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1. 发明授权

US5016089A Substrate for hybrid IC, hybrid IC using the substrate and its applications 失效
标题翻译：用于混合IC的基板，使用该基板的混合IC及其应用
公开(公告)号：US5016089A
公开(公告)日：1991-05-14
申请号：US293443
申请日：1989-01-04
申请人： Mituru Fujii , Tadamichi Asai , Toshio Ogawa , Osamu Ito , Akira Ikegami , Mitsuru Hasegawa , Takao Kobayashi , Teizo Tamura
发明人： Mituru Fujii , Tadamichi Asai , Toshio Ogawa , Osamu Ito , Akira Ikegami , Mitsuru Hasegawa , Takao Kobayashi , Teizo Tamura
IPC分类号： H01L25/18 , H01C1/142 , H01C7/00 , H01C17/06 , H01C17/065 , H01C17/28 , H01C17/30 , H01L23/498 , H01L25/04 , H01L25/16 , H05K1/16
CPC分类号： H01C7/003 , H01C1/142 , H01C17/065 , H01C17/281 , H01L23/49883 , H01L25/16 , H01L2224/16225 , H01L2924/09701 , H01L2924/19107 , Y10S257/904
摘要： A substrate for hybrid IC which comprises a substrate, a thick film resistor containing glass, formed on the substrate, and a thick film conductor at the terminal of the thick film resistor, where a means for preventing diffusion of the glass from the thick film resistor into the thick film conductor is provided between the thick film resistor and the thick film conductor has a stable resistance as a thick film microresistor and is applied to various uses such as cellular radio communication system.

2. 发明授权

US4873022A Electrically conductive paste, electronic circuit component and method for producing same 失效
标题翻译：导电胶，电子电路部件及其制造方法
公开(公告)号：US4873022A
公开(公告)日：1989-10-10
申请号：US139792
申请日：1987-12-30
申请人： Toshio Ogawa , Mituru Fujii , Tadamichi Asai , Akira Ikegami , Hiroshi Ohtsu , Kazuhiko Ato
发明人： Toshio Ogawa , Mituru Fujii , Tadamichi Asai , Akira Ikegami , Hiroshi Ohtsu , Kazuhiko Ato
IPC分类号： H01B1/16 , H05K1/09 , H05K3/38
CPC分类号： H05K1/092 , H01B1/16 , Y10T428/24917
摘要： The present invention provides an electronic circuit component having a ceramic base and more particularly to a conductive paste for circuit film and an electronic circuit component having a copper film circuit of 10 .mu.m of less in film thickness formed from said conductive paste and a method for making the electronic circuit component.The characteristic of the present invention resides in a conductive paste comprising 100 parts by weight of copper powder of 1 .mu.m or less in average particle size, 0.01-4 parts by weight of at least one of S, Te and Se and 1-10 parts by weight of a frit glass as a binder.Further, there is provided an electronic circuit component having a copper film circuit containing 0.005-2 parts by weight of at least one of S, Te and Se and an effective amount of a glass as a binder for 100 parts by weight of copper which is produced by forming a circuit pattern of said conductive paste on an insulating base by flexo-printing method or the like and then firing the pattern.Especially, since a copper film of 10 .mu.m or less in thickness can be easily formed by printing method, an electronic circuit component having fine circuit pattern comparable to conventional gold film can be provided. This electronic circuit component is excellent as electronic circuit components which require low circuit loss.
摘要翻译：本发明提供了一种具有陶瓷基底的电子电路部件，更具体地说，涉及一种用于电路膜的导电膏和具有由所述导电膏形成的薄膜厚度小于10μm的铜膜电路的电子电路部件，制作电子电路组件。本发明的特征在于，包含平均粒径为1μm以下的铜粉末100重量份，S，Te，Se中的至少一种为0.01-4重量份，以及1-10重量份重量份的玻璃料作为粘合剂。此外，提供了一种电子电路部件，其具有包含0.005-2重量份的S，Te和Se中的至少一个的铜膜电路和有效量的作为100重量份铜的粘合剂的玻璃，其为通过柔性印刷法等在绝缘基底上形成所述导电膏的电路图案，然后点燃图案而制成。特别是由于可以通过印刷法容易地形成厚度在10μm以下的铜膜，所以可以提供具有与常规金膜相当的精细电路图案的电子电路元件。该电子电路部件作为需要低电路损耗的电子电路部件是优异的。

3. 发明授权

US5236630A Conductor paste containing high amounts of either molybdenum or tungsten 失效
标题翻译：含有大量钼或钨的导体糊料
公开(公告)号：US5236630A
公开(公告)日：1993-08-17
申请号：US561916
申请日：1990-08-02
申请人： Hideo Arima , Takashi Kuroki , Masao Sekihata , Mituru Fujii , Mutsumi Horikoshi
发明人： Hideo Arima , Takashi Kuroki , Masao Sekihata , Mituru Fujii , Mutsumi Horikoshi
IPC分类号： H05K1/09 , C09D5/24 , H01B1/22 , H01F5/00 , H01L23/498
CPC分类号： H01B1/22 , H01L23/49883 , H01L2224/16225 , H01L2924/15174 , H01L2924/15312 , H05K1/092
摘要： This invention provides a conductor paste having a low resistivity (about 10 .mu..OMEGA..cm or below) and capable of retaining a film thickness of 25 to 35 .mu.m after baking by composing the paste from 85 to 96 wt. % of a metal powder having a resistivity of 10 .mu..OMEGA..cm or below and 4 to 15 wt. % of an organic vehicle containing 5 to 13 wt. % of a binder. The invention also provides a process for producing the above-described conductor paste, in which 85 to 96 wt. % of a metal powder having a resistivity of 10 .mu..OMEGA..cm or below and 4 to 15 wt. % of an organic vehicle containing 5 to 13 wt. % of a binder are forcibly passed between the barrel-shaped rolls in a kneader and thereby kneaded to form a paste, wherein the roll interval in the kneader is adjusted so that the smallest distance between the adjoining barrel-shaped rolls becomes 5 .mu.m or less and the shear rate therebetween is set at 1,000 s.sup.-1 or more.
摘要翻译：本发明提供一种具有低电阻率（约10μ欧米收/厘米或以下）的导电膏，并且能够通过组合该膏从85至96重量百分比来保持烘烤后的25至35微米的膜厚度。％的电阻率为10欧姆或以下，4〜15重量％的金属粉末。％的有机载体含有5〜13wt。％的粘合剂。本发明还提供了一种制备上述导体糊的方法，其中85至96wt。％的电阻率为10欧姆或以下，4〜15重量％的金属粉末。％的有机载体含有5〜13wt。粘合剂的％通过捏合机在筒状辊之间强制通过，从而捏合形成糊料，其中调整捏合机中的辊间隔使得相邻的桶形辊之间的最小距离变为5μm或较小，其间的剪切速率设定为1000秒-1以上。

4. 发明授权

US4674654A Liquid dispenser having sound generating mechanism 失效
标题翻译：具有声音发生机构的液体分配器
公开(公告)号：US4674654A
公开(公告)日：1987-06-23
申请号：US753814
申请日：1985-07-09
申请人： Mituru Fujii , Tomoyuki Dobashi , Hisashi Sasaki , Masamichi Imanishi , Toshihiro Ueda
发明人： Mituru Fujii , Tomoyuki Dobashi , Hisashi Sasaki , Masamichi Imanishi , Toshihiro Ueda
IPC分类号： B65D25/48 , B65D51/24
CPC分类号： B65D25/48 , B65D51/248
摘要： A liquid dispenser having an air introduction tube with a sound generating mechanism for mounting to an opening of a container holding a liquid such as beer. When liquid is poured through the dispenser a pulsating air flow is generated in the air introduction tube which causes the sound generating mechanism to produce a chirping sound.
摘要翻译：一种具有空气引入管的液体分配器，其具有用于安装到容纳啤酒的液体的容器的开口的发声机构。当通过分配器注入液体时，空气导入管中产生脉动空气流，导致声音产生机构产生啁啾声。

5. 外观设计

USD246296S Pallet 失效
公开(公告)号：USD246296S
公开(公告)日：1977-11-08
申请号：US138011
申请日：1971-04-27
申请人： Mituru Fujii , Izumi Narusawa
设计人： Mituru Fujii , Izumi Narusawa

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