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1. 发明授权

US07733408B2 Optical device module, optical path fixing device, and method for manufacturing optical device module 失效
标题翻译：光器件模块，光路固定装置以及光器件模块的制造方法
公开(公告)号：US07733408B2
公开(公告)日：2010-06-08
申请号：US11388940
申请日：2006-03-23
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H04N5/225
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L2224/48227 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H04N5/2257 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.
摘要翻译：固态图像传感器，透明盖，DSP，布线板等通过合成树脂的模塑密封在密封部分中，并固定到成像单元。此时，透明盖的一部分从密封部露出。在透镜筒的下端表面与露出部分接触的状态下，通过密封部分密封的光路固定装置和成像单元通过钩接合部和钩部的接合而被固定地组合。结果，即使固态图像传感器布置的基板被偏转或失真，透镜相对于固态图像传感器的像素区域的定位精度也不会劣化。

2. 发明申请

US20100019134A1 Solid-state image sensing device, method and apparatus for manufacturing same, and electronic device 有权
标题翻译：固体摄像装置及其制造方法和装置以及电子装置
公开(公告)号：US20100019134A1
公开(公告)日：2010-01-28
申请号：US12311228
申请日：2007-08-08
申请人： Hiroaki Tsukamoto , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Kazuo Kinoshita
IPC分类号： H01L31/0203 , H01L31/0232 , B05D5/12 , B05C5/00 , B05C1/00
CPC分类号： H04N5/2251 , H04N5/2257
摘要： A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.
摘要翻译：相机模块（1）是透镜支架（4）和布线板（2）的组件。透镜架（4）保持形成被摄体图像的光学结构（3）。布线板（2）上形成有将由光学结构（3）形成的被摄体的图像转换成电信号的固体摄像元件（21）。将润滑脂（7）以不存在于光学结构（3）的光路中的润滑脂的方式施加到相机模块（1）。润滑脂（7）在制造过程中和在使用时捕获灰尘（D），从而防止灰尘（D）引起图像缺陷。因此，提供了能够防止制造时和使用中产生的灰尘引起图像缺陷的固体摄像装置。

3. 发明申请

US20060197864A1 Solid-state imaging device 审中-公开
标题翻译：固态成像装置
公开(公告)号：US20060197864A1
公开(公告)日：2006-09-07
申请号：US11359848
申请日：2006-02-21
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2924/16235 , H01L2924/00014
摘要： A solid-state imaging device which has a wiring substrate, a solid-state image sensor having a face opposite to a pixel area fixed to the wiring substrate, and a transparent cover fixed to the solid-state image sensor through an adhesive layer so as to oppose the pixel area of the solid-state image sensor. The wiring substrate has, on a side opposing the transparent cover, a cavity being provided with plural connecting terminals. The solid-state image sensor is fixed to a bottom face of the cavity in a state where the solid-state image sensor falls into the cavity. The connecting terminals of the cavity are connected with a connecting terminals of the solid-state image sensor, respectively through a wiring which falls into the cavity.
摘要翻译：一种固态成像装置，其具有布线基板，具有与固定到布线基板的像素区域相对的面的固态图像传感器，以及通过粘合层固定到固态图像传感器的透明盖，以抵抗固态图像传感器的像素区域。布线基板在与透明盖相对的一侧具有设置有多个连接端子的空腔。在固态图像传感器落入空腔的状态下，固态图像传感器固定到空腔的底面。空腔的连接端子分别通过落入空腔的布线与固态图像传感器的连接端子连接。

4. 发明授权

US08288710B2 Solid-state image sensing device capable of preventing dust from attaching to optical path, method for manufacturing same, and electronic device 有权
标题翻译：能够防止灰尘附着于光路的固体摄像装置及其制造方法以及电子装置
公开(公告)号：US08288710B2
公开(公告)日：2012-10-16
申请号：US12311228
申请日：2007-08-08
申请人： Hiroaki Tsukamoto , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Kazuo Kinoshita
IPC分类号： H01J40/14
CPC分类号： H04N5/2251 , H04N5/2257
摘要： A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.
摘要翻译：相机模块（1）是透镜支架（4）和布线板（2）的组件。透镜架（4）保持形成被摄体图像的光学结构（3）。布线板（2）上形成有将由光学结构（3）形成的被摄体的图像转换为电信号的固体摄像元件（21）。将润滑脂（7）以不存在于光学结构（3）的光路中的润滑脂的方式施加到相机模块（1）。润滑脂（7）在制造过程中和在使用时捕获灰尘（D），从而防止灰尘（D）引起图像缺陷。因此，提供了能够防止制造时和使用中产生的灰尘引起图像缺陷的固体摄像装置。

5. 发明申请

US20060219884A1 Optical device module, and method of fabricating the optical device module 有权
标题翻译：光器件模块及其制造方法
公开(公告)号：US20060219884A1
公开(公告)日：2006-10-05
申请号：US11388531
申请日：2006-03-23
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H01J40/14 , H01J5/02
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L2224/48227 , H01L2924/15311 , H01L2224/48091 , H01L2924/00014
摘要： An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.
摘要翻译：具有透镜的光路限定器被设置为与粘合到固态图像传感器的表面的透明盖接触，并且固定而不粘合。此外，固定透明盖的固态图像传感器设置为与未透明盖接触的光路限定器，用作信号处理器的DSP，电路部分和布线板，通过密封在合成树脂中固定。即使当由于设置固态图像传感器的板上的翘曲，挠曲等而发生变形时，透镜相对于固态图像传感器的对准的精度也不会降低。此外，固态图像传感器或信号处理器不会因外部冲击而损坏。

6. 发明授权

US07397023B2 Image sensor module with optical path delimiter and accurate alignment 有权
标题翻译：图像传感器模块，具有光路分隔符和精确对准
公开(公告)号：US07397023B2
公开(公告)日：2008-07-08
申请号：US11388531
申请日：2006-03-23
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H01L27/00 , H01L27/14 , H01L23/12
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L2224/48227 , H01L2924/15311 , H01L2224/48091 , H01L2924/00014
摘要： An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.
摘要翻译：具有透镜的光路限定器被设置为与粘合到固态图像传感器的表面的透明盖接触，并且固定而不粘合。此外，固定透明盖的固态图像传感器设置为与未透明盖接触的光路限定器，用作信号处理器的DSP，电路部分和布线板，通过密封在合成树脂中固定。即使当由于设置固态图像传感器的板上的翘曲，挠曲等而发生变形时，透镜相对于固态图像传感器的对准的精度也不会降低。此外，固态图像传感器或信号处理器不会因外部冲击而损坏。

7. 发明授权

US07294828B2 Distortion and shock resistant optical device module for image capture 失效
标题翻译：用于图像捕获的失真和抗冲击光学设备模块
公开(公告)号：US07294828B2
公开(公告)日：2007-11-13
申请号：US11396427
申请日：2006-03-30
申请人： Kazuo Kinoshita , Nobuhito Hirosumi , Takashi Yasudome , Hiroaki Tsukamoto
发明人： Kazuo Kinoshita , Nobuhito Hirosumi , Takashi Yasudome , Hiroaki Tsukamoto
IPC分类号： H01J5/02 , H01L31/0203
CPC分类号： H04N1/024 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.
摘要翻译：在图像感测单元上设置螺纹部，在光路限定器上设置与螺纹部接合的螺纹孔部，螺纹部和螺纹孔部接合在一起，固定摄像单元，光路限定器使得光路限定器的镜筒与粘合到固态图像传感器的表面的透明盖接触。固态图像传感器，透明盖，DSP，布线板等由树脂制成的密封部分密封。即使当由于设置固态图像传感器的板上的翘曲，弯曲等而发生变形时，透镜相对于固态图像传感器的像素区域的定位的精度也不会降低，可以防止固态图像传感器或信号处理器被外部冲击损坏，并且容易地制造光学器件模块。

8. 发明申请

US20060221225A1 Optical device module, optical path fixing device, and method for manufacturing optical device module 失效
标题翻译：光器件模块，光路固定装置以及光器件模块的制造方法
公开(公告)号：US20060221225A1
公开(公告)日：2006-10-05
申请号：US11388940
申请日：2006-03-23
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H04N5/225
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L2224/48227 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H04N5/2257 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.
摘要翻译：固态图像传感器，透明盖，DSP，布线板等通过合成树脂的模塑密封在密封部分中，并固定到成像单元。此时，透明盖的一部分从密封部露出。在透镜筒的下端表面与露出部分接触的状态下，通过密封部分密封的光路固定装置和成像单元通过钩接合部和钩部的接合而被固定地组合。结果，即使固态图像传感器布置的基板被偏转或失真，透镜相对于固态图像传感器的像素区域的定位精度也不会劣化。

9. 发明申请

US20060219885A1 Optical device module 失效
标题翻译：光器件模块
公开(公告)号：US20060219885A1
公开(公告)日：2006-10-05
申请号：US11396427
申请日：2006-03-30
申请人： Kazuo Kinoshita , Nobuhito Hirosumi , Takashi Yasudome , Hiroaki Tsukamoto
发明人： Kazuo Kinoshita , Nobuhito Hirosumi , Takashi Yasudome , Hiroaki Tsukamoto
IPC分类号： H01J5/02
CPC分类号： H04N1/024 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.
摘要翻译：在图像感测单元上设置螺纹部，在光路限定器上设置与螺纹部接合的螺纹孔部，螺纹部和螺纹孔部接合在一起，固定摄像单元，光路限定器使得光路限定器的镜筒与粘合到固态图像传感器的表面的透明盖接触。固态图像传感器，透明盖，DSP，布线板等由树脂制成的密封部分密封。即使当由于设置固态图像传感器的板上的翘曲，弯曲等而发生变形时，透镜相对于固态图像传感器的像素区域的定位的精度也不会降低，可以防止固态图像传感器或信号处理器被外部冲击损坏，并且容易地制造光学器件模块。

10. 发明申请

US20060208182A1 Solid-state image sensing device 审中-公开
标题翻译：固态摄像装置
公开(公告)号：US20060208182A1
公开(公告)日：2006-09-21
申请号：US11366945
申请日：2006-03-01
申请人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
发明人： Hiroaki Tsukamoto , Nobuhito Hirosumi , Takashi Yasudome , Kazuo Kinoshita
IPC分类号： H01J5/02
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state image sensing device has a printed board; a solid-state image sensing element fixed to the printed board; and a light-transmitting lid section fixed to the solid-state image sensing element so as to cover an image sensing area (effective pixel area). The printed board has a bore which penetrates through the printed board in a thickness direction thereof, at least a part of the light-transmitting lid section is fitted in the bore, and connecting terminals of the printed board are connected to connecting terminals of the solid-state image sensing element.
摘要翻译：固态摄像装置具有印刷电路板; 固体摄像元件固定在印刷电路板上; 以及固定在固体摄像元件上以覆盖图像感测区域（有效像素区域）的透光盖部分。印刷电路板具有在其厚度方向上穿过印刷电路板的孔，至少一部分透光盖部分装配在孔中，并且印刷电路板的连接端子连接到固体的连接端子状态图像传感元件。

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