专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5956574A Lead frame flash removing method and apparatus 失效
标题翻译：引线框架闪光去除方法和装置
公开(公告)号：US5956574A
公开(公告)日：1999-09-21
申请号：US808420
申请日：1997-02-28
申请人： Seiji Ichikawa , Junichi Tanaka , Tomoaki Hirokawa , Taku Sato , Tomoaki Kimura , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida , Kenji Watanabe , Tsutomu Noguti
发明人： Seiji Ichikawa , Junichi Tanaka , Tomoaki Hirokawa , Taku Sato , Tomoaki Kimura , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida , Kenji Watanabe , Tsutomu Noguti
IPC分类号： H01L21/56 , H01L21/48 , H01L23/50 , H01L21/44 , H01L21/50
CPC分类号： H01L21/4835 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/30107
摘要： In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.
摘要翻译：在引线框架闪光去除方法和装置中，引线框架与壳体一体地模制。在模制之后，将研磨剂混合水喷射到形成闪光的引线框架的表面。将引线框架浸入电解液中，施加直流电压施加在引线框架和电解液中的电极，由此对引线框架进行电解处理。在电解处理之后，将外力施加到引线框架的表面，从而去除闪光。

2. 发明授权

US5905301A Mold package for sealing a chip 失效
标题翻译：用于密封芯片的模具封装
公开(公告)号：US5905301A
公开(公告)日：1999-05-18
申请号：US792394
申请日：1997-02-03
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Junichi Tanaka , Taku Sato , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Junichi Tanaka , Taku Sato , Satoshi Murata , Tsutomu Kubota , Takeo Ogihara , Kenji Uchida
IPC分类号： H01L23/04 , H01L23/02 , H01L23/057 , H01L23/08 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/66 , H01L23/10 , H01L29/82
CPC分类号： H01L24/49 , H01L23/057 , H01L23/315 , H01L23/49541 , H01L23/49555 , H01L23/49861 , H01L23/66 , H01L2224/16245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/85201 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01067 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025
摘要： A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
摘要翻译：本发明的封装包括：通过树脂与引线框架整体模制的基座，安装在引线框架上的芯片和覆盖芯片并固定到基座的由树脂制成的盖。底座包括密封引线框架的基板部分，形成在所述基板部分的上表面的周边的框状的堤部分，其中插入在基板部分之间的引线框架的堤岸部分和锚定部分形成在插入在基板部分和堤岸部分之间的引线框架的一部分。芯片安装在由堤部分围绕的引线框架的区域上。盖子固定在银行部分。

3. 发明授权

US5970322A Ultrahigh-frequency electronic component and method of manufacturing the same 失效
标题翻译：超高频电子元件及其制造方法
公开(公告)号：US5970322A
公开(公告)日：1999-10-19
申请号：US4447
申请日：1998-01-08
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/565 , H01L23/295 , H01L23/3135 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
摘要翻译：超高频电子元件具有封装在模制树脂封装中的超高频芯片。超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。还公开了一种制造超高频电子部件的方法。

4. 发明授权

US5904501A Hollow package manufacturing method 失效
标题翻译：空心包装制造方法
公开(公告)号：US5904501A
公开(公告)日：1999-05-18
申请号：US824459
申请日：1997-03-26
申请人： Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Kenji Uchida , Tsutomu Kubota , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka
发明人： Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Kenji Uchida , Tsutomu Kubota , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka
IPC分类号： H01L23/02 , H01L21/00 , H01L23/04 , H01L23/10 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/67126 , H01L23/10 , H01L2924/0002 , H01L2924/09701 , Y10S257/924
摘要： A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
摘要翻译：中空包装制造方法包括粘合剂铺展步骤，粘合剂施加步骤和盖子粘合步骤。在粘合剂铺展步骤中，将粘合剂铺展在圆桌上以均匀的厚度。在粘合剂涂布步骤中，具有底部的圆筒形盖的开口端面被推靠在圆台上以将粘合剂施加到盖上。在盖接合步骤中，将涂有粘合剂的盖子粘附到壳体上。还公开了一种中空包装制造装置。

5. 发明授权

US5889232A Ultrahigh-frequency electronic component 失效
标题翻译：超高频电子元件
公开(公告)号：US5889232A
公开(公告)日：1999-03-30
申请号：US855537
申请日：1997-05-13
申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L23/28
CPC分类号： H01L21/565 , H01L23/295 , H01L23/3135 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
摘要翻译：超高频电子元件具有封装在模制树脂封装中的超高频芯片。超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。还公开了一种制造超高频电子部件的方法。

6. 发明授权

US6011303A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US6011303A
公开(公告)日：2000-01-04
申请号：US978648
申请日：1997-11-26
申请人： Junichi Tanaka , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Kenji Watanabe , Kenji Utida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
发明人： Junichi Tanaka , Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Kenji Watanabe , Kenji Utida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
IPC分类号： H01L23/48 , H01L23/02 , H01L23/04 , H01L23/31 , H01L23/50 , H01L23/66
CPC分类号： H01L23/315 , H01L23/66 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/30107
摘要： An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
摘要翻译：电子部件包括基板部分，堤部分，多个引线部件，锚定孔以及至少一对凹口。芯片支撑在基板部分上。堤部分形成在基片部分的周围以围绕芯片。多个引线构件由导电条片制成，并且每个引线构件具有电连接到芯片的内引线和延伸到外部的外引线。基板部分和堤部分用树脂一体地模制成包括引线部件，使得内引线和外引线固定到基片部分和堤部之间的连接部分。锚定孔形成在每个引导部件与堤部分接触的部分中，并且填充有树脂。一对切口形成在每个引导构件的两端以夹持锚定孔。

7. 发明授权

US08239965B2 Method of controlling a conference system, program product, and storage medium 失效
标题翻译：控制会议系统，程序产品和存储介质的方法
公开(公告)号：US08239965B2
公开(公告)日：2012-08-07
申请号：US12130625
申请日：2008-05-30
申请人： Tsutomu Kubota
发明人： Tsutomu Kubota
IPC分类号： G06F21/00
CPC分类号： H04L12/1831 , G06Q10/10
摘要： A conference system includes a storage unit configured to store electronic data used as conference material, a display unit configured to display electronic data stored in the storage unit, an identifying unit configured to identify an attendee of a conference, and a memory unit configured to store information about an attendee identified by the identifying unit as viewing history information in association with electronic data displayed by the display.
摘要翻译：会议系统包括：存储单元，被配置为存储用作会议资料的电子数据;显示单元，被配置为显示存储在存储单元中的电子数据;识别单元，被配置为识别会议的与会者;以及存储单元，关于由识别单元识别的参加者与由显示器显示的电子数据相关联的观看历史信息的信息。

8. 发明授权

US5151454A Photocurable adhesive of hydroxy-polyesterurethane acrylate, monomer and polyisocyanate 失效
标题翻译：羟基聚合物丙烯酸酯，单体和聚异氰酸酯的可光胶
公开(公告)号：US5151454A
公开(公告)日：1992-09-29
申请号：US815622
申请日：1991-12-30
申请人： Jugo Goto , Tsutomu Kubota , Reiichi Kotani , Masuo Miyaji
发明人： Jugo Goto , Tsutomu Kubota , Reiichi Kotani , Masuo Miyaji
IPC分类号： C08F2/50 , C08F283/00 , C08F283/10 , C09J5/00 , C09J175/16
CPC分类号： C09J5/00 , C08F283/00 , C08F283/10 , C09J175/16
摘要： A method of profile lapping adhesion which comprises:coating on a film or sheet, or a substrate, or both of these an adhesive composition which comprises:(a) an epoxy resin or an isocyanate compound,(b) a curing agent for the epoxy resin or the isocyanate compound, and(c) a photopolymerizable vinyl compound:irradiating the adhesvie compoisiton;laminating the sheet or film to the substrate while the sheet or film is wrapped around the substrate; andcuring the adhesive composition.An adhesive composition especially suitable for use in the profile lapping adhesion is provided, which comprises:(a) a photopolymerizable compound which has a number average molecular weight of not less than about 3000 and at least one photopolymerizable double linkage in the molecule;(b) a photopolymerizable monomer which has a molecular weight of about 200-800; and(c) an isocyanate compound.The photopolymerizable compound may be in part or in total displaced by a non-photopolymerizable compound which has a number average molecular weight of not less than about 5000.The adhesive composition develops a large primary adhesive strength by being irradiated, and further the adhesive develops a strong adhesion by chemical cure of the isocyanate compound.
摘要翻译：一种轮廓研磨附着力的方法，其包括：在薄膜或片材或基材上涂布这些粘合剂组合物，或两者均包括：（a）环氧树脂或异氰酸酯化合物，（b）环氧树脂固化剂树脂或异氰酸酯化合物，和（c）可光聚合的乙烯基化合物：照射粘合剂; 在将片材或薄膜卷绕在基片上的同时将片材或薄膜层压到基材上; 并固化粘合剂组合物。提供特别适用于轮廓研磨粘合性的粘合剂组合物，其包括：（a）数均分子量不小于约3000的可光聚合化合物和分子中至少一个光聚合双键; （b）分子量为约200-800的光聚合单体; 和（c）异氰酸酯化合物。可光聚合的化合物可以部分或全部被数均分子量不小于约5000的不可光聚合的化合物置换。粘合剂组合物通过照射产生大的初级粘合强度，并且进一步的粘合剂显影出通过化学固化异氰酸酯化合物的强粘附性。

9. 发明授权

US4471090A Powdery coating composition 失效
标题翻译：粉末涂料组合物
公开(公告)号：US4471090A
公开(公告)日：1984-09-11
申请号：US454552
申请日：1982-12-30
申请人： Jugo Goto , Tsutomu Kubota
发明人： Jugo Goto , Tsutomu Kubota
IPC分类号： C09D5/03 , C08G59/00 , C08G59/42 , C08L23/00 , C08L51/00 , C08L51/02 , C08L63/00 , C08L101/00 , C09D5/46 , C09D129/04 , C09D131/04 , C09D163/00 , C08L29/04
CPC分类号： C09D163/00 , C09D129/04 , C08L63/00
摘要： A powdery coating composition comprising (A) a carboxyl-modified product of a hydrolyzed polymer obtained by hydrolyzing a copolymer derived from a vinyl ester of a saturated monocarboxylic acid and a vinyl monomer polymerizable therewith and (B) a compound having not less than two epoxy groups in the molecule offers extremely tough coating films which are resistant to chemicals, water and salt spray.
摘要翻译：一种粉末涂料组合物，其包含（A）通过水解由饱和一元羧酸的乙烯酯衍生的共聚物和可聚合的乙烯基单体获得的水解聚合物的羧基改性产物和（B）具有不少于两个环氧基的化合物分子中的基团提供极其坚韧的涂膜，耐化学品，水和盐雾。

10. 发明申请

US20090049520A1 METHOD OF CONTROLLING A CONFERENCE SYSTEM, PROGRAM PRODUCT, AND STORAGE MEDIUM 失效
标题翻译：控制会议系统，程序产品和存储介质的方法
公开(公告)号：US20090049520A1
公开(公告)日：2009-02-19
申请号：US12130625
申请日：2008-05-30
申请人： Tsutomu Kubota
发明人： Tsutomu Kubota
IPC分类号： G06F15/16 , G06F7/06 , G06F17/30 , G06F21/00
CPC分类号： H04L12/1831 , G06Q10/10
摘要： A conference system includes a storage unit configured to store electronic data used as conference material, a display unit configured to display electronic data stored in the storage unit, an identifying unit configured to identify an attendee of a conference, and a memory unit configured to store information about an attendee identified by the identifying unit as viewing history information in association with electronic data displayed by the display.
摘要翻译：会议系统包括：存储单元，被配置为存储用作会议资料的电子数据;显示单元，被配置为显示存储在存储单元中的电子数据;识别单元，被配置为识别会议的与会者;以及存储单元，关于由识别单元识别的参加者与由显示器显示的电子数据相关联的观看历史信息的信息。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式