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    • 1. 发明授权
    • Method for double patterning lithography
    • 双重图案光刻的方法
    • US07913197B1
    • 2011-03-22
    • US12035413
    • 2008-02-21
    • Michiel Victor Paul KrugerBayram YenikayaAnwei LiuAbdurrahman SezginerWolf Staud
    • Michiel Victor Paul KrugerBayram YenikayaAnwei LiuAbdurrahman SezginerWolf Staud
    • G06F17/50G06F19/00G03F1/00G21K5/00
    • G03F7/70466G03F7/70475
    • According to various embodiments of the invention systems and methods for multiple pattern lithography, wherein a target layout pattern that is not capable of being printed in one lithography step is decomposed into multiple patterns that are printable in one lithography operation and, when appropriate, a continuous junction is utilized for where patterns overlap. In a further embodiment, where a continuous junction is not utilized, a splice is utilized at overlap locations. In yet another embodiment, where splices are utilized for overlap locations, identifying where critical nets are located in the target layout pattern, determining how close a component of the critical net is to a splice, and changing the target layout pattern as to avoid the condition of a component of the critical net being in proximity to a splice. In another embodiment of the invention, where splices are utilized at overlap locations, placing a landing pad of contacts or vias at the same location as the splice.
    • 根据本发明的各种实施例,用于多图案光刻的系统和方法,其中不能在一个光刻步骤中打印的目标布局图案被分解成可在一个光刻操作中可打印的多个图案,并且在适当时将其连续 结点用于图案重叠的位置。 在另一实施例中,在不使用连续结的情况下,在重叠位置处使用接头。 在另一个实施例中,其中接头用于重叠位置,识别关键网位于目标布局图案中的位置,确定关键网络的部件对拼接有多接近,并且改变目标布局图案以避免条件 关键网的组件位于接头附近。 在本发明的另一个实施例中,其中在重叠位置处使用接头时,将接触点或通孔的接合垫放置在与接头相同的位置处。
    • 3. 发明授权
    • Method for checking printability of a lithography target
    • 用于检查光刻目标的可印刷性的方法
    • US07568174B2
    • 2009-07-28
    • US11504928
    • 2006-08-16
    • Abdurrahman SezginerBayram Yenikaya
    • Abdurrahman SezginerBayram Yenikaya
    • G06F17/50
    • G03F7/70441G03F1/36G03F7/705
    • A technique for determining, without having to perform optical proximity correction, when the result of optical proximity correction will fail to meet the design requirements for printability. A disclosed embodiment has application to a process for producing a photomask for use in the printing of a pattern on a wafer by exposure with optical radiation to optically image the photomask on the wafer. A method is set forth for checking the printability of a target layout proposed for defining the photomask, including the following steps: deriving a system of inequalities that expresses a set of design requirements with respect to the target layout; and checking the printability of the target layout by determining whether the system of inequalities is feasible.
    • 当光学邻近校正的结果不能满足可印刷性的设计要求时,确定无需进行光学邻近校正的技术。 所公开的实施例应用于制造光掩模的方法,该光掩模用于通过用光辐射曝光来在晶片上印刷图案以将晶片上的光掩模光学成像。 提出了一种用于检查建议用于定义光掩模的目标布局的可印刷性的方法,包括以下步骤:导出表示相对于目标布局的一组设计要求的不等式系统; 并通过确定不等式系统是否可行来检查目标布局的可印刷性。
    • 10. 发明申请
    • Method for checking printability of a lithography target
    • 用于检查光刻目标的可印刷性的方法
    • US20070094634A1
    • 2007-04-26
    • US11504928
    • 2006-08-16
    • Abdurrahman SeizginerBayram Yenikaya
    • Abdurrahman SeizginerBayram Yenikaya
    • G06F17/50
    • G03F7/70441G03F1/36G03F7/705
    • A technique for determining, without having to perform optical proximity correction, when the result of optical proximity correction will fail to meet the design requirements for printability. A disclosed embodiment has application to a process for producing a photomask for use in the printing of a pattern on a wafer by exposure with optical radiation to optically image the photomask on the wafer. A method is set forth for checking the printability of a target layout proposed for defining the photomask, including the following steps: deriving a system of inequalities that expresses a set of design requirements with respect to the target layout; and checking the printability of the target layout by determining whether the system of inequalities is feasible.
    • 当光学邻近校正的结果不能满足可印刷性的设计要求时,确定无需进行光学邻近校正的技术。 所公开的实施例应用于制造光掩模的方法,该光掩模用于通过用光辐射曝光来在晶片上印刷图案以将晶片上的光掩模光学成像。 提出了一种用于检查建议用于定义光掩模的目标布局的可印刷性的方法,包括以下步骤:导出表示相对于目标布局的一组设计要求的不等式系统; 并通过确定不等式系统是否可行来检查目标布局的可印刷性。