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    • 5. 发明授权
    • Semiconductor laser
    • 半导体激光器
    • US5805628A
    • 1998-09-08
    • US735637
    • 1996-10-23
    • Shoichi KarakidaNorio HayafujiTatsuya KimuraMotoharu MiyashitaHirotaka KizukiTakashi Nishimura
    • Shoichi KarakidaNorio HayafujiTatsuya KimuraMotoharu MiyashitaHirotaka KizukiTakashi Nishimura
    • H01S5/00H01S5/10H01S5/16H01S5/20H01S5/223H01S5/343H01S3/19
    • B82Y20/00H01S5/10H01S5/16H01S5/2231H01S5/1064H01S5/2077H01S5/3432
    • A semiconductor laser device includes a semiconductor substrate of a first conductivity type; opposed light emitting facets; a double heterojunction structure disposed on the semiconductor substrate and including an optical waveguide that extends between the facets and comprises a light emitting region and a lens region, the lens region being between the light emitting region and one of the facets, the double heterojunction structure including a plurality of AlGaAs series compound semiconductor layers which are thicker in the light emitting region than in the lens region; and a current blocking structure disposed on both sides of the double heterojunction structure and including a lower AlGaAs series compound semiconductor layer of the first conductivity type, an intermediate AlGaAs series compound semiconductor layer of a second conductivity type, opposite the first conductivity type, and an upper AlGaAs series compound semiconductor layer of the first conductivity type. Therefore, a reactive current that does not contribute to laser oscillation is prevented from flowing through the current blocking structure.
    • 半导体激光器件包括第一导电类型的半导体衬底; 相对的发光面; 双异质结结构,其设置在所述半导体衬底上,并且包括在所述面之间延伸并且包括发光区域和透镜区域的光波导,所述透镜区域在所述发光区域和所述面之一之间,所述双异质结结构包括 多个AlGaAs系化合物半导体层,其在发光区域比透镜区域厚; 以及设置在双异质结结构的两侧上的电流阻挡结构,并且包括第一导电类型的下AlGaAs系化合物半导体层,与第一导电类型相反的第二导电类型的中间AlGaAs系化合物半导体层和 第一导电类型的上AlGaAs系化合物半导体层。 因此,防止无助于激光振荡的无功电流流过电流阻挡结构。
    • 9. 发明授权
    • Method of producing a semiconductor structure including a recrystallized
film
    • 制造包括再结晶膜的半导体结构的方法
    • US5467731A
    • 1995-11-21
    • US322375
    • 1994-10-13
    • Satoshi ArimotoNorio HayafujiMikio DeguchiSatoshi Hamamoto
    • Satoshi ArimotoNorio HayafujiMikio DeguchiSatoshi Hamamoto
    • H01L21/208H01L21/20C30B13/20
    • H01L21/2022
    • A method for producing a semiconductor structure including a semiconductor film formed on a semiconductor substrate body via an insulating film includes: laminating a first insulating film, a first semiconductor film, and a second insulating film on the semiconductor substrate successively; forming stripe-shaped second semiconductor films of predetermined width on the second insulating film arranged periodically at a predetermined interval and covering these second semiconductor films with a third insulating film; performing zone melting recrystallization of the first semiconductor film from one end of the substrate to the opposite end along the stripe direction of the stripe-shaped second semiconductor film; etching the third insulating film and portions of the second insulating film not sandwiched by the first and second semiconductor films; oxidizing portions of the second semiconductor film and the first semiconductor film exposed in the etching step and etching and removing the second insulating film remaining after the previous etching. Thus, a semiconductor substrate including a recrystallized semiconductor film having removed sub-grain-boundaries generated during the zone melting recrystallization, is obtained by fewer process steps than in the prior art.
    • 一种用于制造半导体结构的方法,该半导体结构包括通过绝缘膜形成在半导体衬底本体上的半导体膜,包括:依次在半导体衬底上层叠第一绝缘膜,第一半导体膜和第二绝缘膜; 在预定间隔周期性地布置的第二绝缘膜上形成预定宽度的条状第二半导体膜,并用第三绝缘膜覆盖这些第二半导体膜; 从所述基板的一端到所述条状的第二半导体膜的条带方向的相反端进行区域熔融再结晶的第一半导体膜; 蚀刻第三绝缘膜和未被第一和第二半导体膜夹持的第二绝缘膜的部分; 在蚀刻步骤中暴露的第二半导体膜和第一半导体膜的氧化部分,并蚀刻除去在先前蚀刻之后残留的第二绝缘膜。 因此,通过比现有技术更少的工艺步骤获得包括在区域熔融再结晶期间产生的去除亚晶界的再结晶半导体膜的半导体衬底。