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1. 发明授权

US5114518A Method of making multilayer circuit boards having conformal Insulating layers 失效
标题翻译：制造具有保形绝缘层的多层电路板的方法
公开(公告)号：US5114518A
公开(公告)日：1992-05-19
申请号：US463222
申请日：1990-01-10
申请人： Joseph G. Hoffarth , Donald J. Lazzarini , John A. Welsh , John P. Wiley
发明人： Joseph G. Hoffarth , Donald J. Lazzarini , John A. Welsh , John P. Wiley
IPC分类号： H05K1/00 , H05K3/46
CPC分类号： H05K3/4626 , H05K3/4676 , H05K2201/0154 , H05K2201/0195 , H05K2203/066 , Y10T156/1028
摘要： A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.
摘要翻译：公开了一种具有将电路芯与相邻绝缘层分离的绝缘材料的共形层的多层电路板。保形层将电路线的衬底和导电图案封装在电路芯中，从而减少在层压期间被杂质捕获的故障。多层电路板通过在将电路芯最终层压成多层电路板之前，用绝缘材料的保形层涂覆至少一个电路芯。

2. 发明授权

US4918574A Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities 失效
标题翻译：多层电路板由于被杂质杂质引起的短路易损性降低
公开(公告)号：US4918574A
公开(公告)日：1990-04-17
申请号：US183491
申请日：1988-04-15
申请人： Joseph G. Hoffarth , Donald J. Lazzarini , John A. Welsh , John P. Wiley
发明人： Joseph G. Hoffarth , Donald J. Lazzarini , John A. Welsh , John P. Wiley
IPC分类号： H05K1/00 , H05K3/46
CPC分类号： H05K3/4626 , H05K3/4676 , H05K2201/0154 , H05K2201/0195 , H05K2203/066
摘要： A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.
摘要翻译：公开了一种具有将电路芯与相邻绝缘层分离的绝缘材料的共形层的多层电路板。保形层将电路线的衬底和导电图案封装在电路芯中，从而减少在层压期间被杂质捕获的故障。多层电路板通过在将电路芯最终层压成多层电路板之前，用绝缘材料的保形层涂覆至少一个电路芯。

3. 发明授权

US4864722A Low dielectric printed circuit boards 失效
标题翻译：低介电印刷电路板
公开(公告)号：US4864722A
公开(公告)日：1989-09-12
申请号：US168928
申请日：1988-03-16
申请人： Donald J. Lazzarini , John P. Wiley , Robert T. Wiley
发明人： Donald J. Lazzarini , John P. Wiley , Robert T. Wiley
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/024 , H05K3/4623 , H05K2201/015 , H05K2201/09536 , H05K2203/061 , Y10T29/49126
摘要： The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.

4. 发明授权

US5346117A Method of fabricating a parallel processor package 失效
标题翻译：制造并行处理器封装的方法
公开(公告)号：US5346117A
公开(公告)日：1994-09-13
申请号：US97604
申请日：1993-07-27
申请人： Harold Kohn , Donald J. Lazzarini
发明人： Harold Kohn , Donald J. Lazzarini
IPC分类号： G06F13/40 , H05K1/00 , H05K3/00 , H05K3/32 , H05K3/40 , H05K3/46 , H05K3/36
CPC分类号： H05K3/4635 , G06F13/409 , H05K3/462 , H05K1/0393 , H05K2201/0305 , H05K2201/0373 , H05K2201/09536 , H05K2201/09572 , H05K2201/096 , H05K2201/10159 , H05K3/328 , H05K3/4038 , H05K3/4623 , H05K3/4626 , H05K3/4641 , Y10T29/49126
摘要： Disclosed is a method for manufacturing a stacked circuitized flex structure. The structure is a laminate for Z-axis communication within a parallel processor. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. Z-axis circuitization is carried out by providing vias and through holes in individual circuitized flex strips. These vias and through holes are circuited and plated. This is followed by filling the vias and through holes with solder and forming solder bumps at the tops and bottoms of the vias and through holes. A sticker sheet with clearance holes for the solder bumps is provided, and a plurality of the circuitized flex strips are laid up for lamination to form a stack of circuitized flexible strips. Lamination is carried out at elevated pressure and temperature to crush the solder bumps, bond, and homogenize solder bump material and fuse the sticker sheets. Next, the stack is cooled to solidify the homogenized solder bump material.
摘要翻译：公开了一种用于制造堆叠电路化柔性结构的方法。该结构是在并行处理器内用于Z轴通信的层压板。该层压部分为处理器间，存储器间，处理器间/存储器元件以及处理器到存储器总线互连和通信提供XY平面和Z轴互连。通过在单独的电路化柔性条中设置通孔和通孔来进行Z轴电路化。这些通孔和通孔被循环和电镀。然后在通孔和通孔的顶部和底部填充通孔和通孔用焊料和形成焊料凸块。提供了具有用于焊料凸块的间隙孔的贴纸，并且堆叠多个电路化的柔性条以层压以形成电路化的柔性条的堆叠。层压在升高的压力和温度下进行，以粉碎焊料凸块，粘合和均质焊料凸块材料并熔合贴纸。接下来，将堆叠冷却以固化均质化的焊料凸块材料。

5. 发明授权

US4000016A Water soluble fluxes 失效
标题翻译：水溶性助焊剂
公开(公告)号：US4000016A
公开(公告)日：1976-12-28
申请号：US527972
申请日：1974-11-29
申请人： Donald J. Lazzarini , Frank H. Sarnacki
发明人： Donald J. Lazzarini , Frank H. Sarnacki
IPC分类号： B23K35/363 , B23K35/36 , B23K35/34
CPC分类号： B23K35/3612
摘要： Water soluble fluxing bath compositions have particular value in immersion soldering of metallic surfaces and electrical connections in that they are characterized by good thermal and chemical stability and easy removal of flux residues without corrosion or insulation resistance hazards. The compositions comprise from about 2 to 8 percent by weight of chelating agents or salts dissolved in a solvent, such as glycerol. In some instances from about 0.1 to 1.0 percent of an inorganic acid, such as hydrochloric acid may be added.
摘要翻译：水溶性助熔浴组合物在金属表面和电连接的浸入焊接中具有特殊的价值，因为它们的特征在于具有良好的热和化学稳定性，并且易于除去焊剂残留物而没有腐蚀或绝缘电阻危害。组合物包含约2至8重量％的螯合剂或溶解在溶剂如甘油中的盐。在一些情况下，可以加入约0.1至1.0％的无机酸，例如盐酸。

6. 发明授权

US4292230A Screen-printing composition and use thereof 失效
标题翻译：丝网印刷组合物及其用途
公开(公告)号：US4292230A
公开(公告)日：1981-09-29
申请号：US946008
申请日：1978-09-27
申请人： Eugene J. Kenney , Donald J. Lazzarini , Robert J. Winters
发明人： Eugene J. Kenney , Donald J. Lazzarini , Robert J. Winters
IPC分类号： B23K35/22 , H05K3/28 , C08K3/36
CPC分类号： B23K35/224 , H05K3/285 , H05K2201/0166 , H05K2201/0209 , Y10T428/31511
摘要： Screen-printing composition containing an epoxy novolac, a phenoxy polymer, a liquid anhydride, colloidal silica, and a diluent. The composition is useful for coating substrates such as printed circuits and serves as a solder mask.
摘要翻译：含有环氧酚醛清漆，苯氧基聚合物，液体酸酐，胶体二氧化硅和稀释剂的丝网印刷组合物。该组合物可用于涂布诸如印刷电路的基材并用作焊接掩模。

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