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    • 3. 发明授权
    • Electrically conductive paste, electronic circuit component and method
for producing same
    • 导电胶,电子电路部件及其制造方法
    • US4873022A
    • 1989-10-10
    • US139792
    • 1987-12-30
    • Toshio OgawaMituru FujiiTadamichi AsaiAkira IkegamiHiroshi OhtsuKazuhiko Ato
    • Toshio OgawaMituru FujiiTadamichi AsaiAkira IkegamiHiroshi OhtsuKazuhiko Ato
    • H01B1/16H05K1/09H05K3/38
    • H05K1/092H01B1/16Y10T428/24917
    • The present invention provides an electronic circuit component having a ceramic base and more particularly to a conductive paste for circuit film and an electronic circuit component having a copper film circuit of 10 .mu.m of less in film thickness formed from said conductive paste and a method for making the electronic circuit component.The characteristic of the present invention resides in a conductive paste comprising 100 parts by weight of copper powder of 1 .mu.m or less in average particle size, 0.01-4 parts by weight of at least one of S, Te and Se and 1-10 parts by weight of a frit glass as a binder.Further, there is provided an electronic circuit component having a copper film circuit containing 0.005-2 parts by weight of at least one of S, Te and Se and an effective amount of a glass as a binder for 100 parts by weight of copper which is produced by forming a circuit pattern of said conductive paste on an insulating base by flexo-printing method or the like and then firing the pattern.Especially, since a copper film of 10 .mu.m or less in thickness can be easily formed by printing method, an electronic circuit component having fine circuit pattern comparable to conventional gold film can be provided. This electronic circuit component is excellent as electronic circuit components which require low circuit loss.
    • 本发明提供了一种具有陶瓷基底的电子电路部件,更具体地说,涉及一种用于电路膜的导电膏和具有由所述导电膏形成的薄膜厚度小于10μm的铜膜电路的电子电路部件, 制作电子电路组件。 本发明的特征在于,包含平均粒径为1μm以下的铜粉末100重量份,S,Te,Se中的至少一种为0.01-4重量份,以及1-10重量份 重量份的玻璃料作为粘合剂。 此外,提供了一种电子电路部件,其具有包含0.005-2重量份的S,Te和Se中的至少一个的铜膜电路和有效量的作为100重量份铜的粘合剂的玻璃,其为 通过柔性印刷法等在绝缘基底上形成所述导电膏的电路图案,然后点燃图案而制成。 特别是由于可以通过印刷法容易地形成厚度在10μm以下的铜膜,所以可以提供具有与常规金膜相当的精细电路图案的电子电路元件。 该电子电路部件作为需要低电路损耗的电子电路部件是优异的。