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1. 发明授权

US6110624A Multiple polarity mask exposure method 失效
标题翻译：多极性掩模曝光方法
公开(公告)号：US6110624A
公开(公告)日：2000-08-29
申请号：US225114
申请日：1999-01-04
申请人： Michael S. Hibbs , Timothy E. Neary , David S. O'Grady , Denis M. Rigaill
发明人： Michael S. Hibbs , Timothy E. Neary , David S. O'Grady , Denis M. Rigaill
IPC分类号： G03F7/095 , G03F7/20 , H05K3/06 , G03F9/00 , G03C5/00
CPC分类号： G03F7/095 , G03F7/2022 , G03F7/2037 , H05K3/064 , H05K2203/0505 , H05K2203/0577
摘要： A patterned mask and method of forming a patterned mask over a substrate, comprising forming a first resist layer over the substrate, forming a second resist layer over the first resist layer, patterning the first resist using energy selective to the first resist layer to form a first patterned resist, and patterning the second resist using energy selective to the second resist layer to form a second patterned resist, wherein the first patterned resist and the second patterned resist form the patterned mask.
摘要翻译：一种图案化掩模和在衬底上形成图案化掩模的方法，包括在衬底上形成第一抗蚀剂层，在第一抗蚀剂层上形成第二抗蚀剂层，使用对第一抗蚀剂层的能量选择性形成第一抗蚀剂以形成第一抗蚀剂层，并且使用对第二抗蚀剂层选择性的能量来形成第二抗蚀剂以形成第二图案化抗蚀剂，其中第一图案化抗蚀剂和第二图案化抗蚀剂形成图案化掩模。

2. 发明授权

US06190836B1 Methods for repair of photomasks 失效
标题翻译：修复光掩模的方法
公开(公告)号：US06190836B1
公开(公告)日：2001-02-20
申请号：US09561560
申请日：2000-04-28
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： G03C500
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
摘要翻译：修复掩模上的缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射，激光烧蚀引起的石英点蚀，激光沉积染色和FIB引起的镓染色而对掩模的清晰区域的损害的步骤。涂层是金属，聚合物或碳材料。涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。包含薄铜层的涂层显着地改善了用离子束的成像，同时保护掩模的清除区域不受FIB染色。由光敏聚合物形成的涂层用于蚀刻不透明缺陷。虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域，然后在随后的FIB沉积步骤中修复这些产生的明确缺陷，而铜涂层保护相邻的清晰区域免受FIB染色。在另一个实施例中，用短脉冲持续时间激光修复不透明缺陷，而不损害下面的石英或相邻的透明区域，同时避免了涂层的需要。

3. 发明授权

US6165649A Methods for repair of photomasks 失效
公开(公告)号：US6165649A
公开(公告)日：2000-12-26
申请号：US786061
申请日：1997-01-21
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： B23K26/06 , G03F1/74 , H01L21/027 , G03F9/00
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.

4. 发明授权

US6090507A Methods for repair of photomasks 有权
标题翻译：修复光掩模的方法
公开(公告)号：US6090507A
公开(公告)日：2000-07-18
申请号：US261638
申请日：1999-03-03
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： B23K26/06 , G03F1/74 , H01L21/027 , G03F9/00
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
摘要翻译：修复掩模缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射，激光烧蚀引起的石英点蚀，激光沉积染色和FIB引起的镓染色而对掩模的透明区域的损害的步骤。涂层是金属，聚合物或碳材料。涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。包含薄铜层的涂层显着地改善了用离子束的成像，同时保护掩模的清除区域不受FIB染色。由光敏聚合物形成的涂层用于蚀刻不透明缺陷。虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域，然后在随后的FIB沉积步骤中修复这些产生的明确缺陷，而铜涂层保护相邻的清晰区域免受FIB染色。在另一个实施例中，用短脉冲持续时间激光修复不透明缺陷，而不损害下面的石英或相邻的透明区域，同时避免了涂层的需要。

5. 发明授权

US06582857B1 Repair of masks to promote adhesion of patches 有权
标题翻译：修复口罩以促进贴片的粘附
公开(公告)号：US06582857B1
公开(公告)日：2003-06-24
申请号：US09526858
申请日：2000-03-16
申请人： Philip S. Flanigan , Dennis M. Hayden , Michael S. Hibbs , Timothy E. Neary
发明人： Philip S. Flanigan , Dennis M. Hayden , Michael S. Hibbs , Timothy E. Neary
IPC分类号： G03F900
CPC分类号： G03F1/72 , G03F1/26 , G03F1/74
摘要： The current invention performs short pulse laser ablation of clear defect regions on a mask prior to patching the clear defect regions. The short-pulse laser ablation removes any residue that absorbs light. Thus, the ablation completely cleans the surface of the clear defect regions, meaning that any patches of the surface will better adhere to the surface of the mask. This is particularly important during those situations where a later etch of a conductive surface added to the mask creates a solvent because the etchant interacts with residue on the mask, and wherein the solvent attacks the patch material at the patch material's interface.
摘要翻译：本发明在修补清晰的缺陷区域之前对掩模上的清晰缺陷区进行短脉冲激光烧蚀。短脉冲激光烧蚀消除了吸收光的残留物。因此，消融完全清洁透明缺陷区域的表面，意味着表面的任何贴片将更好地粘附到掩模的表面。这在这些情况下特别重要，在这些情况下，添加到掩模中的导电表面的后续蚀刻产生溶剂，因为蚀刻剂与掩模上的残余物相互作用，并且其中溶剂在补片材料的界面处攻击补片材料。

6. 发明授权

US6156461A Method for repair of photomasks 有权
标题翻译：光掩模修复方法
公开(公告)号：US6156461A
公开(公告)日：2000-12-05
申请号：US504031
申请日：2000-02-14
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： B23K26/06 , G03F1/74 , H01L21/027 , G03S9/00
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
摘要翻译：修复掩模上的缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射，激光烧蚀引起的石英点蚀，激光沉积染色和FIB引起的镓染色而对掩模的清晰区域的损害的步骤。涂层是金属，聚合物或碳材料。涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。包含薄铜层的涂层显着地改善了用离子束的成像，同时保护掩模的清除区域不受FIB染色。由光敏聚合物形成的涂层用于蚀刻不透明缺陷。虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域，然后在随后的FIB沉积步骤中修复这些产生的明确缺陷，而铜涂层保护相邻的清晰区域免受FIB染色。在另一个实施例中，用短脉冲持续时间激光修复不透明缺陷，而不损害下面的石英或相邻的透明区域，同时避免了涂层的需要。

7. 发明授权

US08110321B2 Method of manufacture of damascene reticle 有权
标题翻译：镶嵌光罩的制造方法
公开(公告)号：US08110321B2
公开(公告)日：2012-02-07
申请号：US11749384
申请日：2007-05-16
申请人： Kevin S. Petrarca , Donald F. Canaperi , Mahadevaiyer Krishnan , Rebecca D. Mih , Steven Steen , Henry Grabarz , Michael S. Hibbs
发明人： Kevin S. Petrarca , Donald F. Canaperi , Mahadevaiyer Krishnan , Rebecca D. Mih , Steven Steen , Henry Grabarz , Michael S. Hibbs
IPC分类号： G03F1/16 , B24B5/00
CPC分类号： G03F1/00 , G03F1/26 , G03F1/50
摘要： A method for manufacturing an optical projection reticle employs a damascene process. First feature recesses are etched into a projection reticle mask plate which is transmissive or transparent. Then feature recesses are tilled with a radiation transmissivity modifying material comprising a partially transmissive material and/or a radiation absorber for absorbing actinic radiation. Sacrificial materials may be added to the recess temporarily prior to filling the recess to provide gaps juxtaposed with the material filling the recess. Thereafter, the sacrificial materials are removed. Then the projection mask is planarized leaving feature recesses filled with transmissivity modifying material, and any gaps desired. The projection mask is planarized while retained in a fixture holding it in place during polishing with a polishing tool and a slurry.
摘要翻译：光学投影掩模版的制造方法采用镶嵌工艺。第一特征凹槽被蚀刻到透射或透明的突出掩模掩模板中。然后，特征凹部用包括用于吸收光化辐射的部分透射材料和/或辐射吸收体的辐射透射率改性材料研磨。牺牲材料可以在填充凹部之前临时添加到凹部中，以提供与填充凹部的材料并置的间隙。此后，去除牺牲材料。然后将投影掩模平坦化，留下填充有透射率改性材料的特征凹部，以及任何期望的间隙。投影面罩被平坦化，同时保持在用抛光工具和浆料抛光过程中将其固定在位置的夹具中。

8. 发明授权

US06627361B2 Assist features for contact hole mask patterns 失效
标题翻译：辅助接触孔掩模图案的功能
公开(公告)号：US06627361B2
公开(公告)日：2003-09-30
申请号：US09901241
申请日：2001-07-09
申请人： Orest Bula , Michael S. Hibbs , Steven J. Holmes , Paul A. Rabidoux
发明人： Orest Bula , Michael S. Hibbs , Steven J. Holmes , Paul A. Rabidoux
IPC分类号： G03F900
CPC分类号： G03F1/36 , G03F7/095
摘要： An assist feature is formed on a lithographic reticle or mask using a hybrid resist and an exposure dose such that only an annular area is effectively exposed having a width that is potentially less than the minimum feature size that can be resolved by the mask exposure tool to simultaneously or sequentially form both a feature of interest and an assist feature for enhancing imaging of the feature of interest when the feature is printed to a wafer. Since the assist feature can be imaged simultaneously with the feature of interest or multiple assist features imaged concurrently, possibly between closely spaced features, data volume and mask writing time are greatly reduced. The invention is particularly applicable to the scaling of contact holes for connections to active devices in extremely high density integrated circuits.
摘要翻译：使用混合抗蚀剂和曝光剂量在光刻掩模版或掩模上形成辅助特征，使得只有环形区域被有效地暴露，其宽度可能小于可由掩模曝光工具解析的最小特征尺寸，同时或顺序地形成感兴趣的特征和当将特征印刷到晶片时增强感兴趣特征的成像的辅助特征。由于可以与感兴趣的特征或同时成像的多个辅助特征（可能在紧密间隔的特征之间）同时成像辅助特征，所以数据量和掩模写入时间被大大减少。本发明特别适用于用于连接到极高密度集成电路中的有源器件的接触孔的缩放。

9. 发明申请

US20110239169A1 EMF CORRECTION MODEL CALIBRATION USING ASYMMETRY FACTOR DATA OBTAINED FROM AERIAL IMAGES OR A PATTERNED LAYER 有权
标题翻译： EMF校正模型校准使用不对称因子数据从空中图像或图形层
公开(公告)号：US20110239169A1
公开(公告)日：2011-09-29
申请号：US12748513
申请日：2010-03-29
申请人： Jaione Tirapu-Azpiroz , Timothy A. Brunner , Michael S. Hibbs , Alan E. Rosenbluth
发明人： Jaione Tirapu-Azpiroz , Timothy A. Brunner , Michael S. Hibbs , Alan E. Rosenbluth
IPC分类号： G06F17/50
CPC分类号： G03F1/38 , G03F1/70 , G03F7/70283 , G03F7/70441
摘要： A computer-implemented method is provided for generating an electromagnetic field (EMF) correction boundary layer (BL) model corresponding to a mask, which can include using a computer to perform a method, in which asymmetry factor data is determined from aerial image measurements of a plurality of different gratings representative of features provided on a mask, wherein the aerial image measurements having been made at a plurality of different focus settings. The method may also include determining boundary layer (BL) model parameters of an EMF correction BL model corresponding to the mask by fitting to the asymmetry factor measurements. Alternatively, the asymmetry factor data can be determined from measurements of line widths of photoresist patterns, wherein the photoresist patterns correspond to images cast by a plurality of gratings at a plurality of different defocus distances, and the gratings can be representative of features of a mask.
摘要翻译：提供了一种计算机实现的方法，用于产生对应于掩模的电磁场（EMF）校正边界层（BL）模型，其可以包括使用计算机执行一种方法，其中由不确定因素数据从空间图像测量代表提供在掩模上的特征的多个不同光栅，其中已经在多个不同焦点设置进行了空间图像测量。该方法还可以包括通过拟合不对称因子测量来确定对应于掩模的EMF校正BL模型的边界层（BL）模型参数。或者，可以通过对光致抗蚀剂图案的线宽度的测量来确定不对称因子数据，其中光致抗蚀剂图案对应于由多个不同散焦距离处的多个光栅投射的图像，并且光栅可以代表掩模的特征。

10. 发明授权

US07257247B2 Mask defect analysis system 失效
标题翻译：面膜缺陷分析系统
公开(公告)号：US07257247B2
公开(公告)日：2007-08-14
申请号：US09683836
申请日：2002-02-21
申请人： James A. Bruce , Orest Bula , Edward W. Conrad , William C. Leipold , Michael S. Hibbs , Joshua J. Krueger
发明人： James A. Bruce , Orest Bula , Edward W. Conrad , William C. Leipold , Michael S. Hibbs , Joshua J. Krueger
IPC分类号： G06K9/00
CPC分类号： G03F1/84
摘要： An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.
摘要翻译：提出了一种用于分析半导体制造过程中的掩模缺陷的自动化系统。该系统将来自检查工具的结果和来自被检查的每个掩模层的设计数据存储库的设计布局数据与计算机程序和预定规则集相结合，以确定给定掩模层上的缺陷何时发生。掩模检查结果包括缺陷的存在，位置和类型（透明或不透明）。最终，根据缺陷是否可能导致产品故障，确定是否废除，修理或接受给定的掩模。将缺陷检查数据应用于被检查的每个掩模层的设计布局数据防止当所识别的缺陷不在掩模的关键区域时被报废。

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