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    • 5. 发明授权
    • Vertical trench-formed dual-gate FET device structure and method for creation
    • 垂直沟槽形双栅FET器件结构及其制作方法
    • US06406962B1
    • 2002-06-18
    • US09761931
    • 2001-01-17
    • Paul D. AgnelloArne W. BallantineRamachandra DivakaruniErin C. JonesEdward J. NowakJed H. Rankin
    • Paul D. AgnelloArne W. BallantineRamachandra DivakaruniErin C. JonesEdward J. NowakJed H. Rankin
    • H01L21336
    • H01L29/78648H01L21/84H01L27/1203H01L29/42384H01L29/78642
    • The present invention relates to an apparatus and method of forming one or more FETs having a vertical trench-formed double-gate, with a plurality of nitride layers having oxide marker etch-stop layers provided periodically there-through, thereby adapting the FETs to have a plurality of selectable gate lengths. The present invention provides for control and formation of gate lengths scaled down to about 5 nm to about 100 nm, preferably from about 5 nm to about 50 nm. The plurality of pad nitride layers with the oxide etch-stop layers provide for the present FET to be connected to a plurality of contacts having a variety of connection depths corresponding to the gate lengths used, by etching a plurality of via in the pad nitride layers whereby such vias stop at selected ones of the etch-stop layers to provide vias adapted to connect with the selected ones of such contacts. Additional gate material may be deposited over a top surface of the selected plurality of nitride layers to allow for contacts to the gate electrodes of any given FET.
    • 本发明涉及一种形成具有垂直沟槽形成的双栅极的一个或多个FET的装置和方法,其中多个氮化物层具有周期性地设置在其上的氧化物标记蚀刻停止层,从而使FET具有 多个可选择的栅极长度。 本发明提供控制和形成尺寸缩小到约5nm至约100nm,优选约5nm至约50nm的栅极长度。 具有氧化物蚀刻停止层的多个衬垫氮化物层通过蚀刻衬垫氮化物层中的多个通孔来提供本FET连接到具有对应于所使用的栅极长度的各种连接深度的多个触点 由此这些通孔在选定的蚀刻停止层处停止以提供适于与所选择的这些触点连接的通孔。 附加的栅极材料可以沉积在所选择的多个氮化物层的顶表面上,以允许与任何给定FET的栅电极的接触。