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1. 发明申请

US20100269285A1 APPARATUS AND SYSTEM FOR CLEANING SUBSTRATE 失效
标题翻译：用于清洁基板的装置和系统
公开(公告)号：US20100269285A1
公开(公告)日：2010-10-28
申请号：US12431731
申请日：2009-04-28
申请人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
发明人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , Y10S134/902
摘要： An upper processing head includes a topside module defined to apply a cleaning material to a top surface of a substrate and then expose the substrate to a topside rinsing meniscus. The topside module is defined to flow a rinsing material through the topside rinsing meniscus in a substantially unidirectional manner towards the cleaning material and opposite a direction of movement of the substrate. A lower processing head includes a bottomside module defined to apply a bottomside rinsing meniscus to the substrate so as to balance a force applied to the substrate by the topside rinsing meniscus. The bottomside module is defined to provide a drain channel for collecting and draining the cleaning material dispensed from the upper processing head when the substrate is not present between the upper and lower processing heads. The upper and lower processing heads can include multiple instantiations of the topside and bottomside modules, respectively.
摘要翻译：上加工头包括顶层模块，其定义为将清洁材料施加到基板的顶表面，然后将基板暴露于顶侧冲洗弯液面。顶部模块被定义为使冲洗材料以基本上单向的方式流过顶侧冲洗弯液面朝向清洁材料并与衬底的移动方向相反。下处理头包括底部模块，所述底部模块限定为将底部冲洗弯液面施加到基底，以平衡由顶侧冲洗弯液面施加到基底的力。底部模块被限定为当衬底不存在于上加工头和下加工头之间时，提供用于收集和排出从上加工头分配的清洁材料的排水通道。上下处理头可以分别包括顶侧和底部模块的多个实例。

2. 发明申请

US20110048467A1 Apparatus and System for Cleaning Substrate 审中-公开
标题翻译：清洗基板的设备和系统
公开(公告)号：US20110048467A1
公开(公告)日：2011-03-03
申请号：US12942446
申请日：2010-11-09
申请人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
发明人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , Y10S134/902
摘要： An upper processing head includes a topside module defined to apply a cleaning material to a top surface of a substrate and then expose the substrate to a topside rinsing meniscus. The topside module is defined to flow a rinsing material through the topside rinsing meniscus in a substantially uni-directional manner towards the cleaning material and opposite a direction of movement of the substrate. A lower processing head includes a bottomside module defined to apply a bottomside rinsing meniscus to the substrate so as to balance a force applied to the substrate by the topside rinsing meniscus. The bottomside module is defined to provide a drain channel for collecting and draining the cleaning material dispensed from the upper processing head when the substrate is not present between the upper and lower processing heads. The upper and lower processing heads can include multiple instantiations of the topside and bottomside modules, respectively.
摘要翻译：上加工头包括顶层模块，其定义为将清洁材料施加到基板的顶表面，然后将基板暴露于顶侧冲洗弯液面。顶部模块被定义为使冲洗材料以基本上单向的方式流过顶侧冲洗弯液面朝向清洁材料并与衬底的移动方向相反。下处理头包括底部模块，所述底部模块限定为将底部冲洗弯液面施加到基底，以平衡由顶侧冲洗弯液面施加到基底的力。底部模块被限定为当衬底不存在于上加工头和下加工头之间时，提供用于收集和排出从上加工头分配的清洁材料的排水通道。上下处理头可以分别包括顶侧和底部模块的多个实例。

3. 发明授权

US07849554B2 Apparatus and system for cleaning substrate 失效
标题翻译：用于清洁衬底的设备和系统
公开(公告)号：US07849554B2
公开(公告)日：2010-12-14
申请号：US12431731
申请日：2009-04-28
申请人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
发明人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
IPC分类号： A47L9/08
CPC分类号： H01L21/67051 , Y10S134/902
摘要： An upper processing head includes a topside module defined to apply a cleaning material to a top surface of a substrate and then expose the substrate to a topside rinsing meniscus. The topside module is defined to flow a rinsing material through the topside rinsing meniscus in a substantially uni-directional manner towards the cleaning material and opposite a direction of movement of the substrate. A lower processing head includes a bottomside module defined to apply a bottomside rinsing meniscus to the substrate so as to balance a force applied to the substrate by the topside rinsing meniscus. The bottomside module is defined to provide a drain channel for collecting and draining the cleaning material dispensed from the upper processing head when the substrate is not present between the upper and lower processing heads. The upper and lower processing heads can include multiple instantiations of the topside and bottomside modules, respectively.
摘要翻译：上加工头包括顶层模块，其定义为将清洁材料施加到基板的顶表面，然后将基板暴露于顶侧冲洗弯液面。顶部模块被定义为使冲洗材料以基本上单向的方式流过顶侧冲洗弯液面朝向清洁材料并与衬底的移动方向相反。下处理头包括底部模块，所述底部模块限定为将底部冲洗弯液面施加到基底，以平衡由顶侧冲洗弯液面施加到基底的力。底部模块被限定为当衬底不存在于上加工头和下加工头之间时，提供用于收集和排出从上加工头分配的清洁材料的排水通道。上下处理头可以分别包括顶侧和底部模块的多个实例。

4. 发明授权

US08900374B2 Method for substrate cleaning including movement of substrate below substrate cleaning module 有权
标题翻译：基材清洗方法，包括基板清洗模块下方的基板运动
公开(公告)号：US08900374B2
公开(公告)日：2014-12-02
申请号：US12942446
申请日：2010-11-09
申请人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
发明人： Cheng-Yu (Sean) Lin , Mark Kawaguchi , Mark Wilcoxson , Russell Martin , Leon Ginzburg
IPC分类号： B08B3/04 , H01L21/67
CPC分类号： H01L21/67051 , Y10S134/902
摘要： A substrate is moved below a substrate cleaning module in a direction extending from a leading edge to a trailing edge of the substrate cleaning module. A cleaning material is dispensed downward toward a top surface of the substrate along the leading edge of the substrate cleaning module. A rinsing material is dispensed downward toward the top surface of the substrate along the trailing edge of the substrate cleaning module to generate a rinsing meniscus. Vacuum suction is applied at a vacuum suction location along a bottom surface of the substrate cleaning module and parallel to the leading and trailing edges of the substrate cleaning module. The vacuum location is positioned between a dispense location of the cleaning material and a dispense location of the rinsing material. A plenum region located between the dispense location of the cleaning material and the vacuum location is vented.
摘要翻译：衬底沿着从衬底清洁模块的前缘延伸到后缘的方向移动到衬底清洁模块下方。清洁材料沿着衬底清洁模块的前缘朝向衬底的顶表面向下分配。冲洗材料沿衬底清洁模块的后缘向下分配到衬底的顶表面，以产生漂洗弯液面。真空抽吸沿着基板清洁模块的底表面在真空抽吸位置处并且平行于基板清洁模块的前缘和后缘施加。真空位置位于清洁材料的分配位置和冲洗材料的分配位置之间。位于清洁材料的分配位置和真空位置之间的集气室区域被排出。

5. 发明授权

US08317966B2 Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus 有权
标题翻译：用于在通过弯液面处理晶片表面时相对于邻近头部基本上均匀的流体流速的装置
公开(公告)号：US08317966B2
公开(公告)日：2012-11-27
申请号：US12367515
申请日：2009-02-07
申请人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
发明人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
IPC分类号： B29C65/00 , B08B3/00
CPC分类号： H01L21/67051 , Y10S134/902 , Y10T29/49826
摘要： Conditioning fluid flow into a proximity head is provided for fluid delivery to a wafer surface. An upper plenum connected to a plurality of down flow bores is supplied by a main bore. The down flow bores provide fluid into the upper plenum, and a resistor bore is connected to the upper plenum. The resistor bore receives a resistor having a shape so as to limit flow of the fluid through the resistor bore. A lower plenum connected to the resistor bore is configured to receive fluid from the resistor bore as limited by the resistor for flow to a plurality of outlet ports extending between the lower plenum and surfaces of the head surface. Fluid flowing through the upper plenum, the resistor bore with the resistor and the lower plenum is substantially conditioned to define a substantially uniform fluid outflow from the plurality of outlet ports, across the width of the proximity head.
摘要翻译：提供流体流入邻近头部的调节流体输送到晶片表面。连接到多个向下流动孔的上部气室由主孔提供。向下流动孔将流体提供到上部通风室中，并且电阻器孔连接到上部增压室。电阻器孔接收具有形状以阻止流体流过电阻器孔的电阻器。连接到电阻器孔的下部增压室被配置为从电阻器孔接收流体，由电阻器限制，以流向在下部增压室和头部表面的表面之间延伸的多个出口端口。流过上部通风室的流体，具有电阻器和下部增压室的电阻器孔基本上被调节以限定跨过接近头部宽度的多个出口端口的基本均匀的流体流出。

6. 发明申请

US20130048765A1 Proximity Head Having a Fluid Resistor 有权
标题翻译：具有流体电阻的接近头
公开(公告)号：US20130048765A1
公开(公告)日：2013-02-28
申请号：US13661969
申请日：2012-10-26
申请人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
发明人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
IPC分类号： B05B1/00
CPC分类号： H01L21/67051 , Y10S134/902 , Y10T29/49826
摘要： A proximity head defined by a body having a length. The body includes a main bore defined therein and extending along the length. A resistor bore is defined in the body and extends along the length. The resistor bore defined below the main bore. A first plurality of bores defined between the main bore and the resistor bore and a second plurality of bores defined between the resistor bore and an exterior surface of the body. The exterior surface of the body defining a proximity surface of the proximity head.
摘要翻译：由具有长度的主体限定的邻近头。主体包括限定在其中并沿着长度延伸的主孔。电阻孔定义在主体中并沿着长度延伸。电阻孔位于主孔下方。限定在主孔和电阻器孔之间的第一多个孔和限定在电阻器孔和主体的外表面之间的第二多个孔。主体的外表面限定了邻近头部的接近表面。

7. 发明申请

US20100037922A1 APPARATUS FOR SUBSTANTIALLY UNIFORM FLUID FLOW RATES RELATIVE TO A PROXIMITY HEAD IN PROCESSING OF A WAFER SURFACE BY A MENISCUS 有权
标题翻译：装置用于通过曼尼斯卡处理WAFER表面的临时头部的大体均匀流体流量
公开(公告)号：US20100037922A1
公开(公告)日：2010-02-18
申请号：US12367515
申请日：2009-02-07
申请人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
发明人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , Y10S134/902 , Y10T29/49826
摘要： Conditioning fluid flow into a proximity head is provided for fluid delivery to a wafer surface. An upper plenum connected to a plurality of down flow bores is supplied by a main bore. The down flow bores provide fluid into the upper plenum, and a resistor bore is connected to the upper plenum. The resistor bore receives a resistor having a shape so as to limit flow of the fluid through the resistor bore. A lower plenum connected to the resistor bore is configured to receive fluid from the resistor bore as limited by the resistor for flow to a plurality of outlet ports extending between the lower plenum and surfaces of the head surface. Fluid flowing through the upper plenum, the resistor bore with the resistor and the lower plenum is substantially conditioned to define a substantially uniform fluid outflow from the plurality of outlet ports, across the width of the proximity head.
摘要翻译：提供流体流入邻近头部的调节流体输送到晶片表面。连接到多个向下流动孔的上部气室由主孔提供。向下流动孔将流体提供到上部通风室中，并且电阻器孔连接到上部增压室。电阻器孔接收具有形状以阻止流体流过电阻器孔的电阻器。连接到电阻器孔的下部增压室被配置为从电阻器孔接收流体，由电阻器限制，以流向在下部增压室和头部表面的表面之间延伸的多个出口端口。流过上部通风室的流体，具有电阻器和下部增压室的电阻器孔基本上被调节以限定跨过接近头部宽度的多个出口端口的基本均匀的流体流出。

8. 发明申请

US20100043822A1 REMOVING BUBBLES FROM A FLUID FLOWING DOWN THROUGH A PLENUM 有权
标题翻译：从通过一个地板流出的流体中去除泡沫
公开(公告)号：US20100043822A1
公开(公告)日：2010-02-25
申请号：US12194308
申请日：2008-08-19
申请人： Encrico Magni , Russell Martin
发明人： Encrico Magni , Russell Martin
IPC分类号： B08B3/04 , B05C5/00
CPC分类号： H01L21/67051 , H01L21/6708
摘要： In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.
摘要翻译：在示例性实施例中，用于在半导体晶片上沉积流体的顶部邻近头部包括接收流体的输送孔。顶部邻近头部包括通过多个输入通道连接到输送孔的气室，流体从输送孔流入该通道。每个输入通道具有倒V形开口，其推动任何气泡向上流动。从气室，流体通过输出通道流出顶部邻近头部以形成弯液面。流体通过返回通道返回通孔而从弯液面吸入顶部邻近头部。通道将输送孔与回流孔连接，允许气泡从输送孔逸出到回流孔中。该通道允许可忽略量的流体直接在两个孔之间流动，而不是通过气室。

9. 发明申请

US20130042891A1 Method for Removing Bubbles from a Fluid Flowing Down Through a Plenum 审中-公开
标题翻译：从流下的流体中除去气泡的方法
公开(公告)号：US20130042891A1
公开(公告)日：2013-02-21
申请号：US13656647
申请日：2012-10-19
申请人： Enrico Magni , Russell Martin
发明人： Enrico Magni , Russell Martin
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/6708
摘要： A system performs a method for removing air bubbles from a proximity head. The system pumps a fluid into a delivery passage in the proximity head that includes, input channels, a plenum, output channels, a return passage, and return channels. The fluid flows from the delivery passage through the input channels into the plenum. Each of the input channels has an inverted V-shaped opening into the plenum to urge any air bubbles in the plenum to flow upwards through the inverted V-shaped opening. The fluid flows from the plenum through the output channels onto a substrate. The system creates suction in the return passage which is connected to the return channels. The return channels suction the fluid from the substrate. A connecting passage connects the delivery passage and the return passage, allowing air bubbles to escape from the delivery passage into the return passage.
摘要翻译：系统执行从邻近头部去除气泡的方法。该系统将流体泵入邻近头部中的输送通道，其包括输入通道，增压室，输出通道，返回通道和返回通道。流体从输送通道通过输入通道流入气室。每个输入通道具有倒入V形开口进入通风室，以促使通风室中的任何气泡向上流过反向V形开口。流体从气室通过输出通道流到衬底上。该系统在返回通道中产生吸入，该回路与返回通道连接。返回通道从基板吸入流体。连接通道连接输送通道和返回通道，允许气泡从输送通道逸出回流通道。

10. 发明授权

US08291921B2 Removing bubbles from a fluid flowing down through a plenum 有权
标题翻译：从流经通风室的流体中除去气泡
公开(公告)号：US08291921B2
公开(公告)日：2012-10-23
申请号：US12194308
申请日：2008-08-19
申请人： Encrico Magni , Russell Martin
发明人： Encrico Magni , Russell Martin
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/6708
摘要： In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.
摘要翻译：在示例性实施例中，用于在半导体晶片上沉积流体的顶部邻近头部包括接收流体的输送孔。顶部邻近头部包括通过多个输入通道连接到输送孔的气室，流体从输送孔流入该通道。每个输入通道具有倒V形开口，其推动任何气泡向上流动。从气室，流体通过输出通道流出顶部邻近头部以形成弯液面。流体通过返回通道返回通孔而从弯液面吸入顶部邻近头部。通道将输送孔与回流孔连接，允许气泡从输送孔逸出到回流孔中。该通道允许可忽略量的流体直接在两个孔之间流动，而不是通过气室。

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