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1. 发明授权

US5116571A Chromoum heat-resistant steel excellent in toughness and having high cracking resistance and high creep strength in welded joint 失效
标题翻译：耐腐蚀钢，韧性好，耐焊接性高，耐冲击强度高
公开(公告)号：US5116571A
公开(公告)日：1992-05-26
申请号：US730013
申请日：1991-07-12
申请人： Nakatsugu Abe , Haruo Suzuki , Hiroaki Tsukamoto , Seishi Tsuyama , Moriyasu Nagae
发明人： Nakatsugu Abe , Haruo Suzuki , Hiroaki Tsukamoto , Seishi Tsuyama , Moriyasu Nagae
IPC分类号： C22C38/00 , C22C38/24 , C22C38/26 , C22C38/54
CPC分类号： C22C38/24 , C22C38/26
摘要： A chromium heat-resistant steel excellent in toughness and having a high cracking resistance and a high creep strength when said steel is utilized to form a welded joint, said steel consisting essentially of:______________________________________ carbon: from 0.04 to 0.09 wt. %, silicon: from 0.01 to 0.50 wt. %, manganese: from 0.25 to 1.50 wt. %, chromium: from 7.0 to 9.2 wt. %, molybdenum: from 0.50 to 1.50 wt. %, soluble aluminum: from 0.005 to 0.060 wt. %, nitrogen: from 0.001 to 0.060 wt. %, ______________________________________ where, the total amount of nitrogen and carbon being up to 0.13 wt. %, at least one element selected from the group consisting of:______________________________________ vanadium: from 0.01 to 0.30 wt. %, and niobium: from 0.005 to 0.200 wt. %, ______________________________________ where, the total amount of vanadium and 1.5 times niobium being up to 0.30 wt. %, and the balance being iron and incidental impurities; and the amount of ferrite as represented by the ferrite number (.delta..sub.F) in the above-mentioned chromium heat-resistant steel being -5 or lower, as calculated by the following formula:.delta..sub.F=-104-555 (C+6/7N)+32.9Si-49.5Mn+12.1Cr+39.1Mo+46.1V+83.5Nb.
摘要翻译：当所述钢用于形成焊接接头时，韧性优异且具有高抗裂性和高蠕变强度的铬耐热钢，所述钢主要由以下组成： - 碳：0.04〜0.09重量％％， - 硅氧烷：0.01〜0.50wt。％， - 锰：0.25至1.50wt。％，-chromium：7.0〜9.2wt。％， - 钼：0.50〜1.50wt。％，可溶性铝：0.005〜0.060重量％％， - 氮：0.001〜0.060重量％％， - 其中，氮和碳的总量高达0.13wt。％，选自以下的至少一种元素： - 钒：0.01〜0.30重量％％， - 和 - 铌：0.005〜0.200wt。％， - 其中钒和1.5倍铌的总量高达0.30重量％。％，余量为铁和杂质; 和由上述铬耐热钢中的铁素体数（ΔF）表示的铁素体的量为-5以下，通过下式计算：ΔF= -104-555（C + 6 / 7N）+ 32.9Si-49.5Mn + 12.1Cr + 39.1Mo + 46.1V + 83.5Nb。

2. 发明授权

US4755234A Method of manufacturing pressure vessel steel with high strength and toughness 失效
标题翻译：具有高强度和韧性的压力容器钢的制造方法
公开(公告)号：US4755234A
公开(公告)日：1988-07-05
申请号：US56264
申请日：1987-05-26
申请人： Haruo Suzuki , Toshio Takano , Koshiro Tsukada , Hiroaki Tsukamoto
发明人： Haruo Suzuki , Toshio Takano , Koshiro Tsukada , Hiroaki Tsukamoto
IPC分类号： C21D8/00 , C21D8/02 , C22C38/00 , C22C38/54
CPC分类号： C22C38/54 , C22C38/001
摘要： A method of manufacturing pressure vessel steel having high strength and high toughness comprising the steps of heating steel to a temperature higher than 1200.degree. C., said steel containing from 0.03 to 0.12 wt. % C, 0.10 to 0.8 wt. % Si, 0.45 to 1.00 wt. % Mn, 0.80 to 3.50 wt. % Cr, 0.10 to 1.60 wt. % Mo, 0.10 to 0.53 wt. % Ni, 0.010 to 0.040 wt. % soluble aluminum, at least one of 0.05 to 0.40 wt. % V and 0.02 to 0.20 wt. % Nb, less than 0.010 wt. % Ti, 0.0002 to 0.0010 wt. % B, and less than 0.004 wt. % N, the balance of iron and impurities, the N and Ti satisfying the following equationN
摘要翻译：一种制造具有高强度和高韧性的压力容器钢的方法，包括将钢加热至高于1200℃的温度，所述钢含有0.03至0.12wt。％C，0.10〜0.8wt。％Si，0.45〜1.00wt。％Mn，0.80〜3.50wt。％Cr，0.10〜1.60重量％％Mo，0.10〜0.53wt。％Ni，0.010〜0.040wt。％可溶性铝，0.05〜0.40重量％％V和0.02〜0.20wt。％Nb，小于0.010wt。％Ti，0.0002〜0.0010重量％％B，小于0.004wt。％N，铁和杂质的平衡，N和Ti满足下列等式N <14/48×Ti + 0.0024％; 在高于1050℃的温度下滚动加热钢，总共减少30％以上; 直接淬火轧制钢; 并回火轧制钢。

3. 发明申请

US20070267712A1 Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication 审中-公开
标题翻译：固态成像器件，半导体晶片，光学器件模块，固态成像器件制造方法和光学器件模块制造方法
公开(公告)号：US20070267712A1
公开(公告)日：2007-11-22
申请号：US11799258
申请日：2007-04-30
申请人： Kazuya Fujita , Hiroaki Tsukamoto , Takashi Yasudome
发明人： Kazuya Fujita , Hiroaki Tsukamoto , Takashi Yasudome
IPC分类号： H01L31/09
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/16151 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： With the reduced size of a solid state imaging device, the invention provides: a solid state imaging device of a chip size and having good environmental durability; a semiconductor wafer used for fabricating a solid state imaging device; an optical device module incorporating a solid state imaging device; a method of solid state imaging device fabrication; and a method of optical device module fabrication. The solid state imaging device comprises: a solid state image pickup device formed on a semiconductor substrate; a light-transparent cover arranged opposite to an effective pixel region, so as to protect (the surface of) the effective pixel region formed in one surface of the solid state image pickup device against external environment; and an adhering section formed outside the effective pixel region in the one surface of the solid state image pickup device, so as to adhere the light-transparent cover and the solid state image pickup device.
摘要翻译：随着固态成像装置的尺寸减小，本发明提供了一种芯片尺寸并具有良好的环境耐久性的固态成像装置; 用于制造固态成像装置的半导体晶片; 包括固态成像装置的光学装置模块; 一种固态成像器件制造方法; 以及光学器件模块制造的方法。固态成像装置包括：形成在半导体衬底上的固态图像拾取器件; 与有效像素区域相对布置的光透明盖，以防止形成在固态图像拾取装置的一个表面中的有效像素区域（表面）抵抗外部环境; 以及形成在固态图像拾取装置的一个表面中的有效像素区域外侧的粘附部分，以便粘附透光盖和固态图像拾取装置。

4. 发明授权

US07112864B2 Module for optical device, and manufacturing method therefor 有权
标题翻译：光学元件模块及其制造方法
公开(公告)号：US07112864B2
公开(公告)日：2006-09-26
申请号：US10804666
申请日：2004-03-18
申请人： Hiroaki Tsukamoto , Kazuya Fujita , Takashi Yasudome
发明人： Hiroaki Tsukamoto , Kazuya Fujita , Takashi Yasudome
IPC分类号： H01L31/0203 , H01L31/062
CPC分类号： G02B7/02 , H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H01L2924/3025 , H04N5/2253 , H01L2924/00014 , H01L2924/00
摘要： A module for an optical device being provided with a wiring substrate having a conductive wiring patterned thereon, a solid-state image sensor, a DSP for controlling the operation of the solid-state image sensor and processing a signal outputted from the same, and a lens holder being placed opposite to the solid-state image sensor and having a function of an optical path demarcating unit for demarcating the optical path to the solid-state image sensor, wherein a transparent cover bonded to the surface of the solid-state image sensor is joined to the lens holder at a joint portion. It is unnecessary to provide a focus adjuster for matching the optical distance between the lens and the solid-state image sensor with the focal length of the lens.
摘要翻译：一种用于光学装置的模块，其具有布置有图案化的导电布线的布线基板，固态图像传感器，用于控制固态图像传感器的操作的DSP以及处理从其输出的信号的DSP 透镜架放置在与固态图像传感器相对的位置，并且具有用于将光路划定到固态图像传感器的光路划分单元的功能，其中粘合到固态图像传感器的表面的透明盖在接合部分处连接到透镜保持器。不需要提供用于将透镜和固态图像传感器之间的光学距离与透镜的焦距进行匹配的焦点调节器。

5. 发明授权

US07733408B2 Optical device module, optical path fixing device, and method for manufacturing optical device module 失效
标题翻译：光器件模块，光路固定装置以及光器件模块的制造方法
公开(公告)号：US07733408B2
公开(公告)日：2010-06-08
申请号：US11388940
申请日：2006-03-23
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H04N5/225
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L2224/48227 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H04N5/2257 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.
摘要翻译：固态图像传感器，透明盖，DSP，布线板等通过合成树脂的模塑密封在密封部分中，并固定到成像单元。此时，透明盖的一部分从密封部露出。在透镜筒的下端表面与露出部分接触的状态下，通过密封部分密封的光路固定装置和成像单元通过钩接合部和钩部的接合而被固定地组合。结果，即使固态图像传感器布置的基板被偏转或失真，透镜相对于固态图像传感器的像素区域的定位精度也不会劣化。

6. 发明申请

US20100019134A1 Solid-state image sensing device, method and apparatus for manufacturing same, and electronic device 有权
标题翻译：固体摄像装置及其制造方法和装置以及电子装置
公开(公告)号：US20100019134A1
公开(公告)日：2010-01-28
申请号：US12311228
申请日：2007-08-08
申请人： Hiroaki Tsukamoto , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Kazuo Kinoshita
IPC分类号： H01L31/0203 , H01L31/0232 , B05D5/12 , B05C5/00 , B05C1/00
CPC分类号： H04N5/2251 , H04N5/2257
摘要： A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.
摘要翻译：相机模块（1）是透镜支架（4）和布线板（2）的组件。透镜架（4）保持形成被摄体图像的光学结构（3）。布线板（2）上形成有将由光学结构（3）形成的被摄体的图像转换成电信号的固体摄像元件（21）。将润滑脂（7）以不存在于光学结构（3）的光路中的润滑脂的方式施加到相机模块（1）。润滑脂（7）在制造过程中和在使用时捕获灰尘（D），从而防止灰尘（D）引起图像缺陷。因此，提供了能够防止制造时和使用中产生的灰尘引起图像缺陷的固体摄像装置。

7. 发明授权

US07456483B2 Semiconductor device, manufacturing method of semiconductor device and module for optical device 有权
标题翻译：半导体器件，半导体器件的制造方法和光学器件的模块
公开(公告)号：US07456483B2
公开(公告)日：2008-11-25
申请号：US11125661
申请日：2005-05-09
申请人： Hiroaki Tsukamoto , Kazuya Fujita , Takashi Yasudome
发明人： Hiroaki Tsukamoto , Kazuya Fujita , Takashi Yasudome
IPC分类号： H01L29/72
CPC分类号： H01L27/14618 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/16195 , H01L2924/16235 , H01L2924/00014 , H01L2924/00
摘要： A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion on the outer side; and a trap portion. The first opening end portion, the trap portion and the second opening end portion constitute a vent path. The vent path is shaped not to connect the first opening end portion with the second opening end portion linearly but to connect the opening end portions in the bond portion via the trap portion larger than the opening end portions.
摘要翻译：用于将固态成像元件的主平面与透明覆盖部分接合并构成中间部分的接合部分设置有：中空部分侧的第一开口端部; 外侧的第二开口端部; 和陷阱部分。第一开口端部，捕获部和第二开口端部构成通气路径。排气路径的形状不是使第一开口端部与第二开口端部直线连接，而是通过比开口端部大的收纳部连接接合部的开口端部。

8. 发明申请

US20060197864A1 Solid-state imaging device 审中-公开
标题翻译：固态成像装置
公开(公告)号：US20060197864A1
公开(公告)日：2006-09-07
申请号：US11359848
申请日：2006-02-21
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2924/16235 , H01L2924/00014
摘要： A solid-state imaging device which has a wiring substrate, a solid-state image sensor having a face opposite to a pixel area fixed to the wiring substrate, and a transparent cover fixed to the solid-state image sensor through an adhesive layer so as to oppose the pixel area of the solid-state image sensor. The wiring substrate has, on a side opposing the transparent cover, a cavity being provided with plural connecting terminals. The solid-state image sensor is fixed to a bottom face of the cavity in a state where the solid-state image sensor falls into the cavity. The connecting terminals of the cavity are connected with a connecting terminals of the solid-state image sensor, respectively through a wiring which falls into the cavity.
摘要翻译：一种固态成像装置，其具有布线基板，具有与固定到布线基板的像素区域相对的面的固态图像传感器，以及通过粘合层固定到固态图像传感器的透明盖，以抵抗固态图像传感器的像素区域。布线基板在与透明盖相对的一侧具有设置有多个连接端子的空腔。在固态图像传感器落入空腔的状态下，固态图像传感器固定到空腔的底面。空腔的连接端子分别通过落入空腔的布线与固态图像传感器的连接端子连接。

9. 发明授权

US08288710B2 Solid-state image sensing device capable of preventing dust from attaching to optical path, method for manufacturing same, and electronic device 有权
标题翻译：能够防止灰尘附着于光路的固体摄像装置及其制造方法以及电子装置
公开(公告)号：US08288710B2
公开(公告)日：2012-10-16
申请号：US12311228
申请日：2007-08-08
申请人： Hiroaki Tsukamoto , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Kazuo Kinoshita
IPC分类号： H01J40/14
CPC分类号： H04N5/2251 , H04N5/2257
摘要： A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.
摘要翻译：相机模块（1）是透镜支架（4）和布线板（2）的组件。透镜架（4）保持形成被摄体图像的光学结构（3）。布线板（2）上形成有将由光学结构（3）形成的被摄体的图像转换为电信号的固体摄像元件（21）。将润滑脂（7）以不存在于光学结构（3）的光路中的润滑脂的方式施加到相机模块（1）。润滑脂（7）在制造过程中和在使用时捕获灰尘（D），从而防止灰尘（D）引起图像缺陷。因此，提供了能够防止制造时和使用中产生的灰尘引起图像缺陷的固体摄像装置。

10. 发明申请

US20080277752A1 Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication 审中-公开
标题翻译：固态成像器件，半导体晶片，光学器件模块，固态成像器件制造方法和光学器件模块制造方法
公开(公告)号：US20080277752A1
公开(公告)日：2008-11-13
申请号：US12218137
申请日：2008-07-11
申请人： Kazuya Fujita , Hiroaki Tsukamoto , Takashi Yasudome
发明人： Kazuya Fujita , Hiroaki Tsukamoto , Takashi Yasudome
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/16151 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： With the reduced size of a solid state imaging device, the invention provides: a solid state imaging device of a chip size and having good environmental durability; a semiconductor wafer used for fabricating a solid state imaging device; an optical device module incorporating a solid state imaging device; a method of solid state imaging device fabrication; and a method of optical device module fabrication. The solid state imaging device comprises: a solid state image pickup device formed on a semiconductor substrate; a light-transparent cover arranged opposite to an effective pixel region, so as to protect (the surface of) the effective pixel region formed in one surface of the solid state image pickup device against external environment; and an adhering section formed outside the effective pixel region in the one surface of the solid state image pickup device, so as to adhere the light-transparent cover and the solid state image pickup device.
摘要翻译：随着固态成像装置的尺寸减小，本发明提供了一种芯片尺寸并具有良好的环境耐久性的固态成像装置; 用于制造固态成像装置的半导体晶片; 包括固态成像装置的光学装置模块; 一种固态成像器件制造方法; 以及光学器件模块制造的方法。固态成像装置包括：形成在半导体衬底上的固态图像拾取器件; 与有效像素区域相对布置的光透明盖，以防止形成在固态图像拾取装置的一个表面中的有效像素区域（表面）抵抗外部环境; 以及形成在固态图像拾取装置的一个表面中的有效像素区域外侧的粘附部分，以便粘附透光盖和固态图像拾取装置。

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