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    • 4. 发明申请
    • DRAM DEVICES
    • DRAM设备
    • US20110006353A1
    • 2011-01-13
    • US12830788
    • 2010-07-06
    • Min-Sang KIMDong-Won KimJun SeoKeun-Hwi ChoHyun-Jun BaeJi-Myoung Lee
    • Min-Sang KIMDong-Won KimJun SeoKeun-Hwi ChoHyun-Jun BaeJi-Myoung Lee
    • H01L27/108
    • H01L27/10894H01L27/10814H01L27/10852H01L27/10855H01L28/60
    • A DRAM device includes a plug on a substrate, a conductive plate electrically connected to the plug and overlapping the substrate, at least one capacitor on the substrate and spaced apart from the plug, and at least one word line under the conductive plate and spaced apart from the conductive plate. The DRAM device further includes at least one first conductive pad under the conductive plate, the at least one first conductive pad being spaced apart from the conductive plate in a first state and being electrically connected to the conductive plate in a second state, the at least one first conductive pad being disposed between the plug and an adjacent word line of the at least one word line, and the at least one first conductive pad being electrically connected to a respective capacitor of the at least one capacitor.
    • DRAM装置包括在基板上的插头,电连接到插头并与衬底重叠的导电板,基板上的至少一个电容器和与插头间隔开的至少一个电容器,以及导电板下面的至少一个字线并间隔开 从导电板。 DRAM器件还包括在导电板下方的至少一个第一导电焊盘,所述至少一个第一导电焊盘在第一状态下与导电板间隔开并且在第二状态下电连接到导电板,至少 一个第一导电焊盘设置在所述插头和所述至少一个字线的相邻字线之间,并且所述至少一个第一导电焊盘电连接到所述至少一个电容器的相应电容器。
    • 8. 发明授权
    • Method of fabricating a semiconductor device
    • 制造半导体器件的方法
    • US07939436B2
    • 2011-05-10
    • US12353398
    • 2009-01-14
    • Sung-Min KimMin-Sang KimKeun-Hwi ChoJi-Myoung Lee
    • Sung-Min KimMin-Sang KimKeun-Hwi ChoJi-Myoung Lee
    • H01L21/20H01L21/36
    • H01L21/823425H01L21/28123H01L21/823437H01L21/823468H01L29/42376H01L29/66659H01L29/7835
    • A method of fabricating a semiconductor device forms a micro-sized gate, and mitigates short channel effects. The method includes a pull-back process to form the gate on a substrate. The method also includes forming inner and outer spacers on the gate that are asymmetric to one another with respect to the gate, and using the spacers in forming junction regions in the substrate on opposite sides of the gate. In particular, the inner and outer spacers are formed on opposite sides of the gate so as to have different thicknesses at the bottom of the gate. The inner and outer junction regions are formed by doping the substrate before and after the spacers are formed. Thus, the inner and outer junction regions have extension regions under the inner and outer spacers, respectively, and the extension regions have different lengths.
    • 制造半导体器件的方法形成微尺寸栅极,并减轻短沟道效应。 该方法包括在衬底上形成栅极的回拉工艺。 该方法还包括在栅极上形成相对于栅极彼此不对称的内部和外部间隔物,以及在栅极的相对侧上在衬底中形成接合区域的间隔物。 特别地,内部和外部间隔件形成在栅极的相对侧上,以便在栅极的底部具有不同的厚度。 通过在形成间隔物之前和之后掺杂衬底来形成内部和外部结区域。 因此,内部和外部连接区域分别在内部和外部间隔件下方具有延伸区域,并且延伸区域具有不同的长度。