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1. 发明授权

US6026762A Apparatus for improved remote microwave plasma source for use with substrate processing systems 失效
标题翻译：用于改进用于衬底处理系统的远程微波等离子体源的装置
公开(公告)号：US6026762A
公开(公告)日：2000-02-22
申请号：US839111
申请日：1997-04-23
申请人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
发明人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
IPC分类号： C23C16/44 , C23C16/452 , C23C16/50 , C23C16/511 , C23C16/52 , H01J37/32 , H01L21/00 , H01L21/205 , H01L21/285 , H01L21/302 , H01L21/3065 , H01L21/31 , C23C16/00
CPC分类号： C23C16/52 , C23C16/4405 , C23C16/452 , H01J37/32192 , H01J37/32357 , H01J37/32862 , H01L21/67028
摘要： An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要翻译：根据具体实施例的用于提供用于有效清洁腔室的远程等离子体的升级CVD系统的装置和方法。使用本发明的升级的CVD系统也可以实现在基板上的蚀刻或沉积层。在具体实施例中，本发明提供了一种用于易于移除，方便处理且相对便宜的鲁棒微波等离子体源的装置，作为对现有CVD设备的改进或可移除的添加。本发明提供了一种改进的CVD装置或改进现有CVD装置，其能够产生用于有效清洁腔室的远程等离子体。

2. 发明授权

US06271148B1 Method for improved remote microwave plasma source for use with substrate processing system 失效
标题翻译：用于改善用于衬底处理系统的远程微波等离子体源的方法
公开(公告)号：US06271148B1
公开(公告)日：2001-08-07
申请号：US09416861
申请日：1999-10-13
申请人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
发明人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
IPC分类号： H01L21302
CPC分类号： C23C16/52 , C23C16/4405 , C23C16/452 , H01J37/32192 , H01J37/32357 , H01J37/32862 , H01L21/67028
摘要： An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要翻译：根据具体实施例的用于提供用于有效清洁腔室的远程等离子体的升级CVD系统的装置和方法。使用本发明的升级的CVD系统也可以实现在基板上的蚀刻或沉积层。在具体实施例中，本发明提供了一种用于易于移除，方便处理且相对便宜的鲁棒微波等离子体源的装置，作为对现有CVD设备的改进或可移除的添加。本发明提供了一种改进的CVD装置或改进现有CVD装置，其能够产生用于有效清洁腔室的远程等离子体。

3. 发明申请

US20130098477A1 Apparatus and Method for Providing Uniform Flow of Gas 有权
公开(公告)号：US20130098477A1
公开(公告)日：2013-04-25
申请号：US13653952
申请日：2012-10-17
申请人： Joseph Yudovsky , Mei Chang , Faruk Gungor , Paul F. Ma , David Chu , Chien-Teh Kao , Hyman Lam , Dien-Yeh Wu
发明人： Joseph Yudovsky , Mei Chang , Faruk Gungor , Paul F. Ma , David Chu , Chien-Teh Kao , Hyman Lam , Dien-Yeh Wu
IPC分类号： F17D3/00
CPC分类号： F17D3/00 , Y10T137/7833
摘要： Provided are gas distribution apparatus with a delivery channel having an inlet end, an outlet end and a plurality of apertures spaced along the length. The inlet end is connectable to an inlet gas source and the outlet end is connectible with a vacuum source. Also provided are gas distribution apparatus with spiral delivery channels, intertwined spiral delivery channels, splitting delivery channels, merging delivery channels and shaped delivery channels in which an inlet end and outlet end are configured for rapid exchange of gas within the delivery channels.

4. 发明授权

US06248176B1 Apparatus and method for delivering a gas 有权
标题翻译：用于输送气体的装置和方法
公开(公告)号：US06248176B1
公开(公告)日：2001-06-19
申请号：US09390136
申请日：1999-09-03
申请人： Joseph Yudovsky , Kenneth Tsai , Steve Ghanayem , Semyon Sherstinsky
发明人： Joseph Yudovsky , Kenneth Tsai , Steve Ghanayem , Semyon Sherstinsky
IPC分类号： C23C1600
CPC分类号： H01L21/68735
摘要： A gas delivery method and apparatus for directing a purge gas to the edge of a substrate at an angle to a linear divergence from the center of the substrate. The apparatus directs a purge gas from a supply source over a deflection surface, having one or more grooves angled relative to a linear divergence from the center of the substrate, to the edge of the substrate. Preferably, the gas is delivered to the edge of the substrate at an angle between about 10 and 90 degrees to a linear divergence from the center of the substrate.
摘要翻译：一种气体输送方法和装置，用于将吹扫气体以与衬底中心成直线散度的角度引导到衬底的边缘。该装置将来自供应源的净化气体引导到偏转表面上，该偏转表面具有相对于从基板的中心到基板的边缘的线性发散度成角度的一个或多个槽。优选地，气体以约10至90度之间的角度被输送到衬底的边缘，从而与衬底的中心线性发散。

5. 发明授权

US5985033A Apparatus and method for delivering a gas 失效
标题翻译：用于输送气体的装置和方法
公开(公告)号：US5985033A
公开(公告)日：1999-11-16
申请号：US893769
申请日：1997-07-11
申请人： Joseph Yudovsky , Kenneth Tsai , Steve Ghanayem , Semyon Sherstinsky
发明人： Joseph Yudovsky , Kenneth Tsai , Steve Ghanayem , Semyon Sherstinsky
IPC分类号： H01L21/302 , C23C14/34 , C23C16/448 , H01L21/205 , H01L21/3065 , H01L21/687 , C23C16/00 , C23C14/00
CPC分类号： H01L21/68735
摘要： A gas delivery apparatus for directing a flow of gas at the edge of a substrate at an angle to the radial direction of the substrate. The apparatus directs the gas from a gas orifice, and over a plurality of grooves that are angled relative to the radial direction of the substrate. Preferably, the resultant flow of gas flows at an angle of between 10 and 90 degrees relative to the radial direction of the substrate.
摘要翻译：一种气体输送装置，用于在衬底的边缘处以与衬底的径向方向成一定角度引导气体流。该装置引导来自气体孔口的气体以及相对于基板的径向成角度的多个凹槽。优选地，所产生的气体流相对于衬底的径向方向以10度和90度之间的角度流动。

6. 发明授权

US06374508B1 Apparatus and method for aligning a substrate on a support member 失效
标题翻译：用于将衬底对准支撑构件的装置和方法
公开(公告)号：US06374508B1
公开(公告)日：2002-04-23
申请号：US09507571
申请日：2000-02-18
申请人： Joseph Yudovsky , Kenneth Tsai , Ilya Perlov , Eugene Gantvarg
发明人： Joseph Yudovsky , Kenneth Tsai , Ilya Perlov , Eugene Gantvarg
IPC分类号： B65G4907
CPC分类号： C23C16/4583 , H01L21/68 , Y10S269/903 , Y10S414/135
摘要： A method and arrangement for lifting lowering and centering a substrate on a surface employs lift pins have conical tips. A capture range is provided by the conical tips to capture and center misaligned wafers. One or more of the pins are inclined in certain embodiments to enhance the alignment capability of the lift pins. The inclined lift pins, when retracting into a support member at an angle, move a supported substrate horizontally into proper alignment.
摘要翻译：用于提升在基体表面上降低定心的方法和装置采用提升销具有圆锥形尖端。捕获范围由锥形尖端提供，以捕获和对准未对准的晶片。一些或多个销在某些实施例中倾斜以增强提升销的对准能力。倾斜的提升销在以一定角度收回到支撑构件中时，将支撑的基板水平地移动到适当的对准位置。

7. 发明授权

US06328808B1 Apparatus and method for aligning and controlling edge deposition on a substrate 失效
标题翻译：用于对准和控制衬底上的边缘沉积的装置和方法
公开(公告)号：US06328808B1
公开(公告)日：2001-12-11
申请号：US09543393
申请日：2000-04-05
申请人： Kenneth Tsai , Joseph Yudovsky , Steve Ghanayem , Ken K. Lai , Patricia Liu , Toshiyuki Nakagawa , Maitreyee Mahajani
发明人： Kenneth Tsai , Joseph Yudovsky , Steve Ghanayem , Ken K. Lai , Patricia Liu , Toshiyuki Nakagawa , Maitreyee Mahajani
IPC分类号： C23C1600
CPC分类号： C23C16/45521 , C23C16/4585
摘要： An alignment mechanism for aligning a substrate on a support member in a process chamber includes a set of guide pins extending from the upper surface of the support member equally spaced about the periphery thereof and spaced to receive a substrate therebetween and align a shadow ring thereover. The inner surfaces of the guide pins are slanted outwardly to form an inverted funnel for receiving and aligning the substrate on the support member. An annular gas groove in the upper surface of the support member provides communication for a supply of purge gas and directs the gas about the peripheral edge of the substrate. The guide pins which extend partially over the gas groove include slots therein that provide fluid communication through the guide pins from the gas groove to the peripheral edge of the substrate. The guide pins also mate with alignment bores formed in the shadow ring so that, as the support member moves into the processing position, the inner surfaces of the guide pins abut abutment surfaces in the alignment bores and align the shadow ring on the support member and over the substrate. A hanger member supports and aligns the shadow ring between processing of each substrate.
摘要翻译：用于使处理室中的支撑构件上的基板对准的对准机构包括一组引导销，其从支撑构件的上表面延伸，围绕其周边等间隔开并间隔开，以在其间对准阴影环。引导销的内表面向外倾斜以形成用于接收和对准支撑构件上的基板的倒置漏斗。在支撑构件的上表面中的环形气体沟槽提供用于供应吹扫气体的连通并且引导围绕衬底的周边边缘的气体。在气槽上部分延伸的引导销包括其中的槽，其通过引导销从气槽到衬底的周缘提供流体连通。引导销还与形成在阴影环中的对准孔配合，使得当支撑构件移动到处理位置时，引导销的内表面邻接对准孔中的邻接表面并将阴影环对准支撑构件和在基板上。衣架构件在每个基底的处理之间支撑和对准阴影环。

8. 发明授权

US6146463A Apparatus and method for aligning a substrate on a support member 失效
公开(公告)号：US6146463A
公开(公告)日：2000-11-14
申请号：US97006
申请日：1998-06-12
申请人： Joseph Yudovsky , Kenneth Tsai , Ilya Perlov , Eugene Gantvarg
发明人： Joseph Yudovsky , Kenneth Tsai , Ilya Perlov , Eugene Gantvarg
IPC分类号： C23C16/458 , H01L21/68 , C23C16/00
CPC分类号： C23C16/4583 , H01L21/68 , Y10S269/903 , Y10S414/135
摘要： A method and arrangement for lifting lowering and centering a substrate on a surface employs lift pins have conical tips. A capture range is provided by the conical tips to capture and center misaligned wafers. One or more of the pins are inclined in certain embodiments to enhance the alignment capability of the lift pins. The inclined lift pins, when retracting into a support member at an angle, move a supported substrate horizontally into proper alignment.

9. 发明授权

US06186092B1 Apparatus and method for aligning and controlling edge deposition on a substrate 失效
公开(公告)号：US06186092B1
公开(公告)日：2001-02-13
申请号：US08914522
申请日：1997-08-19
申请人： Kenneth Tsai , Joseph Yudovsky , Steve Ghanayem , Ken K. Lai , Patricia Liu , Toshiyuki Nakagawa , Maitreyee Mahajani
发明人： Kenneth Tsai , Joseph Yudovsky , Steve Ghanayem , Ken K. Lai , Patricia Liu , Toshiyuki Nakagawa , Maitreyee Mahajani
IPC分类号： C23C1600
CPC分类号： C23C16/45521 , C23C16/4585
摘要： An alignment mechanism for aligning a substrate on a support member in a process chamber includes a set of guide pins extending from the upper surface of the support member equally spaced about the periphery thereof and spaced to receive a substrate therebetween and align a shadow ring thereover. The inner surfaces of the guide pins are slanted outwardly to form an inverted funnel for receiving and aligning the substrate on the support member. An annular gas groove in the upper surface of the support member provides communication for a supply of purge gas and directs the gas about the peripheral edge of the substrate. The guide pins which extend partially over the gas groove include slots therein that provide fluid communication through the guide pins from the gas groove to the peripheral edge of the substrate. The guide pins also mate with alignment bores formed in the shadow ring so that, as the support member moves into the processing position, the inner surfaces of the guide pins abut abutment surfaces in the alignment bores and align the shadow ring on the support member and over the substrate. A hanger member supports and aligns the shadow ring between processing of each substrate.

10. 发明申请

US20160027675A1 Position And Temperature Monitoring Of ALD Platen Susceptor 审中-公开
标题翻译： ALD台板受体的位置和温度监测
公开(公告)号：US20160027675A1
公开(公告)日：2016-01-28
申请号：US14774377
申请日：2014-03-14
申请人： Abraham RAVID , Kevin GRIFFIN , Joseph YUDOVSKY , Kaushal GANGAKHEDKAR , Dmitry A. DZILNO , Alex MINKOVICH
发明人： Abraham Ravid , Kevin Griffin , Joseph Yudovsky , Kaushal Gangakhedkar , Dmitry A. Dzilno , Alex Minkovich
IPC分类号： H01L21/67 , C23C16/458 , C23C16/52 , H01L21/687 , C23C16/455
CPC分类号： H01L21/67259 , C23C16/45544 , C23C16/4584 , C23C16/52 , H01L21/67248 , H01L21/68764 , H01L21/68771
摘要： Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
摘要翻译：描述了测量和控制基座组件和气体分配组件之间的间隙的装置和方法。还描述了用于晶片转印目的的位置控制和温度控制的装置和方法。

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