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    • 1. 发明申请
    • SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION
    • 系统,基于CAD的注册的方法和计算机程序产品
    • US20130204569A1
    • 2013-08-08
    • US13368305
    • 2012-02-07
    • Zvi GorenNir Ben-David Dodzin
    • Zvi GorenNir Ben-David Dodzin
    • G06F19/00
    • G01N21/9501G01N2021/95615
    • A system for generating calibration information usable for wafer inspection, the system including: (I) a displacement analysis module, configured to: (a) calculate a displacement for each target out of multiple targets selected in multiple scanned frames which are included in a scanned area of the wafer, the calculating based on a correlation of: (i) an image associated with the respective target which was obtained during a scanning of the wafer, and (ii) design data corresponding to the image; and (b) determining a displacement for each of the multiple scanned frames, the determining based on the displacements calculated for multiple targets in the respective scanned frame; and (II) a subsequent processing module, configured to generate calibration information including the displacements determined for the multiple scanned frames, and a target database that includes target image and location information of each target of a group of database targets.
    • 一种用于生成可用于晶片检查的校准信息的系统,所述系统包括:(I)位移分析模块,其被配置为:(a)计算在扫描的多个扫描帧中选择的多个目标中的每个目标的位移, 基于以下相关性的计算:(i)在晶片的扫描期间获得的与各个目标相关联的图像,以及(ii)与图像对应的设计数据; 以及(b)确定所述多个扫描帧中的每一个的位移,所述确定基于针对相应扫描帧中的多个目标计算的位移; 以及(II)后续处理模块,被配置为生成包括为多个扫描帧确定的位移的校准信息,以及包括目标图像的目标数据库和一组数据库目标的每个目标的位置信息。
    • 2. 发明授权
    • Methods and apparatus for inspecting a plurality of dies
    • 用于检查多个管芯的方法和装置
    • US07847929B2
    • 2010-12-07
    • US11466583
    • 2006-08-23
    • Tuvia Dror KutscherZvi GorenEfrat RozenmanRami Elichai
    • Tuvia Dror KutscherZvi GorenEfrat RozenmanRami Elichai
    • G01N21/00
    • G01N21/9501G01N21/4738G01N21/55
    • A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.
    • 一种用于检查通常设置在半导体晶片的表面上的多个管芯的方法。 每个模具包括模具内的各自的功能特征。 该方法包括在第一裸片内识别具有各自特征的第一多个功能特征,以及相对于第一裸片的原点测量第一多重性的相应第一位置。 在一组第二模具内,识别具有相应特征的功能特征的第二多重性,测量第二多重性的相应第二位置。 将第二位置与第一位置进行比较,以确定第二模具组的原点的位置。
    • 4. 发明申请
    • Die Column Registration
    • 死柱注册
    • US20080259326A1
    • 2008-10-23
    • US11466583
    • 2006-08-23
    • Tuvia Dror KutscherZvi GorenEfrat RozenmanRami Elichai
    • Tuvia Dror KutscherZvi GorenEfrat RozenmanRami Elichai
    • G01N21/88
    • G01N21/9501G01N21/4738G01N21/55
    • A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.
    • 一种用于检查通常设置在半导体晶片的表面上的多个管芯的方法。 每个模具包括模具内的各自的功能特征。 该方法包括在第一裸片内识别具有各自特征的第一多个功能特征,以及相对于第一裸片的原点测量第一多重性的相应第一位置。 在一组第二模具内,识别具有相应特征的功能特征的第二多重性,测量第二多重性的相应第二位置。 将第二位置与第一位置进行比较,以确定第二模具组的原点的位置。
    • 10. 发明申请
    • METHOD OF DESIGN-BASED DEFECT CLASSIFICATION AND SYSTEM THEREOF
    • 基于设计的缺陷分类方法及其系统
    • US20140212022A1
    • 2014-07-31
    • US13756462
    • 2013-01-31
    • MARK GESHELZVI GORENEFRAT ROZENMAN
    • MARK GESHELZVI GORENEFRAT ROZENMAN
    • G06T7/00
    • G06T7/0004G01R31/26G01R31/2894G06T7/0006G06T7/001G06T2207/30148H01L22/12
    • There is provided an inspection method capable of classifying defects detected on a production layer of a specimen. The method comprises: obtaining input data related to the detected defects; processing the input data using a decision algorithm associated with the production layer and specifying two or more classification operations and a sequence thereof; and sorting the processed defects in accordance with predefined bins, wherein each bin is associated with at least one classification operation, wherein at least one classification operation sorts at least part of the processed defects to one or more classification bins to yield finally classified defects, and wherein each classification operation, excluding the last one, sorts at least part of the processed defects to be processed by one or more of the following classification operations.
    • 提供了能够对在样品的生产层上检测到的缺陷进行分类的检查方法。 该方法包括:获取与检测到的缺陷相关的输入数据; 使用与生产层相关联的决策算法处理输入数据并指定两个或更多个分类操作及其序列; 以及根据预定义的箱分类处理的缺陷,其中每个仓与至少一个分类操作相关联,其中至少一个分类操作将至少部分经处理的缺陷排序到一个或多个分类箱以产生最终分类的缺陷,以及 其中除了最后一个之外的每个分类操作通过以下分类操作中的一个或多个对待处理的缺陷的至少一部分进行排序。