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1. 发明授权

US4011808A Strapping band guide for automatic strapping machine 失效
标题翻译：自动捆扎机捆扎带导轨
公开(公告)号：US4011808A
公开(公告)日：1977-03-15
申请号：US600596
申请日：1975-07-31
申请人： Minoru Aoki , Yoshiaki Kasuga
发明人： Minoru Aoki , Yoshiaki Kasuga
IPC分类号： B65B13/06 , B65B13/04
CPC分类号： B65B13/06
摘要： Automatic band strapping apparatus with a table for supporting an article during banding. An arch frame extends in the form of an upright loop from one side to another of the table. The arch frame has an elongated side wall also in the form of an upright loop in a plane substantially normal to the table. An elongated U-sectioned arch guide made of flexible plastics material such as ultra-high molecular polyethylene has a loop shape following the contour of the arch frame side wall, and one edge surface facing that side wall is opened by means of a groove. Springs press the grooved edge surface of the arch guide against the arch frame side wall thereby defining a band passage through the arch guide which is normally closed. The arch guide is locally separable from the side wall against the urgence of the springs, progressively around the length of the arch frame, providing a moderate draw-out resistance to enable release and withdrawal of band progressively and continuously from the band passage. This maintains continuous tension in the band while it is being wrapped about the article in a straight path without twisting or meandering. The plastics arch guide has sufficient flexibility in a direction normal to the side wall to enable the springs to keep it seated against the side wall despite minor dimensional variations of the parts within manufacturing tolerances. Further, the arch guide is sufficiently flexible in the direction parallel to the side wall that it will remain seated against it, and the band passage thereby kept closed against inadvertent loss of band despite local or overall self-adjusting squirming or sliding movement of the arch guide against the arch frame side wall when in use.
摘要翻译：自动带束带装置，带有用于在捆扎期间支撑物品的工作台。拱形框架以直立环的形式从桌子的一侧延伸到另一侧。拱形框架具有在基本上垂直于桌子的平面中具有直立环形的细长侧壁。由柔性塑料材料如超高分子量聚乙烯制成的细长U形拱形导轨具有跟随拱形框架侧壁轮廓的环形形状，并且面向该侧壁的一个边缘表面通过凹槽打开。弹簧将拱形引导件的带槽的边缘表面压靠在拱形框架侧壁上，从而限定通过拱形引导件的通常关闭的带通道。拱形引导件可以根据弹簧的紧迫程度局部地从侧壁分离，逐渐围绕拱形框架的长度，提供适度的拉出阻力，以使带能够从带通道逐渐和连续地释放和退出。这样可以保持带中的持续张力，同时以直线的方式将物品缠绕在一起，而不会扭曲或曲折。塑料拱形导轨在垂直于侧壁的方向上具有足够的灵活性，以使得弹簧能够将其保持抵靠侧壁，尽管零件在制造公差内的尺寸变化很小。此外，拱形引导件在平行于侧壁的方向上具有足够的柔性，使得其将保持抵靠在其上，并且带通道由此保持关闭，以防止无意中的带的损失，尽管局部或整体自调节拱形的弯曲或滑动使用时对拱架侧壁的引导。

2. 再颁专利

USRE40261E1 Apparatus and method of partially transferring data through bus and bus master control device 有权
标题翻译：通过总线和总线主控装置部分传送数据的装置和方法
公开(公告)号：USRE40261E1
公开(公告)日：2008-04-22
申请号：US10234910
申请日：2002-09-04
申请人： Yuichi Hashimoto , Touru Kakiage , Masato Suzuki , Yoshiaki Kasuga , Jyunichi Yasui
发明人： Yuichi Hashimoto , Touru Kakiage , Masato Suzuki , Yoshiaki Kasuga , Jyunichi Yasui
IPC分类号： G06F13/00
CPC分类号： G06F13/28
摘要： A method of transferring data through a bus includes the steps of: occupying the bus by a first device serving as a bus master; transferring a first predetermined number of data items of all data items to be transferred while the first device is occupying the bus; determining if the first predetermined number of data items have been transferred; determining if the first device should release the bus based on whether or not there is a request from a second device after it is determined that the first predetermined number of data items have been transferred; and releasing the bus by the first deice when it is determined that the first device should release the bus.
摘要翻译：通过总线传送数据的方法包括以下步骤：由用作总线主机的第一设备占用总线; 在第一设备占用总线的同时传送要传送的所有数据项的第一预定数量的数据项; 确定第一预定数量的数据项是否已被传送; 在确定已经传送了第一预定数量的数据项之后，基于来自第二设备的请求来确定第一设备是否应该释放总线; 并且当确定第一设备应该释放总线时，通过第一设备释放总线。

3. 发明授权

US5767009A Structure of chip on chip mounting preventing from crosstalk noise 失效
标题翻译：片上芯片安装结构防止串扰噪声
公开(公告)号：US5767009A
公开(公告)日：1998-06-16
申请号：US798471
申请日：1997-02-10
申请人： Takayuki Yoshida , Takashi Otsuka , Hiroaki Fujimoto , Tadaaki Mimura , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga
发明人： Takayuki Yoshida , Takashi Otsuka , Hiroaki Fujimoto , Tadaaki Mimura , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga
IPC分类号： H01L21/56 , H01L23/552 , H01L25/065 , H01L25/18 , H01L21/44
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/552 , H01L24/29 , H01L25/18 , H01L2224/1147 , H01L2224/16145 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2225/06513 , H01L2225/06527 , H01L2225/06572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/14 , H01L2924/30105 , H01L2924/30107
摘要： The present invention reduces crosstalk noise, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip (1) having a first electrode pad (2) and a first wiring layer (9), and a second semiconductor chip (5) having a second electrode pad (6) and a second wiring layer (10). A bump (4) is provided for electrically coupling the first electrode pad (2) and the second electrode pad (6). An insulation layer 8 is disposed between confronting surfaces of the first semiconductor chip (1) and the second semiconductor chip (5). An electro-conductive layer (7) is disposed between the confronting surfaces of the first semiconductor chip and the second semiconductor chip.
摘要翻译：本发明减少串扰噪声，其是由于在第一半导体芯片的各个布线层的每一个中运行的信号与以小间隙堆叠在一起的第二半导体芯片之间的干扰而发生的。半导体器件包括具有第一电极焊盘（2）和第一布线层（9）的第一半导体芯片（1）和具有第二电极焊盘（6）和第二布线层 10）。提供凸起（4）用于电耦合第一电极焊盘（2）和第二电极焊盘（6）。绝缘层8设置在第一半导体芯片（1）和第二半导体芯片（5）的相对表面之间。导电层（7）设置在第一半导体芯片和第二半导体芯片的相对表面之间。

4. 发明授权

US5821625A Structure of chip on chip mounting preventing from crosstalk noise 失效
标题翻译：片上芯片安装结构防止串扰噪声
公开(公告)号：US5821625A
公开(公告)日：1998-10-13
申请号：US636651
申请日：1996-04-23
申请人： Takayuki Yoshida , Takashi Otsuka , Hiroaki Fujimoto , Tadaaki Mimura , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga
发明人： Takayuki Yoshida , Takashi Otsuka , Hiroaki Fujimoto , Tadaaki Mimura , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga
IPC分类号： H01L21/56 , H01L23/552 , H01L25/065 , H01L25/18 , H01L23/02 , H01L23/48
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/552 , H01L24/29 , H01L25/18 , H01L2224/1147 , H01L2224/16145 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2225/06513 , H01L2225/06527 , H01L2225/06572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/14 , H01L2924/30105 , H01L2924/30107
摘要： The present invention reduces crosstalk, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip 1 having a first electrode pad 2 and a first wiring layer 9 in the main surface, and a second semiconductor chip 5 having a second electrode pad 6 and a second wiring layer 10 in the main surface confronting the first semiconductor chip. A bump 4 is provided for electrically coupling the first electrode pad 2 and the second electrode pad 6 together. An insulation layer 8 is disposed between the main surfaces of first semiconductor chip 1 and second semiconductor chip 5. An electro-conductive layer 7 is disposed between the main confronting surfaces of the first semiconductor chip and the second semiconductor chip.
摘要翻译：本发明减少串扰，其是由于在第一半导体芯片的各个布线层的每一个中运行的信号与以小间隙堆叠在表面之间的第二半导体芯片之间的干扰而发生的。该半导体器件包括在主表面上具有第一电极焊盘2和第一布线层9的第一半导体芯片1和第二半导体芯片5，第二半导体芯片5在主表面中具有第二电极焊盘6和第二布线层10 第一个半导体芯片。凸块4被设置用于将第一电极焊盘2和第二电极焊盘6电耦合在一起。绝缘层8设置在第一半导体芯片1和第二半导体芯片5的主表面之间。导电层7设置在第一半导体芯片和第二半导体芯片的主要相对表面之间。

5. 发明授权

US4653394A Band feeding and tightening apparatus and method of feeding and tightening a band 失效
标题翻译：送带和收紧带的装置和送带方法
公开(公告)号：US4653394A
公开(公告)日：1987-03-31
申请号：US759312
申请日：1985-07-26
申请人： Yoshiaki Kasuga
发明人： Yoshiaki Kasuga
IPC分类号： B65B13/02 , B65B13/22
CPC分类号： B65B13/22
摘要： A band feeding and tightening apparatus for a band strapping machine comprises a main shaft rotatably placed at a lateral position of a serial connection of a motor and a reduction gear device; a high speed revolution transmitting means to transmit a rotational force at the high speed side of the reduction gear device to the main shaft; a low speed revolution transmitting means to transmit a rotational force at the low speed side of the reduction gear to the main shaft through an electromagnetic clutch; a stationary shaft placed in parallel to the main shaft, the stationary shaft rotatably supporting a feed roller and a power transmitting means to transmit a rotational force of the high speed revolution transmitting mean to the feed roller through a friction clutch; and the return roller mounted on the main shaft through a one-way clutch.
摘要翻译：用于带束带捆扎机的送带和收紧装置包括可旋转地设置在马达和减速装置的串联连接的横向位置的主轴; 高速旋转传递装置，用于将减速装置的高速侧的旋转力传递到主轴; 低速旋转传递装置，用于通过电磁离合器将减速齿轮的低速侧的旋转力传递到主轴; 平行于主轴设置的固定轴，可旋转地支撑进给辊的固定轴和通过摩擦离合器将高速旋转传递装置的旋转力传递给进给辊的动力传递装置; 并且通过单向离合器安装在主轴上的返回辊。

6. 发明授权

US5805865A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5805865A
公开(公告)日：1998-09-08
申请号：US721390
申请日：1996-09-26
申请人： Tadaaki Mimura , Takayuki Yoshida , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga , Hiroaki Fujimoto
发明人： Tadaaki Mimura , Takayuki Yoshida , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga , Hiroaki Fujimoto
IPC分类号： H01L21/60 , G06F11/22 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/00 , G06F13/00
CPC分类号： H01L25/18 , H01L25/0652 , H01L2224/16145 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701
摘要： A microcomputer chip is formed with a CPU core, a peripheral circuit, a built-in ROM, and a built-in RAM. An emulation functional chip is formed with an emulation control circuit for controlling the whole process of emulation. First electrode pads formed on the functional surface of the microcomputer chip are electrically interconnected to second electrode pads formed on the functional surface of the emulation functional chip with connecting bumps interposed therebetween. The microcomputer chip and the emulation functional chip are modularized using an insulating resin with the first electrode pads being connected to the second electrode pads.
摘要翻译：微型计算机芯片由CPU核心，外围电路，内置ROM和内置RAM形成。仿真功能芯片形成有用于控制整个仿真过程的仿真控制电路。形成在微计算机芯片的功能表面上的第一电极焊盘与形成在仿真功能芯片的功能表面上的第二电极焊盘电连接，其间具有连接凸块。微型计算机芯片和仿真功能芯片使用绝缘树脂进行模块化，其中第一电极焊盘连接到第二电极焊盘。

7. 发明授权

US4218969A Band feeding and tightening apparatus for strapping machine 失效
标题翻译：捆扎机送带捆扎机
公开(公告)号：US4218969A
公开(公告)日：1980-08-26
申请号：US8602
申请日：1979-02-01
申请人： Yoshiaki Kasuga
发明人： Yoshiaki Kasuga
IPC分类号： B65B13/22
CPC分类号： B65B13/22
摘要： A strapping machine comprises a return roller having a high friction outer peripheral surface and a feed roller having a low friction outer peripheral surface which are contacted with each other under pressure and the return roller is disposed in free condition during the rotation of the feed roller in one direction and when the feeding resistance of the band is increased, the band is slipped on the outer peripheral surface of the feed roller to prevent the feeding of the band and in order to tighten the band around the package, both of the rollers are reversely rotated at a high speed to tighten the band around an object to be packed and then continuously rotated at a low speed to impart high torque to the band for an attainment of further tightening thereof.
摘要翻译：捆扎机包括具有高摩擦外周面的返回辊和具有低摩擦外周面的进料辊，其在压力下彼此接触并且在进给辊旋转期间将返回辊设置在自由状态一个方向，并且当带的进给电阻增加时，带在进给辊的外周表面上滑动，以防止带的进给，并且为了使围绕包装的带紧固，两个辊都是反向的高速旋转以使待包装物体周围的带束紧，然后以低速连续旋转，以向带施加高扭矩以实现进一步收紧。

8. 发明授权

US4155799A Strapping machine 失效
标题翻译：捆扎机
公开(公告)号：US4155799A
公开(公告)日：1979-05-22
申请号：US795492
申请日：1977-05-10
申请人： Fukumatsu Matsushita , Yoshiaki Kasuga
发明人： Fukumatsu Matsushita , Yoshiaki Kasuga
IPC分类号： B65B13/32 , B65B13/22 , B32B35/00
CPC分类号： B65B13/22
摘要： A strapping machine comprises a roller for reversely rotating by a one way motor to tighten a package with a band, a differential reducing mechanism engaged to a clutch whereby the roller is reversely rotated at high speed before sliding the clutch and is further reversely rotated at low speed and high torque after sliding the clutch and a seal forming shaft starts when a return roller is stopped under a predetermined tension applied by tightening the band. The strapping machine further comprises a cutter anvil to contact the inner surfaces of the bands at the superposed part with a heating element inserted into the superposed part of the bands and a cutter for cutting the band under suitable tension after cooling the heat-sealed bands.
摘要翻译：一种捆扎机包括一个用于通过单向马达反向旋转以使带状物收紧的卷筒的辊子，与离合器接合的差速器减速机构，由此在滑动离合器之前辊子以高速反向旋转并进一步反转低速滑动离合器之后的高速和高扭矩，并且当通过收紧带施加预定的张力使止回辊停止时，启动密封成形轴。捆扎机还包括一个切割砧座，用于与叠置部分的带状物的内表面接合，插入到带的重叠部分中的加热元件和用于在冷却热封带之后在适当张力下切割带的切割器。

9. 发明授权

US6115767A Apparatus and method of partially transferring data through bus and bus master control device 失效
标题翻译：通过总线和总线主控装置部分传送数据的装置和方法
公开(公告)号：US6115767A
公开(公告)日：2000-09-05
申请号：US808017
申请日：1997-03-03
申请人： Yuichi Hashimoto , Touru Kakiage , Masato Suzuki , Yoshiaki Kasuga , Jyunichi Yasui
发明人： Yuichi Hashimoto , Touru Kakiage , Masato Suzuki , Yoshiaki Kasuga , Jyunichi Yasui
IPC分类号： G06F13/28 , G06F13/00
CPC分类号： G06F13/28
摘要： A method of transferring data through a bus includes the steps of: occupying the bus by a first device serving as a bus master; transferring a first predetermined number of data items of all data items to be transferred while the first device is occupying the bus; determining if the first predetermined number of data items have been transferred; determining if the first device should release the bus based on whether or not there is a request from a second device after it is determined that the first predetermined number of data items have been transferred; and releasing the bus by the first device when it is determined that the first device should release the bus.
摘要翻译：通过总线传送数据的方法包括以下步骤：由用作总线主机的第一设备占用总线; 在第一设备占用总线的同时传送要传送的所有数据项的第一预定数量的数据项; 确定第一预定数量的数据项是否已被传送; 在确定已经传送了第一预定数量的数据项之后，基于来自第二设备的请求来确定第一设备是否应该释放总线; 并且当确定第一设备应该释放总线时，由第一设备释放总线。

10. 发明授权

US5835505A Semiconductor integrated circuit and system incorporating the same 失效
标题翻译：半导体集成电路和系统结合在一起
公开(公告)号：US5835505A
公开(公告)日：1998-11-10
申请号：US843581
申请日：1997-04-16
申请人： Yoshito Nishimichi , Satoshi Ogura , Shinji Ozaki , Seiji Tokunoh , Akira Miyoshi , Hiroaki Yamamoto , Yoshiaki Kasuga
发明人： Yoshito Nishimichi , Satoshi Ogura , Shinji Ozaki , Seiji Tokunoh , Akira Miyoshi , Hiroaki Yamamoto , Yoshiaki Kasuga
IPC分类号： G06F11/36 , G01R31/28 , G11C29/00
CPC分类号： G06F11/3648
摘要： A semiconductor integrated circuit includes a functional block realizing at least part of a function of the semiconductor integrated circuit. The functional block includes a plurality of basic cells and a plurality of terminal cells. Each of the plurality of terminal cells has a connector for mediating a communication between another semiconductor integrated circuit and one of the plurality of basic cells.
摘要翻译：半导体集成电路包括实现半导体集成电路的功能的至少一部分的功能块。功能块包括多个基本单元和多个终端单元。多个终端单元中的每一个具有用于中介另一半导体集成电路与多个基本单元中的一个之间的通信的连接器。

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