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    • 1. 发明申请
    • CANARY DEVICE FOR FAILURE ANALYSIS
    • 用于故障分析的CANARY设备
    • US20060195285A1
    • 2006-08-31
    • US10906590
    • 2005-02-25
    • Pierre BouchardMark HakeyMark MastersLeah PastelJames SlinkmanDavid Vallett
    • Pierre BouchardMark HakeyMark MastersLeah PastelJames SlinkmanDavid Vallett
    • G06F19/00
    • G01R31/2856G01R31/2831G01R31/318511G01R31/3187
    • A diagnostic system and method for testing an integrated circuit (IC) during fabrication thereof, wherein the diagnostic system comprises at least one IC chip comprising an electrical signature; a sacrificial circuit adjacent to the IC chip and comprising a known electrical signature and intentionally mis-designed circuitry; and a comparator adapted to compare the electrical signature of the IC chip with the known electrical signature of the sacrificial circuit, wherein a match in the electrical signature of the IC chip with the known electrical signature of the sacrificial circuit indicates that the IC chip is mis-designed. The diagnostic system further comprises a semiconductor wafer comprising a plurality of IC chips and a kerf area separating one IC chip from another IC chip. The sacrificial circuit is located in the kerf area or alternatively on each of the plurality of IC chips. A mis-designed IC chip comprises abnormally functioning circuitry.
    • 一种用于在其制造期间测试集成电路(IC)的诊断系统和方法,其中所述诊断系统包括至少一个包括电特征的IC芯片; 邻近于IC芯片的牺牲电路,包括已知的电气签名和故意错误设计的电路; 以及比较器,用于将IC芯片的电气签名与牺牲电路的已知电气签名进行比较,其中IC芯片的电子签名与牺牲电路的已知电气签名的匹配表明IC芯片是错误的 设计。 诊断系统还包括半导体晶片,其包括多个IC芯片和将IC芯片与另一IC芯片分开的切口区域。 牺牲电路位于切口区域中,或者替代地位于多个IC芯片中的每一个上。 错误设计的IC芯片包括异常功能的电路。
    • 5. 发明申请
    • SENSOR DIFFERENTIATED FAULT ISOLATION
    • 传感器差异故障分离
    • US20060232284A1
    • 2006-10-19
    • US10907787
    • 2005-04-15
    • Kevin CondonTheodore LevinLeah PastelDavid Vallett
    • Kevin CondonTheodore LevinLeah PastelDavid Vallett
    • G01R31/302
    • G01R31/311G01R31/302G01R31/31728G01R31/3187
    • Disclosed is an apparatus and method for diagnostically testing circuitry within a device. The apparatus and method incorporate the use of energy (e.g., light, heat, magnetic, electric, etc.) applied directly to any location on the device that can affect the electrical activity within the circuitry being tested in order to produce an indicator of a response. A local sensor (e.g., photonic, magnetic, etc.) is positioned at another location on the device where the sensor can detect the indicator of the response within the circuitry. A correlator is configured with response location correlation software and/or circuit tracing software so that when the indicator is detected, the correlator can determine the exact location of a response causing a device failure and/or trace the connectivity of the circuitry, based upon the location of the energy source and the location of the sensor.
    • 公开了一种用于诊断测试设备内的电路的装置和方法。 该装置和方法包括直接应用于设备上可能影响被测电路内的电活动的任何位置的能量(例如光,热,磁,电等)的使用,以便产生一个 响应。 本地传感器(例如,光子,磁性等)位于设备上的另一位置处,其中传感器可以检测电路内的响应的指示符。 相关器被配置有响应位置相关软件和/或电路跟踪软件,使得当检测到指示符时,相关器可基于导致设备故障的确定位置和/或跟踪电路的连通性来确定电路的连接性 能源的位置和传感器的位置。
    • 9. 发明申请
    • Designing Scan Chains With Specific Parameter Sensitivities to Identify Process Defects
    • 设计具有特定参数敏感度的扫描链来识别过程缺陷
    • US20060026472A1
    • 2006-02-02
    • US10710642
    • 2004-07-27
    • James AdkissonGreg BazanJohn CohnMatthew GradyLeendert HuismanMark JaffePhillip NighLeah PastelThomas SopchakDavid SweenorDavid Vallett
    • James AdkissonGreg BazanJohn CohnMatthew GradyLeendert HuismanMark JaffePhillip NighLeah PastelThomas SopchakDavid SweenorDavid Vallett
    • G06F17/50G01R31/28
    • G06F17/5045G01R31/31855G01R31/318586H01L22/34H01L2924/0002H01L2924/00
    • A method is disclosed for designing scan chains in an integrated circuit chip with specific parameter sensitivities to identify fabrication process defects causing test fails and chip yield loss. The composition of scan paths in the integrated circuit chip is biased to allow them to also function as on-product process monitors. The method adds grouping constraints that bias scan chains to have common latch cell usage where possible, and also biases cell routing to constrain scan chain routing to given restricted metal layers for interconnects. The method assembles a list of latch design parameters which are sensitive to process variation or integrity, and formulates a plan for scan chain design which determines the number and the length of scan chains. A model is formulated of scan chain design based upon current state of yield and process integrity, wherein certain latch designs having dominant sensitivities are chosen for specific ones of the scan chains on the chip. The model is provided as input parameters to a global placement and wiring program used to lay out the scan chains. Test data on the chip is then analyzed to determine and isolate systematic yield problems denoted by attributes of a statistically significant failing population of a specific type of scan chain.
    • 公开了一种用于设计具有特定参数灵敏度的集成电路芯片中的扫描链的方法,以识别导致测试失败和芯片产量损失的制造工艺缺陷。 集成电路芯片中的扫描路径的组成被偏置以允许它们也用作产品过程监视器。 该方法增加了分组约束,使得扫描链偏置以在可能的情况下具有共同的锁存单元使用,并且还偏置小区路由以将扫描链路由限制到用于互连的给定受限金属层。 该方法组合了对过程变化或完整性敏感的锁存器设计参数列表,并且制定了扫描链设计的计划,该计划决定了扫描链的数量和长度。 基于产量和过程完整性的当前状态来制定扫描链设计的模型,其中为芯片上的特定扫描链选择具有主要灵敏度的某些锁存器设计。 该模型作为输入参数提供给用于布置扫描链的全局放置和布线程序。 然后对芯片上的测试数据进行分析,以确定和分离由特定类型的扫描链的统计学显着失败群体的属性表示的系统产量问题。