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1. 发明授权

US4600839A Small-dimension measurement system by scanning electron beam 失效
标题翻译：通过扫描电子束的小尺寸测量系统
公开(公告)号：US4600839A
公开(公告)日：1986-07-15
申请号：US576324
申请日：1984-02-02
申请人： Mikio Ichihashi , Satoru Fukuhara , Masahide Okumura , Hisaya Murakoshi
发明人： Mikio Ichihashi , Satoru Fukuhara , Masahide Okumura , Hisaya Murakoshi
IPC分类号： G01B15/00 , G01R31/305 , H01J37/28 , G01N23/00
CPC分类号： H01J37/28 , G01B15/00 , G01R31/305
摘要： A small-dimension measurement system by scanning electron beam comprises an electron optical column including an electron source for emitting an electron beam to scan a sample, at least one pair of detectors disposed symmetrically with respect to an optical axis of the electron optical column for detecting position information from the sample by scanning of the electron beam, and a signal selecting circuit for subjecting the outputs of the paired detectors to a predetermined signal selection. The signal selecting circuit selectively and alternately provides maximum or peak portions of the outputs of the paired detectors which portions correspond to opposite edge portions of the sample. The output of the signal selecting circuit is applied to a signal processing circuit for conversion into a dimension of a predetermined pattern on the sample.
摘要翻译：通过扫描电子束的小尺寸测量系统包括电子光学柱，其包括用于发射电子束以扫描样品的电子源，至少一对相对于电子光学柱的光轴对称设置的检测器，用于检测通过扫描电子束从样品的位置信息，以及信号选择电路，用于对成对的检测器的输出进行预定的信号选择。信号选择电路选择性地并且交替地提供成对检测器的输出的最大值或峰值部分，这些部分对应于样品的相对边缘部分。信号选择电路的输出被施加到信号处理电路，以转换成样本上的预定图案的尺寸。

2. 发明授权

US4670652A Charged particle beam microprobe apparatus 失效
标题翻译：带电粒子束微探针装置
公开(公告)号：US4670652A
公开(公告)日：1987-06-02
申请号：US737478
申请日：1985-05-24
申请人： Mikio Ichihashi , Masahide Okumura , Satoru Fukuhara
发明人： Mikio Ichihashi , Masahide Okumura , Satoru Fukuhara
IPC分类号： H01J37/22 , G01B15/00 , G01B15/04 , G01B15/08 , G01N23/225 , H01J37/28
CPC分类号： H01J37/28
摘要： A charged particle beam microprobe apparatus capable of accurately determining the three-dimensional structure of a surface is disclosed in which a detection system including at least a pair of detectors disposed symmetrically with respect to the optical axis of an charged particle beam generating instrument is used for obtaining an image signal from a surface scanned with a charged particle beam, the image signal obtained by difference detection in the detection system is compared with a pair of variable reference levels opposite in polarity to each other, to be converted into positive and negative rectangular wave signals, and information on whether the scanned surface slopes upward or downward when viewed from the detection system and information on the gradient of the scanned surface are obtained from the polarity and pulse width of each of the positive and negative rectangular wave signals, respectively, to determine the three-dimensional structure of the scanned surface. That is, the charged particle beam apparatus does not utilize a phenomenon that the coefficient of backscattered electrons is proportional to the angle of slope of a primary beam impinging surface, and hence can use secondary electron suitable for forming a high resolution scanned image.
摘要翻译：公开了一种能够精确地确定表面的三维结构的带电粒子束微探针装置，其中使用包括至少一对相对于带电粒子束产生装置的光轴对称设置的检测器的检测系统从用带电粒子束扫描的表面获得图像信号，将通过检测系统中的差分检测获得的图像信号与彼此极性相反的一对可变参考电平进行比较，以被转换为正和负矩形波信号，以及关于从检测系统观察扫描表面是向上还是向下倾斜的信息以及关于扫描表面的梯度的信息的信息分别从正和负矩形波信号的极性和脉冲宽度获得到确定扫描表面的三维结构。也就是说，带电粒子束装置没有利用背散射电子的系数与主光束入射表面的倾斜角成比例的现象，因此可以使用适于形成高分辨率扫描图像的二次电子。

3. 发明申请

US20090057556A1 METHOD AND APPARATUS OF AN INSPECTION SYSTEM USING AN ELECTRON BEAM 失效
标题翻译：使用电子束检测系统的方法和装置
公开(公告)号：US20090057556A1
公开(公告)日：2009-03-05
申请号：US12211343
申请日：2008-09-16
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： G01N23/00
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
摘要翻译：通过提供新颖的检查方法和采用这种新方法的检测装置，本发明通过使用电子束的本发明解决了常规检查方法中遇到的问题和采用该方法的传统装置，该方法能够提高扫描样本的速度作为半导体晶片。本发明提供的检验新颖方法包括以下步骤：产生电子束; 通过使用物镜将生成的电子束会聚在样品上; 使用会聚电子束扫描样品; 扫描期间连续移动样品; 检测在样本和物镜之间的位置处从样本发出的带电粒子，并将检测到的带电粒子转换成电信号; 存储由电信号传送的图像信息; 通过使用存储的图像信息将图像与另一图像进行比较; 并检测样本的缺陷。

4. 发明授权

US06987265B2 Method and an apparatus of an inspection system using an electron beam 失效
公开(公告)号：US06987265B2
公开(公告)日：2006-01-17
申请号：US10083481
申请日：2002-02-27
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/28
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.

5. 发明授权

US06512227B2 Method and apparatus for inspecting patterns of a semiconductor device with an electron beam 有权
公开(公告)号：US06512227B2
公开(公告)日：2003-01-28
申请号：US09982965
申请日：2001-10-22
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Atsuko Takafuji , Hiroshi Toyama , Katsuya Sugiyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Atsuko Takafuji , Hiroshi Toyama , Katsuya Sugiyama
IPC分类号： G01N2300
CPC分类号： H01J37/28 , G01N23/04 , H01J2237/2817
摘要： An object of the present invention is to provide an inspection method using an electron beam and an inspection apparatus therefor, which are capable of enhancing the resolution, improving the inspection speed and reliability, and realizing miniaturization the apparatus. To achieve the above object, according to the present invention, there is provided an inspection method using an electron beam, including the steps of; applying a voltage on a sample via a sample stage; converging an electron beam on the sample; scanning the sample with the converged electron beam and simultaneously, continuously moving the sample stage; detecting charged particles generated from the sample; and detecting a defect on the sample on the basis of the detected charged particles; wherein a distance between the sample and the shield frame is determined on the basis of a critical discharge between the sample stage and the shield frame; coils of at least hexapoles for correcting the shape of an electron beam are provided; the electron beam is deflected for blanking during movement of the sample with the crossover of the electron beam taken as a fulcrum of blanking; or the magnitude of the voltage applied to the sample may be determined depending on the kind of sample.

6. 发明授权

US07232996B2 Method and an apparatus of an inspection system using an electron beam 失效
标题翻译：使用电子束的检查系统的方法和装置
公开(公告)号：US07232996B2
公开(公告)日：2007-06-19
申请号：US11319279
申请日：2005-12-29
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/28
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
摘要翻译：通过提供新颖的检查方法和采用这种新方法的检测装置，本发明通过使用电子束的本发明解决了常规检查方法中遇到的问题和采用该方法的传统装置，该方法能够提高扫描样本的速度作为半导体晶片。本发明提供的检验新颖方法包括以下步骤：产生电子束; 通过使用物镜将生成的电子束会聚在样品上; 使用会聚电子束扫描样品; 扫描期间连续移动样品; 检测在样本和物镜之间的位置处从样本发出的带电粒子，并将检测到的带电粒子转换成电信号; 存储由电信号传送的图像信息; 通过使用存储的图像信息将图像与另一图像进行比较; 并检测样本的缺陷。

7. 发明申请

US20120132801A1 METHOD AND AN APPARATUS OF AN INSPECTION SYSTEM USING AN ELECTRON BEAM 有权
标题翻译：使用电子束检测系统的方法和装置
公开(公告)号：US20120132801A1
公开(公告)日：2012-05-31
申请号：US13366874
申请日：2012-02-06
申请人： Yuko IWABUCHI , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko IWABUCHI , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/28
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
摘要翻译：通过提供新颖的检查方法和采用这种新方法的检测装置，本发明通过使用电子束的本发明解决了常规检查方法中遇到的问题和采用该方法的传统装置，该方法能够提高扫描样本的速度作为半导体晶片。本发明提供的检验新颖方法包括以下步骤：产生电子束; 通过使用物镜将生成的电子束会聚在样品上; 使用会聚电子束扫描样品; 扫描期间连续移动样品; 检测在样本和物镜之间的位置处从样本发出的带电粒子，并将检测到的带电粒子转换成电信号; 存储由电信号传送的图像信息; 通过使用所存储的图像信息将图像与另一图像进行比较; 并检测样本的缺陷。

8. 发明授权

US07439506B2 Method and an apparatus of an inspection system using an electron beam 失效
标题翻译：使用电子束的检查系统的方法和装置
公开(公告)号：US07439506B2
公开(公告)日：2008-10-21
申请号：US11798239
申请日：2007-05-11
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/256 , H01J37/244
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
摘要翻译：通过提供新颖的检查方法和采用这种新方法的检测装置，本发明通过使用电子束的本发明解决了常规检查方法中遇到的问题和采用该方法的传统装置，该方法能够提高扫描样本的速度作为半导体晶片。本发明提供的检验新颖方法包括以下步骤：产生电子束; 通过使用物镜将生成的电子束会聚在样品上; 使用会聚电子束扫描样品; 扫描期间连续移动样品; 检测在样本和物镜之间的位置处从样本发出的带电粒子，并将检测到的带电粒子转换成电信号; 存储由电信号传送的图像信息; 通过使用所存储的图像信息将图像与另一图像进行比较; 并检测样本的缺陷。

9. 发明授权

US4605860A Apparatus for focusing a charged particle beam onto a specimen 失效
标题翻译：用于将带电粒子束聚焦到样本上的装置
公开(公告)号：US4605860A
公开(公告)日：1986-08-12
申请号：US654457
申请日：1984-09-26
申请人： Satoru Fukuhara , Mikio Ichihashi , Hisaya Murakoshi , Shigemitsu Seitoh
发明人： Satoru Fukuhara , Mikio Ichihashi , Hisaya Murakoshi , Shigemitsu Seitoh
IPC分类号： H01J37/21 , H01J37/28 , H01J37/304 , G01K1/08 , H01J3/14
CPC分类号： H01J37/304 , H01J37/21
摘要： Disclosed is an apparatus for focusing a charged particle beam onto a speciman, which comprises a scanner for scanning a pre-formed standard pattern with a charged particle beam, a converging unit capable of converging the charged particle beam onto a specimen, a detector for detecting secondary charged particles emitted as a result of scanning the standard pattern by the scanner, a circuit for deriving a standard frequency component determined by the period of scanning with the charged particle beam and the shape of the portion of the standard pattern in the region being scanned with the charged particle beam, and a circuit cooperating with the converging unit for finding the maximum value of the amplitude of the standard frequency component thereby identifying attainment of focusing of the charged particle beam with high accuracy.
摘要翻译：公开了一种用于将带电粒子束聚焦到标本上的装置，其包括用于利用带电粒子束扫描预形成的标准图案的扫描器，能够将带电粒子束收敛到样本上的会聚单元，用于检测的检测器作为由扫描仪扫描标准图案的结果而发射的二次带电粒子，用于导出由带电粒子束扫描的周期确定的标准频率分量的电路和被扫描的区域中的标准图案的部分的形状带电粒子束，以及与会聚单元配合的电路，用于找到标准频率分量的振幅的最大值，从而以高精度识别带电粒子束的聚焦。

10. 发明授权

US08604430B2 Method and an apparatus of an inspection system using an electron beam 有权
标题翻译：使用电子束的检查系统的方法和装置
公开(公告)号：US08604430B2
公开(公告)日：2013-12-10
申请号：US13366874
申请日：2012-02-06
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/28
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： The inspection apparatus disclosed generates an electron beam, an acceleration electrode accelerates the electron beam, a convergence lens converges the electron beam, an electron beam deflector scans the beam over a sample, an objective lens converges the electron beam on the sample, a detector located between the sample and the objective lens detects charged particles emitted from the sample, a power supply applies a retarding voltage to the sample for decelerating the electron beam to the sample, an electrode is disposed between the objective lens and the sample, and a voltage is generated between the sample and the electrode by said electrode, the voltage being determined depending on the sample. The apparatus solves problems encountered in conventional inspection systems.
摘要翻译：所公开的检查装置产生电子束，加速电极加速电子束，会聚透镜会聚电子束，电子束偏转器扫描样品上的光束，物镜会将电子束会聚在样品上，检测器位于在样品和物镜之间检测从样品发射的带电粒子，电源向样品施加延迟电压以将电子束减速到样品，电极设置在物镜和样品之间，电压为通过所述电极在样品和电极之间产生，电压根据样品确定。该装置解决了常规检测系统遇到的问题。

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