , A23L33/105 , A61K31/122
摘要： According to the present invention, there is provided a blood pressure-lowering agent, a vascular flexibility-ameliorating agent and foods having these functions imparted thereto, which are comprising isohumulones or a hop extract and/or an isomerized hop extract as an active ingredient.
摘要翻译：根据本发明，提供降血压剂，血管弹性改善剂和赋予其功能的食品，其包含异葎草酮类或啤酒花提取物和/或异构化啤酒花提取物作为活性成分。

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