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1. 发明专利

JP2003100758A METHOD FOR FORMING PATTERN AND PRESSURE SENSITIVE ADHESIVE SHEET FOR METAL FILM PATTERNING 审中-公开
公开(公告)号：JP2003100758A
公开(公告)日：2003-04-04
申请号：JP2001298331
申请日：2001-09-27
申请人： DENSO CORP , NITTO DENKO CORP
发明人： KONDO ICHIJI , NORITAKE CHIKAGE , SUZUKI MIKIMASA , TOYODA HIDESHI
IPC分类号： H01L29/43 , H01L21/28 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a method for patterning a metal film that facilitates peeling and the cost of which is low. SOLUTION: On the surface of a base where an aluminum thin film 3 as a first material and a polyimide film 4 as a second material different from the first material are exposed, a metal film 5 is formed and when patterning of the metal film 5 is carried out in such a way that the metal film 5 located on the aluminum thin film 3 is left and the metal film 5 located on the polyimide film 4 is peeled, a pressure sensitive adhesive sheet 8 is used to peel the metal film 5 and the surface is irradiated with reactive ions or radicals for refining as a process for preventing the metal film 5 from being peeled from the aluminum thin film 3 and for facilitating peeling on the surface of the polyimide film 4, then the desired metal film 5 is formed and the pressure sensitive adhesive sheet 8 is peeled off after it is pasted thereto.

2. 发明专利

JP2003100654A PATTERN FORMATION METHOD AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003100654A
公开(公告)日：2003-04-04
申请号：JP2001298326
申请日：2001-09-27
申请人： DENSO CORP , NITTO DENKO CORP
发明人： ISHIHARA YASUO , INOUE SHINGO , KONDO ICHIJI , TOYODA HIDESHI
IPC分类号： H01L21/28
摘要： PROBLEM TO BE SOLVED: To provide a pattern formation method in which a metal film can be patterned inside an opening in an insulating film with a new constitution. SOLUTION: An opening 3 whose end part is tapered is patterned to the insulating film 2 formed on a silicon substrate 1 comprising an N-type diffusion layer 4. A metal film 5, a metal film 6, and a metal film 7 are formed on the insulating film 2 inclusive of the inside of the opening 3. An adhesive sheet is pasted on the surface of the metal films 5, 6, 7, the adhesive sheet is then stripped, the metal films 5, 6, 7 are left inside the opening 3 including its taper part, the metal films 5, 6, 7 on the insulating film 2 in their circumference are removed so as to be patterned.

3. 发明专利

JP2002026049A SURFACE TREATING METHOD OF SUBSTRATE 失效
公开(公告)号：JP2002026049A
公开(公告)日：2002-01-25
申请号：JP2000206442
申请日：2000-07-07
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , NAMIKAWA AKIRA , NORITAKE CHIKAGE , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a surface treating method of a substrate having irregularities on the surface (e.g. a semiconductor substrate having protruding insulating parts and recessed electrode parts formed on the surface being used in the formation of a metal film pattern) in which only the protrusions can be reformed selectively in the fabrication of a semiconductor device. SOLUTION: Properties at the surface part of protrusions on a substrate (A) are varied selectively by touching the surface part of a planar or sheet-like article (B) only to the surface part of protrusions on the substrate (A) having irregularities on the surface.

4. 发明专利

JP2001345338A METAL ELECTRODE PATTERN FORMATION METHOD AND ADHESIVE SHEET FOR PEELING AND REMOVING METAL FILM 失效
公开(公告)号：JP2001345338A
公开(公告)日：2001-12-14
申请号：JP2000376017
申请日：2000-12-11
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , ICHIKAWA HIROKI , NAMIKAWA AKIRA , TERADA YOSHIO , NAKANO ICHIRO , IZUMITANI SEIJI , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： C09J7/00 , C09J123/08 , C09J131/04 , C09J201/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method for reliably forming a metal electrode pattern at an electrode on a semiconductor substrate by applying an adhesive sheet for releasing and removing a metal film to the metal film that is provided on the surface of an insulating part and an electrode part being provided on a semiconductor substrate, and appropriately releasing and removing a metal film on the surface of an insulation part by pulling and peeling. SOLUTION: This adhesive sheet for peeling and removing a metal film is used, where the ratio of holding modulus of elasticity (on peeling/and pasting) of an adhesive for composing the adhesion layer of the adhesive sheet is set to 5 or more when pasting or peeling the adhesive sheet.

5. 发明专利

JP2002252183A METHOD OF FORMING METAL ELECTRODE PATTERN 失效
公开(公告)号：JP2002252183A
公开(公告)日：2002-09-06
申请号：JP2001045962
申请日：2001-02-22
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , INO KOJI , KONDO ICHIJI
IPC分类号： H01L21/28 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a formation method for a metal electrode pattern by which the exfoliation and removal of the metal film can be efficiently performed by an adhesive sheet, in a method of forming a metal electrode pattern at the electrode part on a substrate, by sticking an adhesive sheet for exfoliation and removal of a metal film on the metal film provided on the surface of the insulating part and the electrode part made on a substrate, and then peeling off the adhesive sheet concerned thereby exfoliating and removing the metal film on the surface of the insulation part. SOLUTION: In the method of forming the metal electrode pattern at the electrode part on the substrate, the adhesive sheet is peeled off along a plate- shaped object, when peeling off the adhesive sheet.

6. 发明专利

JP2001284350A PATTERN-FORMING METHOD AND ADHESIVE SHEET FOR PEELING OFF THIN FILM 失效
公开(公告)号：JP2001284350A
公开(公告)日：2001-10-12
申请号：JP2000097364
申请日：2000-03-31
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , TERADA YOSHIO , NAMIKAWA AKIRA , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a thin-film pattern forming method using an adhesive sheet for peeling off a thin film, utilizable in methods of forming metal electrode patterns on a semiconductor substrate, etc., whereby a thin film pattern without contamination of adhesives, etc., can be formed surely. SOLUTION: In peeling off an adhesive sheet, an adhesive layer of this sheet is individualized about adhesion and set so as to separate the portions for peeling off a thin film from portions for not peeling it off, thus forming a desired pattern made of a thin film on a substrate.

7. 发明专利

JP2001284385A METHOD FOR FORMING METAL ELECTRODE PATTERN AND ADHESIVE SHEET FOR STRIPPING OFF METAL FILM 失效
公开(公告)号：JP2001284385A
公开(公告)日：2001-10-12
申请号：JP2000097188
申请日：2000-03-31
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , NANZAKI YOSHIHIRO , NAMIKAWA AKIRA , TERADA YOSHIO , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： H01L21/28 , H01L21/3205 , H01L21/60 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To surely provide a method for forming a metal electrode pattern at the electrode part on a semiconductor substrate, by attaching an adhesive sheet for stripping off a metal film to the metal film provided on the surface of an insulating part and the electrode part formed on the semiconductor substrate, and then stripping off the metal film well form the surface of the insulating part. SOLUTION: The adhesive, composing the adhesive layer of an adhesive sheet for stripping off a metal film, has an acid value of 10 or higher.

8. 发明专利

JP2014209564A 熱硬化性封止用シート、及び、セパレータ付き熱硬化性封止用シート审中-公开
标题翻译：热封密封片和隔热材料的热封密封片
公开(公告)号：JP2014209564A
公开(公告)日：2014-11-06
申请号：JP2014022235
申请日：2014-02-07
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： TOYODA HIDESHI , SHIMIZU YUSAKU , TORINARI GO , IINO CHIE
IPC分类号： H01L23/29 , B32B27/38 , C09J7/02 , C09J201/00 , C09K3/10 , H01L23/31
CPC分类号： B32B27/06 , H01L21/568
摘要：【課題】搬送時等に隅部が衝突し、シートに割れや欠けが発生することを抑制することが可能な熱硬化性封止用シートを提供すること。【解決手段】隅部にアールが形成されており、アールの曲率半径R1が0.5〜10mmの範囲内である熱硬化性封止用シート。【選択図】図1
摘要翻译：要解决的问题：提供一种热固性密封片，其能够在运输等期间通过拐角的碰撞来抑制片材中的裂纹和缺失。解热：在热固性密封片中，在每个中形成圆度角度，圆度的曲率半径R1在0.5〜10mm的范围内。

9. 发明专利

JP2014194959A Resin sheet for electronic device sealing, and method for manufacturing electronic device package 有权
标题翻译：用于电子设备密封的树脂片和用于制造电子设备包装的方法
公开(公告)号：JP2014194959A
公开(公告)日：2014-10-09
申请号：JP2013069886
申请日：2013-03-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TOYODA HIDESHI , SHIMIZU YUSAKU , ISHIZAKA TAKESHI
IPC分类号： H01L23/02 , C08J5/18 , H01L23/08
CPC分类号： C08J5/18 , H01L21/561 , H01L23/295 , H01L23/3107 , H01L24/16 , H01L24/97 , H01L2224/16225 , H01L2224/16245 , H01L2224/97 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H03H9/10 , H01L2224/81 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a resin sheet large in sheet thickness and reduced in a quantity of outgassing.SOLUTION: A resin sheet for electronic device sealing has a thickness of 100-2000 μm, and generates no more than 500 ppm of gas when being cured for one hour at 150°C.
摘要翻译：要解决的问题：提供大的板厚并减少排气量的树脂片。解决方案：一种用于电子器件密封的树脂片的厚度为100-2000μm，当不超过500ppm的气体时，在150℃下固化1小时。

10. 发明专利

JP2014107392A Semiconductor device manufacturing method 审中-公开
标题翻译：半导体器件制造方法
公开(公告)号：JP2014107392A
公开(公告)日：2014-06-09
申请号：JP2012258748
申请日：2012-11-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ISHII ATSUSHI , UENDA DAISUKE , TOYODA HIDESHI , SUZUKI AKIRA
IPC分类号： H01L25/04 , H01L23/52 , H01L25/18
CPC分类号： H01L23/145 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/5389 , H01L24/24 , H01L24/96 , H01L25/04 , H01L25/18 , H01L2224/04105 , H01L2224/24137 , H01L2924/3511 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which inhibits the occurrence of warpage when a thermosetting resin sheet is thermally cured after a plurality of semiconductor chips are buried in the thermosetting resin sheet.SOLUTION: The semiconductor device manufacturing method comprises: a process A of preparing a first laminate in which a first adhesive layer 24 is provided on a first base 22, a second laminate in which a second adhesive layer 34 is provided on a second base 32 and a third laminate which is provided between a surface of the first laminate on the first adhesive layer 24 side and a surface of the second laminate on the second adhesive layer 34 side and in which thermosetting resin sheets 40 in each of which a plurality of semiconductor chips 26 are buried are laminated; a process B of thermally curing the thermosetting resin sheets 40 of the third laminate; a process C of peeling the first laminate after thermally curing the thermosetting resin sheets 40 by using a bonded surface of the thermosetting resin sheets 40 and the first adhesive layer 24 of the first laminate as a boundary surface; and a process D of forming wiring on the thermosetting resin sheets 40 after peeling the first laminate.
摘要翻译：要解决的问题：提供一种半导体器件制造方法，其在多个半导体芯片被埋入热固性树脂片中之后，当热固性树脂片材热固化时，抑制翘曲的发生。解决方案：半导体器件制造方法包括：制备在第一基底22上设置第一粘合剂层24的第一层压体的方法A，在第二基底32上设置第二粘合剂层34的第二层压体和设置在第二基底32的表面之间的第三层压体第一粘合层24侧的第一层叠体和第二粘合层34侧的第二层叠体的表面层叠有多个半导体芯片26的热固性树脂片40，对第三层压体的热固性树脂片材40进行热固化的工序B; 通过使用热固性树脂片40的接合面和第一层叠体的第一粘合层24作为边界面热固化热固性树脂片40之后剥离第一层压体的工艺C; 以及在剥离第一层压体之后在热固性树脂片40上形成布线的工序D.

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