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1. 发明专利

JP2007164787A Memory system 有权
标题翻译：记忆系统
公开(公告)号：JP2007164787A
公开(公告)日：2007-06-28
申请号：JP2006331050
申请日：2006-12-07
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： LEE JAE-JUN , CHOI JOO-SUN , KIM KYU-HYOUN , PARK KWANG-SOO
IPC分类号： G06F12/00 , G06F12/06 , G06F13/16
CPC分类号： G11C5/066 , G11C5/02
摘要： PROBLEM TO BE SOLVED: To provide point-to-point link between memory devices. SOLUTION: This memory system has first and second primary memories and first and second auxiliary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second auxiliary memories. A first connection element, like a connector or a soldered, one connects at least one of the other first and second primary and first and second auxiliary memories to a mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供存储器件之间的点对点链接。解决方案：该存储器系统具有第一和第二主存储器以及分别耦合到第一和第二主存储器的第一和第二辅助存储器，耦合器包括至少一个点到点连接。存储器模块包括第一和第二主要和第一和第二辅助存储器中的至少两个。诸如连接器或焊接的第一连接元件将第一和第二主要和第一和第二辅助存储器中的至少一个连接到母板。第一存储器模块上的至少一个存储器耦合到至少一个其他存储器。存储器系统还包括存储器控制器，该存储器控制器通过点对二点链接连接到主存储器。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2011060293A Memory apparatus capable of selectively applying different types of connectors 有权
标题翻译：可选择适用不同类型连接器的记忆装置
公开(公告)号：JP2011060293A
公开(公告)日：2011-03-24
申请号：JP2010205964
申请日：2010-09-14
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： PARK KWANG-SOO , KIM KYUNG-SUK
IPC分类号： G06F1/18
CPC分类号： G06F1/16 , H05K1/0239 , H05K1/0245 , H05K1/025 , H05K1/0295 , H05K1/117 , H05K1/181 , H05K2201/0949 , H05K2201/10015 , H05K2201/10159 , H05K2201/10189 , H05K2201/10689 , H05K2203/1572
摘要： PROBLEM TO BE SOLVED: To provide a memory apparatus capable of selectively applying different types of connectors, using a single printed circuit board and improving signal characteristics at high-speed operations.
SOLUTION: The memory apparatus includes a printed circuit board for memory apparatus having a controller; first and second connector pads arranged in the printed circuit board; a first passive device pad arranged between the controller and a first connector; a second passive device pad arranged between the controller and a second connector; and a passive device, coupled either to only the first passive device pad or the second passive device pad. When the first connector pads and the second connector pads are disposed asymmetrically on top and bottom surfaces of the printed circuit board, the first and second passive device pads are formed midway between the first connector pads and the second connector pads, preferably being asymmetric and being able to improve signal characteristics.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够选择性地应用不同类型的连接器，使用单个印刷电路板并且在高速操作时改善信号特性的存储装置。存储装置包括：具有控制器的存储装置的印刷电路板; 布置在印刷电路板中的第一和第二连接器焊盘; 布置在控制器和第一连接器之间的第一无源器件焊盘; 布置在控制器和第二连接器之间的第二无源器件焊盘; 以及被耦合到只有第一无源器件焊盘或第二无源器件焊盘的无源器件。当第一连接器焊盘和第二连接器焊盘不对称地布置在印刷电路板的顶表面和底表面上时，第一和第二无源器件焊盘形成在第一连接器焊盘和第二连接器焊盘之间的中间，优选地是不对称的，并且是能够改善信号特性。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2007183941A Memory system capable of changing configuration of memory module 有权
标题翻译：可更改存储器模块配置的存储器系统
公开(公告)号：JP2007183941A
公开(公告)日：2007-07-19
申请号：JP2006348010
申请日：2006-12-25
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： RI SAISHUN , KIM JONG-HOON , PARK KWANG-SOO
IPC分类号： G06F12/00 , G06F12/06
CPC分类号： G06F13/1694
摘要： PROBLEM TO BE SOLVED: To provide a memory system capable of changing a configuration of a memory module.
SOLUTION: This memory system is provided with first, second, and third connectors arranged on a system board and a memory controller connected to a pin in the third connector via a channel. The third connector is provided with a pin connected to a pin in the first connector via the channel and a pin connected to a pin in the second connector via the channel. When the memory system has a first memory capacity, a dummy module is arranged in each of the first and second connectors. When the first memory module is mounted on the third connector, the dummy module and the first memory module are connected to the memory controller. When the memory system has a second memory capacity higher than the first memory capacity, the second memory modules are connected to the memory controller by installing the second memory modules in the first connector and the second connector alone.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够改变存储器模块的配置的存储器系统。解决方案：该存储器系统设置有布置在系统板上的第一，第二和第三连接器以及经由通道连接到第三连接器中的引脚的存储器控制器。第三连接器设置有经由通道连接到第一连接器中的引脚的引脚和经由通道连接到第二连接器中的引脚的引脚。当存储器系统具有第一存储器容量时，在第一和第二连接器的每一个中布置虚拟模块。当第一存储器模块安装在第三连接器上时，虚拟模块和第一存储器模块连接到存储器控制器。当存储器系统具有高于第一存储器容量的第二存储器容量时，通过将第二存储器模块安装在第一连接器和第二连接器中来将第二存储器模块连接到存储器控制器。版权所有（C）2007，JPO＆INPIT

4. 发明专利

DE102006062578B4 Speichersystem 未知
公开(公告)号：DE102006062578B4
公开(公告)日：2016-07-21
申请号：DE102006062578
申请日：2006-12-29
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-JUN , KIM JONG-HOON , PARK KWANG-SOO
IPC分类号： G11C5/06 , G06F13/16
摘要： Speichersystem (100) umfassend: – einen ersten, einen zweiten und einen dritten Konnektor (110, 120, 130), die auf einer Systemplatine angeordnet sind, wobei der dritte Konnektor (130) Anschlüsse (P3) umfasst, die mit Anschlüssen (P1, P2) des ersten und des zweiten Konnektors (110, 120) über Kanäle verbunden sind, und eine Speichersteuereinheit (140), der über Kanäle mit den Anschlüssen (P3) des dritten Konnektors (130) verbunden ist, – wobei das Speichersystem (100), wenn es mit einer ersten Speicherkapazität konfiguriert ist, Dummy-Speichermodule (160) und ein erstes Speichermodul (150) umfasst, die durch Installieren der Dummy-Speichermodule (160) in den ersten und den zweiten Konnektor (110, 120) und durch Installieren des ersten Speichermoduls (150) in den dritten Konnektor (130) mit der Speichersteuereinheit (140) verbunden sind, und – wobei das Speichersystem (100), wenn es alternativ mit einer zweiten Speicherkapazität konfiguriert ist, die größer als die erste Speicherkapazität ist, zweite Speichermodule (170) umfasst, die durch Installieren der zweiten Speichermodule (170) nur in den ersten und den zweiten Konnektor (110, 120) mit der Speichersteuereinheit (140) verbunden sind.

5. 发明专利

DE102006059396A1 Memory system couples memory on memory module to one of the other primary and secondary memories through point-to-point link 未知
公开(公告)号：DE102006059396A1
公开(公告)日：2007-06-28
申请号：DE102006059396
申请日：2006-12-08
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-JUN , CHOI JOO-SUN , KIM KYU-HYOUN , PARK KWANG-SOO
IPC分类号： G11C5/06 , G11C5/02
摘要： The primary memories (116,122) and secondary memories (118,124) are coupled through a point-to-point link. A memory module (114) has two of the primary and secondary memories. A connection element connects the memory module to a mother board. Another connection module connects one of the other primary and secondary memories to the mother board. The memory on the memory module is coupled to one of the other memories. The connector element carries command/address (CA) signals and data signals.

6. 发明专利

DE102006062578A1 未知
公开(公告)号：DE102006062578A1
公开(公告)日：2007-07-26
申请号：DE102006062578
申请日：2006-12-29
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-JUN , KIM JONG-HOON , PARK KWANG-SOO
IPC分类号： G11C5/06
摘要： A memory system is disclosed with first, second, and third connectors located on a system board, the third connector including pins connected to the pins of the first and second connectors through channels, and a memory controller connected to the pins of the third connector through channels. The memory system, as configured in a first memory capacity, comprises; dummy memory modules and a first memory module connected to the memory controller by installing the dummy memory modules in the first and second connectors and installing the first memory module in the third connector. The memory system, as alternately configured in a second memory capacity larger than the first memory capacity, comprises second memory modules connected to the memory controller by installing the second memory modules in only the first and second connectors.

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