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1. 发明专利

JP2012204653A Semiconductor device, and method of manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2012204653A
公开(公告)日：2012-10-22
申请号：JP2011068505
申请日：2011-03-25
申请人： Dainippon Printing Co Ltd , Shinko Electric Ind Co Ltd , Nec Corp , Toppan Printing Co Ltd , Ibiden Co Ltd , National Institute Of Advanced Industrial & Technology , イビデン株式会社 , 凸版印刷株式会社 , 大日本印刷株式会社 , 新光電気工業株式会社 , 日本電気株式会社 , 独立行政法人産業技術総合研究所
发明人： SHIMADA OSAMU , TAKEUCHI YUKIHARU , GOMYO TOSHIO , BABA KAZUHIRO , TAKEMURA KOICHI , OKUBO RIICHI , SHIMAKURA KEI , SAKAI ATSUSHI , AOYANAGI MASAHIRO , KIKUCHI KATSUYA
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a structure capable of improving connection reliability between a semiconductor chip and an intermediary substrate and of reducing cost, in a semiconductor device configured by laminating a plurality of semiconductor chips and having an external connection terminal on the intermediary substrate.SOLUTION: A semiconductor device has: a first semiconductor chip having a first through electrode group; a laminated second semiconductor chip having a second through electrode group and a connection terminal group, which is opposed to the first through electrode group of a rear face side of the first semiconductor chip to establish electrical conduction with the first through electrode group; a third semiconductor chip having a connection terminal group, a third through electrode group, a re-wiring layer 44 provided on a surface on an opposite side to the connection terminal group, and an anti-intermediary substrate connection terminal 61 group formed on the surface where the re-wiring layer 44 is present so as to have electrical conduction with the re-wiring layer 44 and having the minimum pitch of arrangement longer than that of the second through electrode group; and a laminated intermediary substrate 100.
摘要翻译：要解决的问题：为了提供能够提高半导体芯片和中间基板之间的连接可靠性并降低成本的结构，在通过层叠多个半导体芯片并且在其上具有外部连接端子的半导体器件中中间底物。解决方案：半导体器件具有：具有第一贯通电极组的第一半导体芯片; 具有第二通电极组和连接端子组的层叠的第二半导体芯片，与第一半导体芯片的背面侧的第一贯通电极组相对，以与第一贯通电极组建立导电; 具有连接端子组的第三半导体芯片，设置在与连接端子组相反的一侧的表面上的再配线层44以及在该表面上形成的反中介基板连接端子61组的第三贯通电极组，再配线层44 其中重新布线层44存在，以便与再布线层44导通，并且具有比第二通孔电极组更短的布置的最小间距; 和层压的中间衬底100.版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2009229842A Method of manufacturing optical waveguide substrate 有权
标题翻译：制造光波导基板的方法
公开(公告)号：JP2009229842A
公开(公告)日：2009-10-08
申请号：JP2008075529
申请日：2008-03-24
申请人： Fuji Xerox Co Ltd , Fujikura Ltd , Hirose Electric Co Ltd , Hitachi Chem Co Ltd , Ibiden Co Ltd , National Institute Of Advanced Industrial & Technology , Nec Corp , Ngk Spark Plug Co Ltd , Sumitomo Electric Ind Ltd , イビデン株式会社 , ヒロセ電機株式会社 , 住友電気工業株式会社 , 富士ゼロックス株式会社 , 日本特殊陶業株式会社 , 日本電気株式会社 , 日立化成工業株式会社 , 株式会社フジクラ , 独立行政法人産業技術総合研究所
发明人： AOYANAGI MASAHIRO , NAKAGAWA HIROSHI , KIKUCHI KATSUYA , MIKAWA TAKASHI , OKADA YOSHIKUNI , SUZUKI ATSUSHI , SUZUKI SADAICHI , TAMURA MITSUAKI , HASHIMOTO YOICHI , MASUDA HIROSHI , SUZUKI SHUJI , WAKAZONO YOSHITSUGU , ISHIKAWA TAKAAKI
IPC分类号： G02B6/42 , G02B6/122 , H01L31/0232 , H01L33/00 , H01L33/48 , H01S5/183
CPC分类号： H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical waveguide substrate in which an optical element and an optical waveguide are optically coupled to each other on a substrate and the optical coupling portion is easily sealed. SOLUTION: The method of manufacturing the optical waveguide substrate comprising a substrate 1, and a reflective surface 3, the optical waveguide 4, and the optical element 5 disposed on the substrate 1 includes the steps of: forming the reflective surface 3 on the substrate 1, forming the optical waveguide 4 such that an end surface is in contact with the reflective surface 3; mounting the optical element 5 on the substrate 1 and electrically connecting it to the substrate 1; bonding one end of a wire 7 made of a core material to a light emitting surface or light receiving surface of the optical element 5 and bonding the other end of the wire 7 above an end of the optical waveguide 4; and sealing the whole optical coupling portion including the optical element 5, optical waveguide 4, and reflective surface 3 with a clad material. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造其中光学元件和光波导在基板上彼此光学耦合的光波导基板的方法，并且光耦合部分容易密封。解决方案：制造包括基板1和反射表面3，光波导4和设置在基板1上的光学元件5的光波导基板的方法包括以下步骤：将反射表面3形成在基板1，形成光波导4，使得端面与反射面3接触; 将光学元件5安装在基板1上并将其电连接到基板1; 将由芯材制成的导线7的一端接合到光学元件5的发光面或光接收面，并将导线7的另一端接合在光波导4的端部之上; 并且用包覆材料密封包括光学元件5，光波导4和反射表面3的整个光学耦合部分。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009198922A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2009198922A
公开(公告)日：2009-09-03
申请号：JP2008042202
申请日：2008-02-22
申请人： Fuji Xerox Co Ltd , Fujikura Ltd , Hirose Electric Co Ltd , Hitachi Chem Co Ltd , Ibiden Co Ltd , National Institute Of Advanced Industrial & Technology , Nec Corp , Ngk Spark Plug Co Ltd , Sumitomo Electric Ind Ltd , イビデン株式会社 , ヒロセ電機株式会社 , 住友電気工業株式会社 , 富士ゼロックス株式会社 , 日本特殊陶業株式会社 , 日本電気株式会社 , 日立化成工業株式会社 , 株式会社フジクラ , 独立行政法人産業技術総合研究所
发明人： AOYANAGI MASAHIRO , NAKAGAWA HIROSHI , KIKUCHI KATSUYA , MIKAWA TAKASHI , OKADA YOSHIKUNI , SUZUKI ATSUSHI , SUZUKI SADAICHI , TAMURA MITSUAKI , HASHIMOTO YOICHI , MASUDA HIROSHI , SUZUKI SHUJI , WAKAZONO YOSHITSUGU , ISHIKAWA TAKAAKI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide an optical module that is significantly reduced in size, and in which both of optical connection and electric connection are detachably achieved perpendicularly to a wiring board face, and can achieve stable electric connection. SOLUTION: An upper structure 5 having an optical transmission body such as an optical fiber 7, an electronic component mounting substrate 30 mounting an optical element 40 and an anisotropic conductive sheet 60 are fixed by pressing in a perpendicular direction onto a wiring board 70 by use of an attachment body such as a fastening member 50, so as to optically connect the optical transmission path of the upper structure 5 to the optical element 40 on the electronic component mounting substrate 30, as well as to electrically connect an under-face pad 34 of the electronic component mounting substrate 30 with an top-face pad 71 of the wiring board 70 via the anisotropic conductive sheet 60. The anisotropic conductive sheet 60 is provided with projections 60a on both surfaces to be in contact with the under-face pad 34 of the electronic component mounting substrate 30 and with the top-face pad 71 of the wiring board 70. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种大大减小的光学模块，并且其中光学连接和电连接都可以垂直于布线板面拆卸地实现，并且可以实现稳定的电连接。解决方案：具有诸如光纤7的光传输体的上部结构5，安装光学元件40的电子部件安装基板30和各向异性导电片60通过垂直方向按压在布线板上而被固定 70，通过使用诸如紧固构件50的附接体，以将上部结构5的光学传输路径光学连接到电子部件安装基板30上的光学元件40，电子部件安装基板30的面板34经由各向异性导电片60与布线基板70的顶面焊盘71.各向异性导电片60在两面上设置有突起60a，电子部件安装基板30的面板34以及配线基板70的顶面焊盘71.（C）2009，JPO＆INPIT

4. 发明专利

JP2009053282A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2009053282A
公开(公告)日：2009-03-12
申请号：JP2007217575
申请日：2007-08-23
申请人： Fuji Xerox Co Ltd , Fujikura Ltd , Hirose Electric Co Ltd , Hitachi Chem Co Ltd , Ibiden Co Ltd , National Institute Of Advanced Industrial & Technology , Nec Corp , Ngk Spark Plug Co Ltd , Sumitomo Electric Ind Ltd , イビデン株式会社 , ヒロセ電機株式会社 , 住友電気工業株式会社 , 富士ゼロックス株式会社 , 日本特殊陶業株式会社 , 日本電気株式会社 , 日立化成工業株式会社 , 株式会社フジクラ , 独立行政法人産業技術総合研究所
发明人： AOYANAGI MASAHIRO , NAKAGAWA HIROSHI , KIKUCHI KATSUYA , MIKAWA TAKASHI , OKADA YOSHIKUNI , HAYASHI YUKIO , ISHIKAWA TAKAAKI , SUZUKI ATSUSHI , NAGAO TASUKE , SUZUKI SADAICHI , TAMURA MITSUAKI , HASHIMOTO YOICHI , HINO TOMOYUKI , MASUDA HIROSHI , SUZUKI SHUJI , WAKAZONO YOSHITSUGU
IPC分类号： G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide an optical module which is significantly reduced in size and manufactured at a low cost, and in which optical connection is easily and detachably achieved perpendicularly to a wiring board face.
SOLUTION: The optical module is equipped with: an upper structure 5 including an optical transmission body 7 forming a continuous optical transmission path in which the optical axis on an external side and the optical axis on an optical element side are perpendicular to each other, and a holding member 6 holding the optical transmission body 7; an optical element mounting substrate 30 fixed on a wiring board 70 and electrically connected to the wiring board 70; and a fitting member 50 fixed around the optical element mounting substrate 30 on the wiring board 70, and detachably holding the upper structure 5 with downward pressing force and optically connecting the optical transmission path of the upper structure 5 to the optical element 40 of the optical element mounting substrate 30 by fitting the upper structure 5 from the upper part of the member.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种光学模块，其尺寸显着减小并且以低成本制造，并且其中光学连接容易且可拆卸地实现垂直于布线板面。解决方案：光学模块配备有：上部结构5，其包括形成连续光学传输路径的光学传输体7，光学元件侧的光轴与光学元件侧的光轴垂直于每个以及保持光传输体7的保持构件6; 光学元件安装基板30固定在布线板70上并电连接到布线板70; 以及在配线基板70上固定在光学元件安装基板30周围的嵌合部件50，并且以向下的压力可拆卸地保持上部结构5，并将上部结构5的光学传输路径光学地连接到光学元件40的光学元件40 通过从构件的上部装配上部结构5来安装元件安装基板30。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009053278A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2009053278A
公开(公告)日：2009-03-12
申请号：JP2007217566
申请日：2007-08-23
申请人： Fuji Xerox Co Ltd , Fujikura Ltd , Hirose Electric Co Ltd , Hitachi Chem Co Ltd , Ibiden Co Ltd , National Institute Of Advanced Industrial & Technology , Nec Corp , Ngk Spark Plug Co Ltd , Sumitomo Electric Ind Ltd , イビデン株式会社 , ヒロセ電機株式会社 , 住友電気工業株式会社 , 富士ゼロックス株式会社 , 日本特殊陶業株式会社 , 日本電気株式会社 , 日立化成工業株式会社 , 株式会社フジクラ , 独立行政法人産業技術総合研究所
发明人： AOYANAGI MASAHIRO , NAKAGAWA HIROSHI , KIKUCHI KATSUYA , MIKAWA TAKASHI , OKADA YOSHIKUNI , HAYASHI YUKIO , ISHIKAWA TAKAAKI , SUZUKI ATSUSHI , NAGAO TASUKE , SUZUKI SADAICHI , TAMURA MITSUAKI , HASHIMOTO YOICHI , HINO TOMOYUKI , MASUDA HIROSHI , SUZUKI SHUJI , WAKAZONO YOSHITSUGU
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide an optical module with high reliability in which heat from electronic parts during operation is efficiently radiated to the outside and an erroneous operation when an optical element or the like reaches a high temperature during the operation is suppressed.
SOLUTION: The optical module is equipped with: an upper structure 5 including an optical transmission body 7 that forms a continuous optical transmission path where the optical axis on an external side and the optical axis on an optical element side are perpendicular to each other, and a holding member 6 holding the optical transmission body 7; and a lower structure 25 on which electronic parts including an optical element 40 are mounted, and in which the upper structure 5 is positioned and placed on an upper side so as to optically connect the optical transmission body 7 of the upper structure 5 to the optical element 40. The holding member 6 of the upper structure 5 is at least partially made of a resin containing a thermally conductive filler.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高可靠性的光学模块，其中来自电子部件的热量在操作期间被有效地辐射到外部，并且在操作期间当光学元件等达到高温时的错误操作被抑制。解决方案：光学模块配备有：上部结构5，其包括光传输体7，其形成连续的光传输路径，其中外侧的光轴和光学元件侧的光轴垂直于每个以及保持光传输体7的保持构件6; 以及其上安装有包括光学元件40的电子部件的下部结构25，并且上部结构5定位并放置在上侧，以便将上部结构5的光学传输体7光学地连接到光学元件上部结构5的保持构件6至少部分地由含有导热填料的树脂制成。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009037004A Optical waveguide structure, its manufacturing method, and optical module 有权
标题翻译：光波导结构及其制造方法和光学模块
公开(公告)号：JP2009037004A
公开(公告)日：2009-02-19
申请号：JP2007201359
申请日：2007-08-01
申请人： Fuji Xerox Co Ltd , Fujikura Ltd , Hirose Electric Co Ltd , Hitachi Chem Co Ltd , Ibiden Co Ltd , National Institute Of Advanced Industrial & Technology , Nec Corp , Ngk Spark Plug Co Ltd , Sumitomo Electric Ind Ltd , イビデン株式会社 , ヒロセ電機株式会社 , 住友電気工業株式会社 , 富士ゼロックス株式会社 , 日本特殊陶業株式会社 , 日本電気株式会社 , 日立化成工業株式会社 , 株式会社フジクラ , 独立行政法人産業技術総合研究所
发明人： AOYANAGI MASAHIRO , NAKAGAWA HIROSHI , KIKUCHI KATSUYA , MIKAWA TAKASHI , OKADA YOSHIKUNI , SUZUKI ATSUSHI , NAGAO TASUKE , SUZUKI SADAICHI , TAMURA MITSUAKI , HASHIMOTO YOICHI , HINO TOMOYUKI , MASUDA HIROSHI , SUZUKI SHUJI , WAKAZONO YOSHITSUGU , HAYASHI YUKIO , ISHIKAWA TAKAAKI
IPC分类号： G02B6/122 , G02B6/42 , H01L31/0232 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide structure and its manufacturing method capable of being optically coupled to an optical element mounted on a substrate at high efficiency and sealing the optical element by a formation material of the optical waveguide, and to provide an optical module. SOLUTION: The optical waveguide structure 2 includes: a sheet-like clad part 30 formed on the substrate 10 mounting the optical element 20, burying the optical element 20 and formed of a dry film of an optical curing resin or heat curing resin; a core part 40 formed in substantially parallel to the substrate 10 in the clad part 30, positioned at an upper part of the optical element 20 at the end and formed of a dry film of the optical curing resin; and a reflection face 50 formed at an upper part of the optical element 20 and optically coupling the optical element 20 and the core part 40. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种光波导结构及其制造方法，其能够高效地光耦合到安装在基板上的光学元件，并且通过光波导的形成材料密封光学元件，并且提供光模块。解决方案：光波导结构2包括：形成在安装光学元件20的基板10上的片状包层部分30，掩埋光学元件20并由光学固化树脂或热固化树脂的干膜形成 ; 在包层部30中基本平行于基板10形成的芯部40，其端部位于光学元件20的上部，由光固化树脂的干膜形成; 以及形成在光学元件20的上部并且光学耦合光学元件20和芯部40的反射面50.版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008227147A Conduction line path structure, its production method, and wiring substrate 审中-公开
标题翻译：导线路结构及其生产方法和接线基板
公开(公告)号：JP2008227147A
公开(公告)日：2008-09-25
申请号：JP2007063307
申请日：2007-03-13
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所
发明人： YOKOSHIMA TOKIHIKO , NAKAGAWA HIROSHI , AOYANAGI MASAHIRO , KIKUCHI KATSUYA
IPC分类号： H05K1/02 , H01P3/06 , H01P3/08 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To achieve stable transmission characteristics to an extremely high signal frequency (for example, several hundred GHz or higher) by easily adjusting the characteristic impedance of a conduction line path by dramatically improving the resistance of a conduction line path structure to a signal crosstalk between wirings and an external noise. SOLUTION: Provided are a conduction line path structure comprising on a substrate a signal line and a conduction shield layer formed so as to be isolated via an insulating layer, with the insulating layer formed partially or totally with an electrodeposition organic thin film, and a wiring substrate comprising the conduction line path structure. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过极大地改善导线路径的电阻，通过容易地调节导线路径的特性阻抗，来实现稳定的传输特性到极高的信号频率（例如，几百GHz或更高）结构与布线之间的信号串扰和外部噪声。解决方案：提供一种导电路径结构，其包括在基板上，信号线和形成为通过绝缘层隔离的导电屏蔽层，绝缘层部分或全部由电沉积有机薄膜形成，以及包括导线路径结构的布线基板。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008211082A Superconducting element, superconducting integrated circuit, and method of manufacturing superconducting element 审中-公开
标题翻译：超导元件，超导集成电路及制造超导元件的方法
公开(公告)号：JP2008211082A
公开(公告)日：2008-09-11
申请号：JP2007047993
申请日：2007-02-27
申请人： National Institute Of Advanced Industrial & Technology , Saitama Univ , 国立大学法人埼玉大学 , 独立行政法人産業技術総合研究所
发明人： TAINO TORU , MEIREN HIROAKI , TAKADA SUSUMU , ASA SHINICHI , SERITA YOSUKE , NAKAGAWA HIROSHI , KIKUCHI KATSUYA , AOYANAGI MASAHIRO , AKAHO HIROSHI
IPC分类号： H01L39/24
摘要： PROBLEM TO BE SOLVED: To provide a superconducting element in which its manufacturing cost is low and a miniaturization of a junction area S of a Josephson junction is easy without increasing the number of processes and complicating any manufacturing process, and also to provide a superconducting integrated circuit using this superconducting element and a method of manufacturing the superconducting element.
SOLUTION: The superconducting element is equipped with: a load 32; the Josephson junction providing a lower electrode wiring 33 electrically connected to this load 32, a tunnel barrier film 41 contacting with this lower electrode wiring 33, and an upper electrode 42 having vertical sidewalls and contacting with this tunnel barrier film 41; and a first interlayer insulating film 16 which has inner walls contacting with the vertical sidewalls of the upper electrode 42, surrounds peripheries of the upper electrode 42, has a top face consisting of a flat plane perpendicularly intersecting the inner walls, and also has a thickness thicker than the upper electrode 42. A top face of the first interlayer insulating film 16 is flat in a planarity of ±1/20 of a thickness of the upper electrode 42 within the range separated from the inner walls by at least the maximum size of a top face of the upper electrode 42.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供其制造成本低的超导元件，并且约瑟夫逊结的接合面积S的小型化容易，而不增加工艺的数量并使任何制造工艺复杂化，并且还提供使用该超导元件的超导集成电路和制造超导元件的方法。
解决方案：超导元件配有：负载32; 约瑟夫逊结提供与该负载32电连接的下电极配线33，与该下电极配线33接触的隧道势垒膜41和具有垂直侧壁并与该隧道势垒膜41接触的上电极42; 并且具有与上电极42的垂直侧壁接触的内壁的第一层间绝缘膜16围绕上电极42的周边具有由与内壁垂直相交的平面构成的顶面，并且还具有厚度第一层间绝缘膜16的顶面在与内壁分开的范围内的上电极42的厚度的±1/20的平坦度平坦至少最大尺寸上电极42的顶面。（C）2008，JPO＆INPIT

9. 发明专利

JP2006145787A Optical connector and its manufacturing method 有权
标题翻译：光学连接器及其制造方法
公开(公告)号：JP2006145787A
公开(公告)日：2006-06-08
申请号：JP2004335071
申请日：2004-11-18
申请人： Hakusan Mfg Co Ltd , National Institute Of Advanced Industrial & Technology , Ntt Advanced Technology Corp , Nttアドバンステクノロジ株式会社 , 株式会社白山製作所 , 独立行政法人産業技術総合研究所
发明人： SUGITA ETSUJI , WAKUTA SHOICHI , IBARAKI OSAMU , AOYANAGI MASAHIRO
IPC分类号： G02B6/40
CPC分类号： G02B6/3885 , G02B6/3839 , G02B6/3846 , G02B6/3861
摘要： PROBLEM TO BE SOLVED: To eliminate the need for grinding processing of end faces of optical fibers and to sufficiently reduce splicing loss of light quantity.
SOLUTION: An optical connector is equipped with a ferrule 1 in which splicing terminals of optical fibers are inserted to be joined. The optical connector is characterized in that an insertion part 112 in which the splicing terminals of the optical fibers are inserted is provided at a side opposite to the joining surface of the ferrule 1, and optical fibers 5 for relay whose end faces are subjected to grinding processing are housed on axial lines of the insertion part 112 at the side of the joining surface of the ferrule 1.
COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2006010678A Contact probe, measuring pad used for contact probe, and method of manufacturing contact probe 有权
标题翻译：接触探头，用于接触探头的测量垫及其制造方法
公开(公告)号：JP2006010678A
公开(公告)日：2006-01-12
申请号：JP2005115988
申请日：2005-04-13
申请人： Kiyota Seisakusho:Kk , National Institute Of Advanced Industrial & Technology , 有限会社清田製作所 , 独立行政法人産業技術総合研究所
发明人： AOYANAGI MASAHIRO , NAKAGAWA HIROSHI , TOKORO KAZUHIKO , KIKUCHI KATSUYA , OKADA YOSHIKUNI , KIYOTA SHIGEO
IPC分类号： G01R1/06 , G01R1/067 , G01R31/02 , H05K1/02 , H05K1/11
CPC分类号： G01R1/06772 , H05K1/0219 , H05K1/117 , Y10T29/49117
摘要： PROBLEM TO BE SOLVED: To provide a contact probe that is smaller than 50 μm in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. SOLUTION: The contact probe includes a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured, and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor 1a electrically connected to the ground electrode 11a. The tip member is formed on a printed wiring board 2, and the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供在信号电极和接地电极之间的间距小于50μm的接触探针，并且可以正确地进行高速高频测量，用于接触的测量垫探针和制造接触探针的方法。解决方案：接触探针包括具有与待测物体接触的信号电极10a和接地电极11a的尖端构件，以及具有与信号电极10a电连接的芯1b的同轴电缆1 以及电连接到接地电极11a的外覆盖导体1a。尖端构件形成在印刷线路板2上，信号电极10a和接地电极11a由形成在绝缘板2a上的细微共面带状线构成。版权所有（C）2006，JPO＆NCIPI

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