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1. 发明授权

US5522937A Welded susceptor assembly 失效
标题翻译：焊接基座组件
公开(公告)号：US5522937A
公开(公告)日：1996-06-04
申请号：US237084
申请日：1994-05-03
申请人： Sandy M. Chew , Dale R. DuBois , Ronald L. Rose , Manus Wong
发明人： Sandy M. Chew , Dale R. DuBois , Ronald L. Rose , Manus Wong
IPC分类号： C23C16/44 , C23C16/458 , C23C16/50 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/683 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68764 , C23C16/458 , H01L21/68707 , H01L21/68785 , H01L21/68792
摘要： A susceptor support arm assembly in a substrate processing chamber includes a secure ground connection between the susceptor and ground. An aluminum wire rope is welded to a winged terminal lug which is tightly inserted into a hole in a susceptor hub. The wings of the lug are then welded to the hub. The wire rope, now permanently attached to the susceptor hub, is routed through an opening in the susceptor end of a ceramic susceptor support arm, able to pass the ground end lug of the wire rope, through a channel in the support arm back to the susceptor arm support device, and to ground. The channel in the susceptor arm has grooves in its sides to receive a paddle shaped ceramic cover to enclose the channel and the bottom of the hub end of the susceptor arm. The cover insulates, isolates, and shields the grounding wire and thermocouple leads being routed from the susceptor hub back to the support end of the susceptor arm from exposure to the high intensity radiant energy directed at the back of the susceptor. Conical spring washers and shoulder screws, attach the metallic pieces (e.g. the susceptor hub) to the ceramic susceptor hub arm allowing for the differential thermal expansion between pieces without overstressing the ceramic material clamped. Surface treatment of the metallic pieces enhances their corrosion resistance.
摘要翻译：衬底处理室中的感受器支撑臂组件包括在基座和地面之间的牢固接地连接。铝丝绳焊接到紧密插入基座毂孔中的翼形端子凸耳上。接头的翼部然后焊接到轮毂。现在永久地连接到基座轮毂上的钢丝绳穿过陶瓷基座支撑臂的基座端部的开口，该开口能够使钢丝索的接地端部凸起通过支撑臂中的通道回到感受器臂支撑装置，并接地。基座臂中的通道在其侧面具有凹槽，以容纳桨形陶瓷盖以封闭通道和基座臂的毂端的底部。盖子将接地线和热电偶引线绝缘，隔离和屏蔽，从接受器轮毂回到基座臂的支撑端，暴露于指向基座背面的高强度辐射能。圆锥形弹簧垫圈和肩螺钉，将金属片（例如，基座毂）连接到陶瓷基座轮毂臂上，允许片之间的不同热膨胀，而不会对夹持的陶瓷材料施加过大的应力。金属片的表面处理提高了其耐腐蚀性。

2. 发明申请

US20110151119A1 Methods and Systems of Transferring, Docking and Processing Substrates 有权
标题翻译：转移，对接和处理基板的方法和系统
公开(公告)号：US20110151119A1
公开(公告)日：2011-06-23
申请号：US13038309
申请日：2011-03-01
申请人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
发明人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
IPC分类号： H01L21/677 , H01L21/673 , C23C16/44 , C23C16/458 , C23C16/56
CPC分类号： H01L21/67173 , H01L21/6719 , H01L21/67706 , H01L21/67712 , H01L21/67727 , H01L21/67736 , H01L21/67748 , Y10S414/135
摘要： In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more mobile transverse chambers, the mobile transverse chambers being carried on a rail positioned adjacent to the two or more process modules, and wherein each mobile transverse chamber is configured to maintain a specified gas condition during conveyance of the substrate. One or more drive systems are actuated to propel at least one of the one or more mobile transverse chambers along the rail. The at least one mobile transfer chamber docks to at least one of the process modules, and the substrate is conveyed from the mobile transverse chamber to the at least one process modules.
摘要翻译：根据本文描述的一些实施例，提供了一种用于将衬底转移到两个或更多个工艺模块的方法，包括将至少一个衬底加载到一个或多个移动横向室中，所述移动横向室承载在邻近两个或更多个处理模块，并且其中每个移动横向室被构造成在输送基板期间保持特定的气体状态。一个或多个驱动系统被致动以沿着轨道推进一个或多个移动横向室中的至少一个。所述至少一个移动传送室与所述处理模块中的至少一个对接，并且所述基板从所述移动横向室传送到所述至少一个处理模块。

3. 发明授权

US06271148B1 Method for improved remote microwave plasma source for use with substrate processing system 失效
标题翻译：用于改善用于衬底处理系统的远程微波等离子体源的方法
公开(公告)号：US06271148B1
公开(公告)日：2001-08-07
申请号：US09416861
申请日：1999-10-13
申请人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
发明人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
IPC分类号： H01L21302
CPC分类号： C23C16/52 , C23C16/4405 , C23C16/452 , H01J37/32192 , H01J37/32357 , H01J37/32862 , H01L21/67028
摘要： An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要翻译：根据具体实施例的用于提供用于有效清洁腔室的远程等离子体的升级CVD系统的装置和方法。使用本发明的升级的CVD系统也可以实现在基板上的蚀刻或沉积层。在具体实施例中，本发明提供了一种用于易于移除，方便处理且相对便宜的鲁棒微波等离子体源的装置，作为对现有CVD设备的改进或可移除的添加。本发明提供了一种改进的CVD装置或改进现有CVD装置，其能够产生用于有效清洁腔室的远程等离子体。

4. 发明申请

US20100167503A1 Methods and systems of transferring, docking and processing substrates 有权
标题翻译：转移，对接和处理基材的方法和系统
公开(公告)号：US20100167503A1
公开(公告)日：2010-07-01
申请号：US12319231
申请日：2008-12-31
申请人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
发明人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
IPC分类号： H01L21/677 , H01L21/36 , H01L21/673
CPC分类号： H01L21/67173 , H01L21/6719 , H01L21/67706 , H01L21/67712 , H01L21/67727 , H01L21/67736 , H01L21/67748 , Y10S414/135
摘要： In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more mobile transverse chambers, the mobile transverse chambers being carried on a rail positioned adjacent to the two or more process modules, and wherein each mobile transverse chamber is configured to maintain a specified gas condition during conveyance of the substrate. One or more drive systems are actuated to propel at least one of the one or more mobile transverse chambers along the rail. The at least one mobile transfer chamber docks to at least one of the process modules, and the substrate is conveyed from the mobile transverse chamber to the at least one process modules.
摘要翻译：根据本文描述的一些实施例，提供了一种用于将衬底转移到两个或更多个工艺模块的方法，包括将至少一个衬底加载到一个或多个移动横向室中，所述移动横向室承载在邻近两个或更多个处理模块，并且其中每个移动横向室被构造成在输送基板期间保持特定的气体状态。一个或多个驱动系统被致动以沿着轨道推进一个或多个移动横向室中的至少一个。所述至少一个移动传送室与所述处理模块中的至少一个对接，并且所述基板从所述移动横向室传送到所述至少一个处理模块。

5. 发明授权

US06206971B1 Integrated temperature controlled exhaust and cold trap assembly 有权
标题翻译：集成温度控制排气和冷阱组件
公开(公告)号：US06206971B1
公开(公告)日：2001-03-27
申请号：US09281998
申请日：1999-03-29
申请人： Salvador P. Umotoy , Lawrence Chung-Lai Lei , Russell C. Ellwanger , Ronald L. Rose , Joel Huston , James Jin-Long Chen
发明人： Salvador P. Umotoy , Lawrence Chung-Lai Lei , Russell C. Ellwanger , Ronald L. Rose , Joel Huston , James Jin-Long Chen
IPC分类号： C23C1600
CPC分类号： B01D8/00 , C23C16/4412 , Y10S55/15 , Y10S55/30
摘要： A temperature-controlled exhaust assembly with cold trap capability. One embodiment of the exhaust assembly comprises a multi-heater design which allows for independent multi-zone closed-loop temperature control. Another embodiment comprises a compact multi-valve uni-body design incorporating a single heater for simplified closed-loop temperature control. The cold trap incorporates a heater for temperature control at the inlet of the trap to minimize undesirable deposits. One embodiment also comprises a multi-stage cold trap and a particle trap. As a removable unit, this cold trap provides additional safety in the handling and disposal of the adsorbed condensables.
摘要翻译：具有冷阱能力的温度控制排气组件。排气组件的一个实施例包括允许独立的多区域闭环温度控制的多加热器设计。另一个实施例包括紧凑的多阀单体设计，其包括用于简化闭环温度控制的单个加热器。冷阱包含一个加热器，用于在陷阱入口进行温度控制，以尽量减少不必要的沉积物。一个实施例还包括多级冷阱和颗粒捕集器。作为可拆卸单元，该冷阱在吸附的可冷凝物的处理和处理中提供了额外的安全性。

6. 发明授权

US08268734B2 Methods and systems of transferring, docking and processing substrates 有权
标题翻译：转移，对接和处理基材的方法和系统
公开(公告)号：US08268734B2
公开(公告)日：2012-09-18
申请号：US13038309
申请日：2011-03-01
申请人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
发明人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
IPC分类号： H01L21/00
CPC分类号： H01L21/67173 , H01L21/6719 , H01L21/67706 , H01L21/67712 , H01L21/67727 , H01L21/67736 , H01L21/67748 , Y10S414/135
摘要： In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more mobile transverse chambers, the mobile transverse chambers being carried on a rail positioned adjacent to the two or more process modules, and wherein each mobile transverse chamber is configured to maintain a specified gas condition during conveyance of the substrate. One or more drive systems are actuated to propel at least one of the one or more mobile transverse chambers along the rail. The at least one mobile transfer chamber docks to at least one of the process modules, and the substrate is conveyed from the mobile transverse chamber to the at least one process modules.
摘要翻译：根据本文描述的一些实施例，提供了一种用于将衬底转移到两个或更多个工艺模块的方法，包括将至少一个衬底加载到一个或多个移动横向室中，所述移动横向室承载在邻近两个或更多个处理模块，并且其中每个移动横向室被构造成在输送基板期间保持特定的气体状态。一个或多个驱动系统被致动以沿着轨道推进一个或多个移动横向室中的至少一个。所述至少一个移动传送室与所述处理模块中的至少一个对接，并且所述基板从所述移动横向室传送到所述至少一个处理模块。

7. 发明授权

US06517592B2 Cold trap assembly 有权
标题翻译：冷阱装配
公开(公告)号：US06517592B2
公开(公告)日：2003-02-11
申请号：US09740120
申请日：2000-12-19
申请人： Salvador P. Umotoy , Lawrence Chung-Lai Lei , Russell C. Ellwanger , Ronald L. Rose , Joel Huston , James Jin-Long Chen
发明人： Salvador P. Umotoy , Lawrence Chung-Lai Lei , Russell C. Ellwanger , Ronald L. Rose , Joel Huston , James Jin-Long Chen
IPC分类号： B01D4508
CPC分类号： B01D8/00 , C23C16/4412 , Y10S55/15 , Y10S55/30
摘要： A temperature-controlled exhaust assembly with cold trap capability. One embodiment of the exhaust assembly comprises a multi-heater design which allows for independent multi-zone closed-loop temperature control. Another embodiment comprises a compact multi-valve uni-body design incorporating a single heater for simplified closed-loop temperature control. The cold trap incorporates a heater for temperature control at the inlet of the trap to minimize undesirable deposits. One embodiment also comprises a multi-stage cold trap and a particle trap. As a removable unit, this cold trap provides additional safety in the handling and disposal of the adsorbed condensables.
摘要翻译：具有冷阱能力的温度控制排气组件。排气组件的一个实施例包括允许独立的多区域闭环温度控制的多加热器设计。另一个实施例包括紧凑的多阀单体设计，其包括用于简化闭环温度控制的单个加热器。冷阱包含一个加热器，用于在陷阱入口进行温度控制，以尽量减少不必要的沉积物。一个实施例还包括多级冷阱和颗粒捕集器。作为可拆卸单元，该冷阱在吸附的可冷凝物的处理和处理中提供了额外的安全性。

8. 发明授权

US6026762A Apparatus for improved remote microwave plasma source for use with substrate processing systems 失效
标题翻译：用于改进用于衬底处理系统的远程微波等离子体源的装置
公开(公告)号：US6026762A
公开(公告)日：2000-02-22
申请号：US839111
申请日：1997-04-23
申请人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
发明人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
IPC分类号： C23C16/44 , C23C16/452 , C23C16/50 , C23C16/511 , C23C16/52 , H01J37/32 , H01L21/00 , H01L21/205 , H01L21/285 , H01L21/302 , H01L21/3065 , H01L21/31 , C23C16/00
CPC分类号： C23C16/52 , C23C16/4405 , C23C16/452 , H01J37/32192 , H01J37/32357 , H01J37/32862 , H01L21/67028
摘要： An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要翻译：根据具体实施例的用于提供用于有效清洁腔室的远程等离子体的升级CVD系统的装置和方法。使用本发明的升级的CVD系统也可以实现在基板上的蚀刻或沉积层。在具体实施例中，本发明提供了一种用于易于移除，方便处理且相对便宜的鲁棒微波等离子体源的装置，作为对现有CVD设备的改进或可移除的添加。本发明提供了一种改进的CVD装置或改进现有CVD装置，其能够产生用于有效清洁腔室的远程等离子体。

9. 发明授权

US08367565B2 Methods and systems of transferring, docking and processing substrates 有权
标题翻译：转移，对接和处理基材的方法和系统
公开(公告)号：US08367565B2
公开(公告)日：2013-02-05
申请号：US12973736
申请日：2010-12-20
申请人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
发明人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
IPC分类号： H01L21/00
CPC分类号： B05D3/04 , C23C16/44 , H01L21/673 , H01L21/677
摘要： In accordance with some embodiments described herein, a method for transferring a substrate is provided. The method includes loading one or more substrates into a respective mobile chamber of one or more mobile chambers. The mobile chambers are movable on a first rail positioned adjacent to two or more process modules. Each mobile chamber is configured to maintain a specified gas condition. The respective mobile chamber is moved along the first rail. The respective mobile chamber is docked to a respective process module of the two or more process modules. At least one of the one or more substrates is conveyed from the respective mobile chamber to the respective process module.
摘要翻译：根据本文描述的一些实施例，提供了用于转移衬底的方法。该方法包括将一个或多个基底装载到一个或多个移动室的相应移动室中。移动室可在与两个或更多个处理模块相邻定位的第一轨上移动。每个移动室被构造成维持指定的气体状态。相应的移动室沿着第一轨道移动。相应的移动室被对接到两个或更多个处理模块的相应处理模块。一个或多个基板中的至少一个从相应的移动室传送到相应的处理模块。

10. 发明申请

US20110217469A1 Methods and Systems of Transferring, Docking and Processing Substrates 有权
标题翻译：转移，对接和处理基板的方法和系统
公开(公告)号：US20110217469A1
公开(公告)日：2011-09-08
申请号：US12973736
申请日：2010-12-20
申请人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
发明人： Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
IPC分类号： H01L21/677 , H01L21/673 , B05D3/04 , C23C16/44
CPC分类号： B05D3/04 , C23C16/44 , H01L21/673 , H01L21/677
摘要： In accordance with some embodiments described herein, a method for transferring a substrate is provided. The method includes loading one or more substrates into a respective mobile chamber of one or more mobile chambers. The mobile chambers are movable on a first rail positioned adjacent to two or more process modules. Each mobile chamber is configured to maintain a specified gas condition. The respective mobile chamber is moved along the first rail. The respective mobile chamber is docked to a respective process module of the two or more process modules. At least one of the one or more substrates is conveyed from the respective mobile chamber to the respective process module.
摘要翻译：根据本文描述的一些实施例，提供了用于转移衬底的方法。该方法包括将一个或多个基底装载到一个或多个移动室的相应移动室中。移动室可在与两个或更多个处理模块相邻定位的第一轨上移动。每个移动室被构造成维持指定的气体状态。相应的移动室沿着第一轨道移动。相应的移动室被对接到两个或更多个处理模块的相应处理模块。一个或多个基板中的至少一个从相应的移动室传送到相应的处理模块。

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