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1. 发明授权

US5970322A Ultrahigh-frequency electronic component and method of manufacturing the same 失效
标题翻译：超高频电子元件及其制造方法
公开(公告)号：US5970322A
公开(公告)日：1999-10-19
申请号：US4447
申请日：1998-01-08
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/565 , H01L23/295 , H01L23/3135 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
摘要翻译：超高频电子元件具有封装在模制树脂封装中的超高频芯片。超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。还公开了一种制造超高频电子部件的方法。

2. 发明授权

US5904501A Hollow package manufacturing method 失效
标题翻译：空心包装制造方法
公开(公告)号：US5904501A
公开(公告)日：1999-05-18
申请号：US824459
申请日：1997-03-26
申请人： Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Kenji Uchida , Tsutomu Kubota , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka
发明人： Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Kenji Uchida , Tsutomu Kubota , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka
IPC分类号： H01L23/02 , H01L21/00 , H01L23/04 , H01L23/10 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/67126 , H01L23/10 , H01L2924/0002 , H01L2924/09701 , Y10S257/924
摘要： A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
摘要翻译：中空包装制造方法包括粘合剂铺展步骤，粘合剂施加步骤和盖子粘合步骤。在粘合剂铺展步骤中，将粘合剂铺展在圆桌上以均匀的厚度。在粘合剂涂布步骤中，具有底部的圆筒形盖的开口端面被推靠在圆台上以将粘合剂施加到盖上。在盖接合步骤中，将涂有粘合剂的盖子粘附到壳体上。还公开了一种中空包装制造装置。

3. 发明授权

US5889232A Ultrahigh-frequency electronic component 失效
标题翻译：超高频电子元件
公开(公告)号：US5889232A
公开(公告)日：1999-03-30
申请号：US855537
申请日：1997-05-13
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L23/28
CPC分类号： H01L21/565 , H01L23/295 , H01L23/3135 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
摘要翻译：超高频电子元件具有封装在模制树脂封装中的超高频芯片。超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。还公开了一种制造超高频电子部件的方法。

4. 发明授权

US6011303A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US6011303A
公开(公告)日：2000-01-04
申请号：US978648
申请日：1997-11-26
申请人： Junichi Tanaka , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Kenji Watanabe , Kenji Utida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Junichi Tanaka , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Kenji Watanabe , Kenji Utida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L23/48 , H01L23/02 , H01L23/04 , H01L23/31 , H01L23/50 , H01L23/66
CPC分类号： H01L23/315 , H01L23/66 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/30107
摘要： An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
摘要翻译：电子部件包括基板部分，堤部分，多个引线部件，锚定孔以及至少一对凹口。芯片支撑在基板部分上。堤部分形成在基片部分的周围以围绕芯片。多个引线构件由导电条片制成，并且每个引线构件具有电连接到芯片的内引线和延伸到外部的外引线。基板部分和堤部分用树脂一体地模制成包括引线部件，使得内引线和外引线固定到基片部分和堤部之间的连接部分。锚定孔形成在每个引导部件与堤部分接触的部分中，并且填充有树脂。一对切口形成在每个引导构件的两端以夹持锚定孔。

5. 发明授权

US5956574A Lead frame flash removing method and apparatus 失效
标题翻译：引线框架闪光去除方法和装置
公开(公告)号：US5956574A
公开(公告)日：1999-09-21
申请号：US808420
申请日：1997-02-28
申请人： Seiji Ichikawa , Junichi Tanaka , Tomoaki Hirokawa , Taku Sato , Tomoaki Kimura , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida , Kenji Watanabe , Tsutomu Noguti
发明人： Seiji Ichikawa , Junichi Tanaka , Tomoaki Hirokawa , Taku Sato , Tomoaki Kimura , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida , Kenji Watanabe , Tsutomu Noguti
IPC分类号： H01L21/56 , H01L21/48 , H01L23/50 , H01L21/44 , H01L21/50
CPC分类号： H01L21/4835 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/30107
摘要： In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.
摘要翻译：在引线框架闪光去除方法和装置中，引线框架与壳体一体地模制。在模制之后，将研磨剂混合水喷射到形成闪光的引线框架的表面。将引线框架浸入电解液中，施加直流电压施加在引线框架和电解液中的电极，由此对引线框架进行电解处理。在电解处理之后，将外力施加到引线框架的表面，从而去除闪光。

6. 发明授权

US5905301A Mold package for sealing a chip 失效
标题翻译：用于密封芯片的模具封装
公开(公告)号：US5905301A
公开(公告)日：1999-05-18
申请号：US792394
申请日：1997-02-03
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Junichi Tanaka , Taku Sato , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Junichi Tanaka , Taku Sato , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida
IPC分类号： H01L23/04 , H01L23/02 , H01L23/057 , H01L23/08 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/66 , H01L23/10 , H01L29/82
CPC分类号： H01L24/49 , H01L23/057 , H01L23/315 , H01L23/49541 , H01L23/49555 , H01L23/49861 , H01L23/66 , H01L2224/16245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/85201 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01067 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025
摘要： A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
摘要翻译：本发明的封装包括：通过树脂与引线框架整体模制的基座，安装在引线框架上的芯片和覆盖芯片并固定到基座的由树脂制成的盖。底座包括密封引线框架的基板部分，形成在所述基板部分的上表面的周边的框状的堤部分，其中插入在基板部分之间的引线框架的堤岸部分和锚定部分形成在插入在基板部分和堤岸部分之间的引线框架的一部分。芯片安装在由堤部分围绕的引线框架的区域上。盖子固定在银行部分。

7. 发明申请

US20100147962A1 Method and Apparatus for Generating a Barcode with a Human Readable Interpretation, a Printing Apparatus, and a Program 审中-公开
标题翻译：用于生成具有人类可读解释的条形码的方法和装置，打印装置和程序
公开(公告)号：US20100147962A1
公开(公告)日：2010-06-17
申请号：US12710080
申请日：2010-02-22
申请人： Teisuke Takei , Tomoaki Kimura
发明人： Teisuke Takei , Tomoaki Kimura
IPC分类号： G06K19/06
CPC分类号： G06K19/06056 , G06K19/06018
摘要： The present invention is a system and method for generating a barcode with a human readable interpretation (HRI). The method involves receiving characters as an input data set that comprises a series of unique data sets each comprising a unique application identifier. For each adjacent pair of data sets, a special character is inserted between the two data sets of the pair. The method further includes generating a barcode encoding data set for encoding the barcode based on the input data set, including interpreting the special character as a separator between data sets; generating a data set for the HRI based on the input data set, including converting the special character to a “_” (space); and generating the barcode with the HRI including combining the barcode encoding data set and the data set for the HRI.
摘要翻译：本发明是用于生成具有人类可读解释（HRI）的条形码的系统和方法。该方法包括接收字符作为输入数据集，其包括一系列唯一的数据集，每个唯一的数据集包括唯一的应用标识符。对于每个相邻的数据集对，在该对的两个数据集之间插入特殊字符。该方法还包括基于输入数据集生成条形码编码数据集，用于对条形码进行编码，包括将特殊字符解释为数据集之间的分隔符; 基于输入数据集生成用于HRI的数据集，包括将特殊字符转换为“_”（空格）; 并且生成具有HRI的条形码，包括组合条形码编码数据集和HRI的数据集。

8. 发明申请

US20100014130A1 Sheet Media Reading Control Method And Sheet Media Reading Device 有权
标题翻译：片材介质读取控制方法和片材介质读取装置
公开(公告)号：US20100014130A1
公开(公告)日：2010-01-21
申请号：US12503636
申请日：2009-07-15
申请人： Atsushi Natsuno , Tomoaki Kimura
发明人： Atsushi Natsuno , Tomoaki Kimura
IPC分类号： H04N1/04
CPC分类号： H04N1/00002 , B65H31/24 , B65H2301/31124 , B65H2301/321 , B65H2301/4214 , B65H2701/1912 , G06K13/063 , G06K13/16 , G06K2017/0038 , H04N1/0005 , H04N1/00068 , H04N1/00087 , H04N1/00718 , H04N1/00745
摘要： A sheet media reading control method includes conveying a sheet medium on which magnetic ink characters are printed through a transportation path, reading the magnetic ink characters and an image of the sheet medium using a magnetic head and an image sensor head positioned along the transportation path, extracting partial scanned image data containing at least an outside edge part of the sheet medium from the scanned image data captured by the image sensor head, executing a skew evaluation based on the partial scanned image data to detect if the sheet medium is conveyed skewed at a skew angle exceeding an allowable skew angle, and invalidating at least the magnetic ink character data captured by the magnetic head from sheet media that are determined by the skew evaluation to be skewed.
摘要翻译：片材介质读取控制方法包括：通过传送路径传送其上印有磁性墨水字符的片材介质，使用沿着传送路径定位的磁头和图像传感器头读取磁性墨水字符和片状介质的图像，从由图像传感器头捕获的扫描图像数据提取包含片材介质的至少外边缘部分的部分扫描图像数据，基于部分扫描图像数据执行偏斜评估，以检测片材介质是否在倾斜角度超过允许的偏斜角度，并且至少使由磁头捕获的磁性墨水字符数据使得由倾斜评估确定的薄片介质失效。

9. 发明申请

US20080228448A1 WAVEFORM MEASURING APPARATUS AND METHOD THEREOF 有权
标题翻译：波形测量装置及其方法
公开(公告)号：US20080228448A1
公开(公告)日：2008-09-18
申请号：US12129035
申请日：2008-05-29
申请人： Tomoaki Kimura , Tadayuki Okada
发明人： Tomoaki Kimura , Tadayuki Okada
IPC分类号： G01R29/00 , G06F15/00
CPC分类号： G01R13/0272 , G01R19/04
摘要： A waveform measuring apparatus includes: a digital filter for removing a large-amplitude changing component from an input signal and for outputting a resultant output signal with a small-amplitude noise component left therein; a window generating section for receiving a differential signal between this input signal and the resultant output signal of the digital filter and for generating a window indicating a position of an edge portion of the differential signal; and a ringing measurement section for extracting, from the resultant output signal of the digital filter, a portion of waveform which is indicated by the window generated by the window generating section and for measuring at least a peak-to-peak amplitude of the portion of waveform.
摘要翻译：波形测量装置包括：数字滤波器，用于从输入信号中去除大幅度变化分量，并输出其中留下的小振幅噪声分量的合成输出信号; 窗口产生部分，用于在该输入信号和数字滤波器的合成输出信号之间接收差分信号，并产生指示差分信号的边缘部分的位置的窗口; 以及振铃测量部分，用于从所得到的数字滤波器的输出信号中提取由窗口产生部分产生的窗口所指示的波形的一部分，并且用于测量该部分的至少峰值幅度波形

10. 发明申请

US20070041453A1 Signal Processing Apparatus, Program Product and Method Therefor 有权
标题翻译：信号处理装置，程序产品及其方法
公开(公告)号：US20070041453A1
公开(公告)日：2007-02-22
申请号：US11464941
申请日：2006-08-16
申请人： Tomoaki Kimura
发明人： Tomoaki Kimura
IPC分类号： H04B14/04
CPC分类号： H04N5/21
摘要： A method, apparatus and program product for signal processing a coded signal is provided such that multiple signal points, having individual signal values consonant with coded values, are contiguously arranged in accordance with a predetermined time base order or a predetermined spatial order. In one embodiment a signal restoration unit. The unit is provided for calculating an average value for signal values at signal points immediately preceding and following a predetermined signal point that constitutes the coded signal transmitted by said input unit is provided. In addition, the signal unit also provides for calculating, for each of one or a plurality of sets of two signal points to be selected out of a plurality of signal points preceding the predetermined signal point, a signal value difference for the two selected signal points, and obtaining one or a plurality of first difference values; for calculating, for each of one or a plurality of sets of two signal points to be selected out of a plurality of signal points following the predetermined signal point, a signal value difference for the two selected signal points, and obtaining one or a plurality of second difference values; and for correcting the average value by employing either one or a plurality of either the first or the second, or both the first and the second difference values to obtain a restored value for a signal value at the predetermined signal point.
摘要翻译：提供了一种用于信号处理编码信号的方法，装置和程序产品，使得具有与编码值相关联的各个信号值的多个信号点根据预定的时基顺序或预定的空间顺序被连续排列。在一个实施例中，信号恢复单元。该单元被提供用于计算在构成由所述输入单元发送的编码信号的预定信号点之前和之后的信号点处的信号值的平均值。此外，信号单元还提供对于在预定信号点之前的多个信号点中选择的两组信号点的一组或多组中的每一个，计算两个所选信号点的信号值差并获得一个或多个第一差分值; 用于针对在所述预定信号点之后的多个信号点中选择的两个信号点的一组或多组中的每一个计算两个所选信号点的信号值差，并获得一个或多个第二差值并且通过采用第一或第二或第二或第二差分值中的一个或多个来校正平均值，以获得在预定信号点处的信号值的恢复值。

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