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1. 发明专利

JP2001284385A METHOD FOR FORMING METAL ELECTRODE PATTERN AND ADHESIVE SHEET FOR STRIPPING OFF METAL FILM 失效
公开(公告)号：JP2001284385A
公开(公告)日：2001-10-12
申请号：JP2000097188
申请日：2000-03-31
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , NANZAKI YOSHIHIRO , NAMIKAWA AKIRA , TERADA YOSHIO , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： H01L21/28 , H01L21/3205 , H01L21/60 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To surely provide a method for forming a metal electrode pattern at the electrode part on a semiconductor substrate, by attaching an adhesive sheet for stripping off a metal film to the metal film provided on the surface of an insulating part and the electrode part formed on the semiconductor substrate, and then stripping off the metal film well form the surface of the insulating part. SOLUTION: The adhesive, composing the adhesive layer of an adhesive sheet for stripping off a metal film, has an acid value of 10 or higher.

2. 发明专利

JP2002252183A METHOD OF FORMING METAL ELECTRODE PATTERN 失效
公开(公告)号：JP2002252183A
公开(公告)日：2002-09-06
申请号：JP2001045962
申请日：2001-02-22
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , INO KOJI , KONDO ICHIJI
IPC分类号： H01L21/28 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a formation method for a metal electrode pattern by which the exfoliation and removal of the metal film can be efficiently performed by an adhesive sheet, in a method of forming a metal electrode pattern at the electrode part on a substrate, by sticking an adhesive sheet for exfoliation and removal of a metal film on the metal film provided on the surface of the insulating part and the electrode part made on a substrate, and then peeling off the adhesive sheet concerned thereby exfoliating and removing the metal film on the surface of the insulation part. SOLUTION: In the method of forming the metal electrode pattern at the electrode part on the substrate, the adhesive sheet is peeled off along a plate- shaped object, when peeling off the adhesive sheet.

3. 发明专利

JP2001284350A PATTERN-FORMING METHOD AND ADHESIVE SHEET FOR PEELING OFF THIN FILM 失效
公开(公告)号：JP2001284350A
公开(公告)日：2001-10-12
申请号：JP2000097364
申请日：2000-03-31
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , TERADA YOSHIO , NAMIKAWA AKIRA , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a thin-film pattern forming method using an adhesive sheet for peeling off a thin film, utilizable in methods of forming metal electrode patterns on a semiconductor substrate, etc., whereby a thin film pattern without contamination of adhesives, etc., can be formed surely. SOLUTION: In peeling off an adhesive sheet, an adhesive layer of this sheet is individualized about adhesion and set so as to separate the portions for peeling off a thin film from portions for not peeling it off, thus forming a desired pattern made of a thin film on a substrate.

4. 发明专利

JP2003100758A METHOD FOR FORMING PATTERN AND PRESSURE SENSITIVE ADHESIVE SHEET FOR METAL FILM PATTERNING 审中-公开
公开(公告)号：JP2003100758A
公开(公告)日：2003-04-04
申请号：JP2001298331
申请日：2001-09-27
申请人： DENSO CORP , NITTO DENKO CORP
发明人： KONDO ICHIJI , NORITAKE CHIKAGE , SUZUKI MIKIMASA , TOYODA HIDESHI
IPC分类号： H01L29/43 , H01L21/28 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a method for patterning a metal film that facilitates peeling and the cost of which is low. SOLUTION: On the surface of a base where an aluminum thin film 3 as a first material and a polyimide film 4 as a second material different from the first material are exposed, a metal film 5 is formed and when patterning of the metal film 5 is carried out in such a way that the metal film 5 located on the aluminum thin film 3 is left and the metal film 5 located on the polyimide film 4 is peeled, a pressure sensitive adhesive sheet 8 is used to peel the metal film 5 and the surface is irradiated with reactive ions or radicals for refining as a process for preventing the metal film 5 from being peeled from the aluminum thin film 3 and for facilitating peeling on the surface of the polyimide film 4, then the desired metal film 5 is formed and the pressure sensitive adhesive sheet 8 is peeled off after it is pasted thereto.

5. 发明专利

JP2003100654A PATTERN FORMATION METHOD AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003100654A
公开(公告)日：2003-04-04
申请号：JP2001298326
申请日：2001-09-27
申请人： DENSO CORP , NITTO DENKO CORP
发明人： ISHIHARA YASUO , INOUE SHINGO , KONDO ICHIJI , TOYODA HIDESHI
IPC分类号： H01L21/28
摘要： PROBLEM TO BE SOLVED: To provide a pattern formation method in which a metal film can be patterned inside an opening in an insulating film with a new constitution. SOLUTION: An opening 3 whose end part is tapered is patterned to the insulating film 2 formed on a silicon substrate 1 comprising an N-type diffusion layer 4. A metal film 5, a metal film 6, and a metal film 7 are formed on the insulating film 2 inclusive of the inside of the opening 3. An adhesive sheet is pasted on the surface of the metal films 5, 6, 7, the adhesive sheet is then stripped, the metal films 5, 6, 7 are left inside the opening 3 including its taper part, the metal films 5, 6, 7 on the insulating film 2 in their circumference are removed so as to be patterned.

6. 发明专利

JP2002026049A SURFACE TREATING METHOD OF SUBSTRATE 失效
公开(公告)号：JP2002026049A
公开(公告)日：2002-01-25
申请号：JP2000206442
申请日：2000-07-07
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , NAMIKAWA AKIRA , NORITAKE CHIKAGE , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a surface treating method of a substrate having irregularities on the surface (e.g. a semiconductor substrate having protruding insulating parts and recessed electrode parts formed on the surface being used in the formation of a metal film pattern) in which only the protrusions can be reformed selectively in the fabrication of a semiconductor device. SOLUTION: Properties at the surface part of protrusions on a substrate (A) are varied selectively by touching the surface part of a planar or sheet-like article (B) only to the surface part of protrusions on the substrate (A) having irregularities on the surface.

7. 发明专利

JP2001345338A METAL ELECTRODE PATTERN FORMATION METHOD AND ADHESIVE SHEET FOR PEELING AND REMOVING METAL FILM 失效
公开(公告)号：JP2001345338A
公开(公告)日：2001-12-14
申请号：JP2000376017
申请日：2000-12-11
申请人： NITTO DENKO CORP , DENSO CORP
发明人： TOYODA HIDESHI , ICHIKAWA HIROKI , NAMIKAWA AKIRA , TERADA YOSHIO , NAKANO ICHIRO , IZUMITANI SEIJI , KONDO ICHIJI , MIYAJIMA TAKESHI
IPC分类号： C09J7/00 , C09J123/08 , C09J131/04 , C09J201/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method for reliably forming a metal electrode pattern at an electrode on a semiconductor substrate by applying an adhesive sheet for releasing and removing a metal film to the metal film that is provided on the surface of an insulating part and an electrode part being provided on a semiconductor substrate, and appropriately releasing and removing a metal film on the surface of an insulation part by pulling and peeling. SOLUTION: This adhesive sheet for peeling and removing a metal film is used, where the ratio of holding modulus of elasticity (on peeling/and pasting) of an adhesive for composing the adhesion layer of the adhesive sheet is set to 5 or more when pasting or peeling the adhesive sheet.

8. 发明专利

JP2005345305A Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：JP2005345305A
公开(公告)日：2005-12-15
申请号：JP2004166114
申请日：2004-06-03
申请人： Denso Corp , 株式会社デンソー
发明人： TANAKA HIROAKI , TOYODA INEO , KONDO ICHIJI , TOTANI MAKOTO
IPC分类号： G01L19/06
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor of a new constitution superior in resistance to corrosion.
SOLUTION: A pressure sensor chip 20 is fixed to a chip housing chamber R1 of a case member 1 in such a way that a surface of the pressure sensor chip 20 in which a pad (26a) is formed may be exposed from an opening part 4. A sheet 41 made of a resin of a flexible printed wiring board 40 is crimped to the case member 1 and the surface of the pressure sensor chip 20 in which the pad (26a) is formed to block the opening part 4 of the chip housing chamber R1 of the case member 1. A wire (42a) of the flexible printed wiring board 40 is joined to the pad (26a) of the pressure sensor chip 20. Their joined parts are sealed with the sheet 41 made of a resin of the flexible printed wiring board 40.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种耐腐蚀性优异的新型式的压力传感器。解决方案：将压力传感器芯片20固定到壳体构件1的芯片容纳室R1上，使得形成有垫（26a）的压力传感器芯片20的表面可以从开口部分4.由柔性印刷线路板40的树脂制成的片材41被卷曲到壳体构件1和形成有垫（26a）的压力传感器芯片20的表面以阻挡开口部分4的开口部分4 壳体构件1的芯片容纳室R1。柔性印刷布线板40的导线（42a）接合到压力传感器芯片20的焊盘（26a）。它们的接合部分用由柔性印刷电路板40的树脂。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005265555A Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：JP2005265555A
公开(公告)日：2005-09-29
申请号：JP2004077131
申请日：2004-03-17
申请人： Denso Corp , 株式会社デンソー
发明人： TOYODA INEO , TANAKA HIROAKI , KONDO ICHIJI , TOTANI MAKOTO
IPC分类号： G01L9/00 , B60C23/04 , G01L17/00 , G08C17/02 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a miniaturizable pressure sensor having excellent corrosion resistance. SOLUTION: This pressure sensor has a constitution wherein a pressure sensor chip 21 and a circuit chip 30 are loaded on a base plate 10, and a conductive pattern 42a serving as wiring and a conductive pattern 43 serving as an antenna are sealed by a thermoplastic resin sheet 41 on a wiring antenna board 40. The thermoplastic resin sheet 41 on a wiring antenna board 40 is thermo-compression bonded to the pressure sensor chip 21 and the circuit chip 30, and the conductive pattern 42a serving as the wiring is bonded to a pad 25a of the pressure sensor chip 21, and the conductive pattern 42a is bonded to a pad 31a of the circuit chip 30, and the conductive pattern 43 serving as the antenna is bonded to a pad 32a of the circuit chip 30, respectively, and each bonded part is sealed by the thermoplastic resin sheet 41. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异耐腐蚀性的小型化压力传感器。解决方案：该压力传感器具有将压力传感器芯片21和电路芯片30装载在基板10上的结构，并且用作布线的导电图案42a和用作天线的导电图案43被密封布线天线板40上的热塑性树脂片41.布线天线板40上的热塑性树脂片41被热压接合到压力传感器芯片21和电路芯片30，并且用作布线的导体图案42a 接合到压力传感器芯片21的焊盘25a，并且导电图案42a接合到电路芯片30的焊盘31a，并且用作天线的导电图案43被接合到电路芯片30的焊盘32a，并且每个接合部分被热塑性树脂片41密封。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2005039029A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2005039029A
公开(公告)日：2005-02-10
申请号：JP2003273932
申请日：2003-07-14
申请人： Denso Corp , 株式会社デンソー
发明人： MAYAMA KEIJI , MIURA SHOJI , KONDO ICHIJI
IPC分类号： H01L21/60
CPC分类号： H01L2224/05557 , H01L2224/13022 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent a conatct between a soldering member and a protective film in a semiconductor device having a metal electrode for soldering to an Al (aluminum) electrode formed on one side of a semiconductor substrate. SOLUTION: After the Al electrode 11 is formed on the one side of the semiconductor substrate 1, the protective film 12 is formd on the Al electrode 11, and an opening part 12a is formed in the protective film 12, the metal electrode 13 for soldering is formed on the surface of the Al electrode 11 seen through the opening part 12a, and the soldering member 60 is bonded to the metal electrode 13. An inner circumference end face 12b of the opening part 12a of the protective film 12 is shaped in taper having a taper angle θ3 smaller than a supplementary angle θ2 of a solder contacting angle θ1 of a shape of the solder member 60 after reflow, the metal electrode 13 is thnner than the protective film 12, and an upper surface of the metal electrode 13 is in the opening part 12a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止在具有用于焊接的金属电极的半导体器件中的焊接部件和保护膜之间的相互作用，形成在半导体基板的一侧上的Al（铝）电极。解决方案：在Al电极11形成在半导体衬底1的一侧之后，在Al电极11上形成保护膜12，并且在保护膜12中形成开口部12a，金属电极在通过开口部12a看到的Al电极11的表面上形成有用于焊接的电极13，焊接部件60接合到金属电极13.保护膜12的开口部12a的内周端面12b为形成为具有小于回流焊后的焊料60的形状的焊料接触角θ1的补角θ3的锥角θ3的锥形，金属电极13比保护膜12高，金属的上表面电极13位于开口部12a中。版权所有（C）2005，JPO＆NCIPI

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