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1. 发明授权

US06831736B2 Method of and apparatus for line alignment to compensate for static and dynamic inaccuracies in scanning 有权
标题翻译：用于线对齐的方法和装置，以补偿扫描中的静态和动态不准确
公开(公告)号：US06831736B2
公开(公告)日：2004-12-14
申请号：US10266823
申请日：2002-10-07
申请人： Rami Elichai , Gilad Schwartz , Ron Naftali , Pavel Margulis , Igor Slobodnik
发明人： Rami Elichai , Gilad Schwartz , Ron Naftali , Pavel Margulis , Igor Slobodnik
IPC分类号： G01N2100
CPC分类号： G01N21/956
摘要： In a method and apparatus for compensating for static and dynamic inaccuracies in an optical scanner used in a typical surface inspection system, the scanner may have a scanning axis and a cross-scanning axis. A surface of an inspection article is scanned along a scanning axis and a scanning axis signal is output at predetermined distances along this axis. The scanning axis signal may be used to determine a speed of relative movement between the scanner and the inspection article. A jitter signal may be output whenever the scanner deviates from the scanning axis, and this signal may be used to calculate the amount of deviation. Information, such as the speed of relative movement, scan line resolution, and a scanning axis static position error may be used to generate a scan line. A generated scan line may be shifted to compensate for a cross-scanning axis error. Utilizing this method, a scan line is generated that compensates for various scanner positioning errors, including the cross-axis and scanning axis static position errors, the scanning axis dynamic position error, and the cross-scanning axis jitter error.
摘要翻译：在用于补偿在典型表面检查系统中使用的光学扫描仪中的静态和动态不准确度的方法和装置中，扫描器可以具有扫描轴和横扫描轴。沿着扫描轴扫描检查物品的表面，沿着该轴以预定的距离输出扫描轴信号。扫描轴信号可以用于确定扫描仪和检查制品之间的相对移动速度。每当扫描仪偏离扫描轴时，抖动信号可能会被输出，该信号可用于计算偏差量。可以使用诸如相对移动速度，扫描线分辨率和扫描轴静态位置误差的信息来生成扫描线。生成的扫描线可以移动以补偿横扫轴的误差。利用该方法，生成扫描线，补偿各种扫描器定位误差，包括横轴和扫描轴静态位置误差，扫描轴动态位置误差和横扫轴抖动误差。

2. 发明授权

US07847929B2 Methods and apparatus for inspecting a plurality of dies 有权
标题翻译：用于检查多个管芯的方法和装置
公开(公告)号：US07847929B2
公开(公告)日：2010-12-07
申请号：US11466583
申请日：2006-08-23
申请人： Tuvia Dror Kutscher , Zvi Goren , Efrat Rozenman , Rami Elichai
发明人： Tuvia Dror Kutscher , Zvi Goren , Efrat Rozenman , Rami Elichai
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/55
摘要： A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.
摘要翻译：一种用于检查通常设置在半导体晶片的表面上的多个管芯的方法。每个模具包括模具内的各自的功能特征。该方法包括在第一裸片内识别具有各自特征的第一多个功能特征，以及相对于第一裸片的原点测量第一多重性的相应第一位置。在一组第二模具内，识别具有相应特征的功能特征的第二多重性，测量第二多重性的相应第二位置。将第二位置与第一位置进行比较，以确定第二模具组的原点的位置。

3. 发明申请

US20080259326A1 Die Column Registration 有权
标题翻译：死柱注册
公开(公告)号：US20080259326A1
公开(公告)日：2008-10-23
申请号：US11466583
申请日：2006-08-23
申请人： Tuvia Dror Kutscher , Zvi Goren , Efrat Rozenman , Rami Elichai
发明人： Tuvia Dror Kutscher , Zvi Goren , Efrat Rozenman , Rami Elichai
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/55
摘要： A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.
摘要翻译：一种用于检查通常设置在半导体晶片的表面上的多个管芯的方法。每个模具包括模具内的各自的功能特征。该方法包括在第一裸片内识别具有各自特征的第一多个功能特征，以及相对于第一裸片的原点测量第一多重性的相应第一位置。在一组第二模具内，识别具有相应特征的功能特征的第二多重性，测量第二多重性的相应第二位置。将第二位置与第一位置进行比较，以确定第二模具组的原点的位置。

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