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    • 1. 发明授权
    • EMF correction model calibration using asymmetry factor data obtained from aerial images or a patterned layer
    • 使用从空间图像或图案层获得的不对称因子数据进行EMF校正模型校准
    • US08271910B2
    • 2012-09-18
    • US12748513
    • 2010-03-29
    • Jaione Tirapu-AzpirozTimothy A. BrunnerMichael S. HibbsAlan E. Rosenbluth
    • Jaione Tirapu-AzpirozTimothy A. BrunnerMichael S. HibbsAlan E. Rosenbluth
    • G06F17/50
    • G03F1/38G03F1/70G03F7/70283G03F7/70441
    • A computer-implemented method is provided for generating an electromagnetic field (EMF) correction boundary layer (BL) model corresponding to a mask, which can include using a computer to perform a method, in which asymmetry factor data is determined from aerial image measurements of a plurality of different gratings representative of features provided on a mask, wherein the aerial image measurements having been made at a plurality of different focus settings. The method may also include determining boundary layer (BL) model parameters of an EMF correction BL model corresponding to the mask by fitting to the asymmetry factor measurements. Alternatively, the asymmetry factor data can be determined from measurements of line widths of photoresist patterns, wherein the photoresist patterns correspond to images cast by a plurality of gratings at a plurality of different defocus distances, and the gratings can be representative of features of a mask.
    • 提供了一种计算机实现的方法,用于产生对应于掩模的电磁场(EMF)校正边界层(BL)模型,其可以包括使用计算机执行一种方法,其中由不确定因素数据从空间图像测量 代表提供在掩模上的特征的多个不同光栅,其中已经在多个不同焦点设置进行了空间图像测量。 该方法还可以包括通过拟合不对称因子测量来确定对应于掩模的EMF校正BL模型的边界层(BL)模型参数。 或者,可以通过对光致抗蚀剂图案的线宽度的测量来确定不对称因子数据,其中光致抗蚀剂图案对应于由多个不同散焦距离处的多个光栅投射的图像,并且光栅可以代表掩模的特征 。
    • 3. 发明授权
    • Apparatus and method for inspection of photolithographic mask
    • 用于光刻掩模检查的装置和方法
    • US06950183B2
    • 2005-09-27
    • US10248808
    • 2003-02-20
    • Timothy A. BrunnerMichael S. HibbsChristopher J. Progler
    • Timothy A. BrunnerMichael S. HibbsChristopher J. Progler
    • G01N21/956G01N21/88
    • G01N21/95692
    • A method for inspecting masks used to project patterns in photolithographic imaging comprises initially providing a photolithographic mask having a pattern field thereon, where in normal production use the pattern is transferred by a reduction projector as a demagnified pattern on a production substrate, and providing a movable field-defining aperture adjacent the mask, the aperture having a field area less than, and capable of defining a pattern subfield comprising only a portion of the entire photolithographic mask pattern field. The method then includes aligning the field-defining aperture with a pattern subfield comprising only a portion of the entire photolithographic mask pattern field. Using an energy source, the method includes projecting the pattern subfield onto a test substrate and exposing onto the test substrate the pattern subfield at a size between that normally exposed on a production substrate and the actual size of the pattern subfield on the photolithographic mask. Subsequently, the method includes inspecting the exposed pattern subfield on the test substrate for defects in the photolithographic mask.
    • 用于检查用于在光刻成像中投影图案的掩模的方法包括首先提供其上具有图案场的光刻掩模,其中在正常生产中使用图案通过缩小投影仪作为缩小图案转印在生产基板上,并且提供可移动 与该掩模相邻的场限定孔径,该孔径具有小于并且能够限定仅包括整个光刻掩模图案场的一部分的图案子场的场区域。 该方法然后包括将场限定孔与仅包括整个光刻掩模图案场的一部分的图案子场对准。 使用能量源,该方法包括将图案子场投射到测试基板上,并以通常暴露在生产基板上的尺寸与光刻掩模上的图案子场的实际尺寸之间的尺寸将图案子区域暴露在测试基板上。 随后,该方法包括检查在光刻掩模中的缺陷的测试基板上的曝光图案子场。
    • 6. 发明申请
    • PELLICLE FILM OPTIMIZED FOR IMMERSION LITHOGRAPHY SYSTEMS WITH NA>1
    • 优化的薄膜电影,用于具有NA> 1的倾斜光刻系统
    • US20080182180A1
    • 2008-07-31
    • US11669175
    • 2007-01-31
    • Timothy A. BrunnerMichael S. Hibbs
    • Timothy A. BrunnerMichael S. Hibbs
    • B32B7/00G03F5/00
    • G03F1/62G03F7/11Y10T428/24
    • An optical pellicle to protect a photomask from particulate contamination during semiconductor lithography is provided which has enhanced transparency and operational characteristics. The pellicle utilizes alternating layers of a transparent polymer and a transparent inorganic layer to form pellicles which have high transmission properties and high strength. In a preferred pellicle, a three-layer pellicle is provided having a transparent inorganic layer sandwiched between two polymer layers. A five-layer pellicle is also provided with the outer layers and a middle layer being polymer layers and the inner layers an inorganic material. The preferred polymer layer is a perfluorinated polymer such as Teflon® and the preferred inorganic material is silicon dioxide. The pellicle of the invention provides light transmission of greater than 0.99% at incident light angles up to arcsine 0.45.
    • 提供了在半导体光刻期间保护光掩模免受颗粒污染的光学防护薄膜,其具有增强的透明度和操作特性。 防护薄膜组件利用透明聚合物和透明无机层的交替层来形成具有高透射性和高强度的薄膜。 在优选的防护薄膜组件中,提供三层薄膜,其具有夹在两个聚合物层之间的透明无机层。 五层防护薄膜也设有外层,中间层是聚合物层,内层是无机材料。 优选的聚合物层是全氟化聚合物,例如Teflon,优选的无机材料是二氧化硅。 本发明的防护薄膜组件在入射光角直至反正弦0.45时提供大于0.99%的透光率。
    • 9. 发明授权
    • Assist features for contact hole mask patterns
    • 辅助接触孔掩模图案的功能
    • US06627361B2
    • 2003-09-30
    • US09901241
    • 2001-07-09
    • Orest BulaMichael S. HibbsSteven J. HolmesPaul A. Rabidoux
    • Orest BulaMichael S. HibbsSteven J. HolmesPaul A. Rabidoux
    • G03F900
    • G03F1/36G03F7/095
    • An assist feature is formed on a lithographic reticle or mask using a hybrid resist and an exposure dose such that only an annular area is effectively exposed having a width that is potentially less than the minimum feature size that can be resolved by the mask exposure tool to simultaneously or sequentially form both a feature of interest and an assist feature for enhancing imaging of the feature of interest when the feature is printed to a wafer. Since the assist feature can be imaged simultaneously with the feature of interest or multiple assist features imaged concurrently, possibly between closely spaced features, data volume and mask writing time are greatly reduced. The invention is particularly applicable to the scaling of contact holes for connections to active devices in extremely high density integrated circuits.
    • 使用混合抗蚀剂和曝光剂量在光刻掩模版或掩模上形成辅助特征,使得只有环形区域被有效地暴露,其宽度可能小于可由掩模曝光工具解析的最小特征尺寸, 同时或顺序地形成感兴趣的特征和当将特征印刷到晶片时增强感兴趣特征的成像的辅助特征。 由于可以与感兴趣的特征或同时成像的多个辅助特征(可能在紧密间隔的特征之间)同时成像辅助特征,所以数据量和掩模写入时间被大大减少。 本发明特别适用于用于连接到极高密度集成电路中的有源器件的接触孔的缩放。