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    • 4. 发明授权
    • Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus
    • 用于在通过弯液面处理晶片表面时相对于邻近头部基本上均匀的流体流速的装置
    • US08317966B2
    • 2012-11-27
    • US12367515
    • 2009-02-07
    • Arnold KholodenkoCheng-Yu (Sean) LinRussell Martin
    • Arnold KholodenkoCheng-Yu (Sean) LinRussell Martin
    • B29C65/00B08B3/00
    • H01L21/67051Y10S134/902Y10T29/49826
    • Conditioning fluid flow into a proximity head is provided for fluid delivery to a wafer surface. An upper plenum connected to a plurality of down flow bores is supplied by a main bore. The down flow bores provide fluid into the upper plenum, and a resistor bore is connected to the upper plenum. The resistor bore receives a resistor having a shape so as to limit flow of the fluid through the resistor bore. A lower plenum connected to the resistor bore is configured to receive fluid from the resistor bore as limited by the resistor for flow to a plurality of outlet ports extending between the lower plenum and surfaces of the head surface. Fluid flowing through the upper plenum, the resistor bore with the resistor and the lower plenum is substantially conditioned to define a substantially uniform fluid outflow from the plurality of outlet ports, across the width of the proximity head.
    • 提供流体流入邻近头部的调节流体输送到晶片表面。 连接到多个向下流动孔的上部气室由主孔提供。 向下流动孔将流体提供到上部通风室中,并且电阻器孔连接到上部增压室。 电阻器孔接收具有形状以阻止流体流过电阻器孔的电阻器。 连接到电阻器孔的下部增压室被配置为从电阻器孔接收流体,由电阻器限制,以流向在下部增压室和头部表面的表面之间延伸的多个出口端口。 流过上部通风室的流体,具有电阻器和下部增压室的电阻器孔基本上被调节以限定跨过接近头部宽度的多个出口端口的基本均匀的流体流出。
    • 5. 发明申请
    • REMOVING BUBBLES FROM A FLUID FLOWING DOWN THROUGH A PLENUM
    • 从通过一个地板流出的流体中去除泡沫
    • US20100043822A1
    • 2010-02-25
    • US12194308
    • 2008-08-19
    • Encrico MagniRussell Martin
    • Encrico MagniRussell Martin
    • B08B3/04B05C5/00
    • H01L21/67051H01L21/6708
    • In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.
    • 在示例性实施例中,用于在半导体晶片上沉积流体的顶部邻近头部包括接收流体的输送孔。 顶部邻近头部包括通过多个输入通道连接到输送孔的气室,流体从输送孔流入该通道。 每个输入通道具有倒V形开口,其推动任何气泡向上流动。 从气室,流体通过输出通道流出顶部邻近头部以形成弯液面。 流体通过返回通道返回通孔而从弯液面吸入顶部邻近头部。 通道将输送孔与回流孔连接,允许气泡从输送孔逸出到回流孔中。 该通道允许可忽略量的流体直接在两个孔之间流动,而不是通过气室。
    • 6. 发明申请
    • Method for Removing Bubbles from a Fluid Flowing Down Through a Plenum
    • 从流下的流体中除去气泡的方法
    • US20130042891A1
    • 2013-02-21
    • US13656647
    • 2012-10-19
    • Enrico MagniRussell Martin
    • Enrico MagniRussell Martin
    • B08B3/04
    • H01L21/67051H01L21/6708
    • A system performs a method for removing air bubbles from a proximity head. The system pumps a fluid into a delivery passage in the proximity head that includes, input channels, a plenum, output channels, a return passage, and return channels. The fluid flows from the delivery passage through the input channels into the plenum. Each of the input channels has an inverted V-shaped opening into the plenum to urge any air bubbles in the plenum to flow upwards through the inverted V-shaped opening. The fluid flows from the plenum through the output channels onto a substrate. The system creates suction in the return passage which is connected to the return channels. The return channels suction the fluid from the substrate. A connecting passage connects the delivery passage and the return passage, allowing air bubbles to escape from the delivery passage into the return passage.
    • 系统执行从邻近头部去除气泡的方法。 该系统将流体泵入邻近头部中的输送通道,其包括输入通道,增压室,输出通道,返回通道和返回通道。 流体从输送通道通过输入通道流入气室。 每个输入通道具有倒入V形开口进入通风室,以促使通风室中的任何气泡向上流过反向V形开口。 流体从气室通过输出通道流到衬底上。 该系统在返回通道中产生吸入,该回路与返回通道连接。 返回通道从基板吸入流体。 连接通道连接输送通道和返回通道,允许气泡从输送通道逸出回流通道。
    • 7. 发明授权
    • Removing bubbles from a fluid flowing down through a plenum
    • 从流经通风室的流体中除去气泡
    • US08291921B2
    • 2012-10-23
    • US12194308
    • 2008-08-19
    • Encrico MagniRussell Martin
    • Encrico MagniRussell Martin
    • B08B3/04
    • H01L21/67051H01L21/6708
    • In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.
    • 在示例性实施例中,用于在半导体晶片上沉积流体的顶部邻近头部包括接收流体的输送孔。 顶部邻近头部包括通过多个输入通道连接到输送孔的气室,流体从输送孔流入该通道。 每个输入通道具有倒V形开口,其推动任何气泡向上流动。 从气室,流体通过输出通道流出顶部邻近头部以形成弯液面。 流体通过返回通道返回通孔而从弯液面吸入顶部邻近头部。 通道将输送孔与回流孔连接,允许气泡从输送孔逸出到回流孔中。 该通道允许可忽略量的流体直接在两个孔之间流动,而不是通过气室。
    • 9. 发明申请
    • High Power Electrical Connector for a Laminated Heater
    • 用于层压加热器的大功率电连接器
    • US20080227323A1
    • 2008-09-18
    • US11687344
    • 2007-03-16
    • Arnold KholodenkoRussell MartinJohn RasnickChristopher Kimball
    • Arnold KholodenkoRussell MartinJohn RasnickChristopher Kimball
    • H01R13/02
    • H05B3/06
    • An electrical connector has a non-conductive outer housing and a spring-loaded conductive assembly mounted within. The non-conductive outer housing has a longitudinal axis along which the spring-loaded conductive assembly is allowed to move over a limited range, in either direction. The conductive assembly includes a conductive contact pad and an conductive elongated shaft which are mated together within the non-conductive outer housing. A spring mounted along the contact shaft and in abutment therewith biases the contact shaft in a direction away from the contact base. When the electrical connector is employed in a chamber lid of a chamber lid assembly having an integrated laminated heater, such as for use in conjunction with a wafer processing chamber, the spring biases a lower surface of the contact shaft against the heater.
    • 电连接器具有非导电外壳和安装在其内的弹簧加载导电组件。 非导电外壳具有纵向轴线,弹簧加载的导电组件沿着该纵向轴线可在任一方向上在有限的范围内移动。 导电组件包括导电接触垫和导电细长轴,其在非导电外壳内配合在一起。 沿着接触轴安装并抵靠的弹簧沿远离接触基座的方向偏压接触轴。 当电连接器用于具有集成层压加热器的室盖组件的室盖中时,诸如与晶片处理室结合使用时,弹簧将接触轴的下表面偏置抵靠加热器。