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    • 1. 发明授权
    • Reticle capturing and handling system
    • 光栅捕获和处理系统
    • US06515736B1
    • 2003-02-04
    • US09564189
    • 2000-05-04
    • Dennis M. HaydenTimothy E. Neary
    • Dennis M. HaydenTimothy E. Neary
    • G03B2762
    • G03F7/70741
    • A reticle capturing system includes a reticle that defines a first recess extending into the reticle from a first edge of the reticle and a second recess extending into the reticle from a second edge of the reticle. The reticle capturing system also includes a first finger selectively extending into the first recess and a second finger selectively extending into the second recess. The first and second fingers may be tapered so that the reticle capturing system will be self centering. The reticle capturing system may also include a third recess defined by the reticle and a third finger selectively extending into a recess. A method for capturing a reticle includes providing a reticle that defines a recess at an edge of the reticle and inserting the finger into the recess. The method may further include inserting a second finger into a second recess.
    • 掩模版捕获系统包括掩模版,所述掩模版限定从所述掩模版的第一边缘延伸到所述掩模版中的第一凹部和从所述掩模版的第二边缘延伸到所述掩模版中的第二凹部。 掩模版捕获系统还包括选择性地延伸到第一凹部中的第一手指和选择性地延伸到第二凹部中的第二手指。 第一和第二手指可以是锥形的,使得掩模版捕获系统将是自对中的。 掩模版捕获系统还可以包括由掩模版限定的第三凹部和选择性地延伸到凹部中的第三手指。 一种用于捕获掩模版的方法包括提供在所述掩模版的边缘处限定凹部并将所述手指插入所述凹部中的掩模版。 该方法还可以包括将第二手指插入第二凹槽中。
    • 7. 发明授权
    • Quartz defect removal utilizing gallium staining and femtosecond ablation
    • 使用镓染色和飞秒消融的石英缺陷去除
    • US06346352B1
    • 2002-02-12
    • US09512951
    • 2000-02-25
    • Dennis M. HaydenTimothy E. NearyJohn N. Ross
    • Dennis M. HaydenTimothy E. NearyJohn N. Ross
    • G03F900
    • G03F1/74G03F1/26
    • The present invention discloses a method of controlling the precise removal of unwanted material from a light transmittable substrate for isolating and removing defects from a surface of the light transmittable substrate and for direct writing of a reticle or photomask, and the resultant reticle or photomask. The depth of ion implantation of a light absorbing material such as gallium, arsenic, boron, phosphorus, antimony or combinations thereof into the defect and/or the areas surrounding the defect on the light transmittable substrate controls the depth of material removed from the substrate. Unexpectedly, the use of laser ablation at pulses not greater than 10−5 seconds to remove the unwanted material provides precision removal while preventing heat damage to the substrate.
    • 本发明公开了一种控制从透光性基板精确去除不想要的材料的方法,用于从透光性基板的表面隔离和去除缺陷,并直接写入掩模版或光掩模,以及所得的掩模版或光掩模。 诸如镓,砷,硼,磷,锑或其组合的光吸收材料的离子注入深度可以在缺陷和/或透光性基材上的缺陷周围的区域上控制从衬底去除的材料的深度。 出乎意料的是,在不大于10-5秒的脉冲下使用激光烧蚀以去除不需要的材料提供精确的去除,同时防止对基底的热损伤。
    • 8. 发明授权
    • Methods for repair of photomasks
    • 修复光掩模的方法
    • US06190836B1
    • 2001-02-20
    • US09561560
    • 2000-04-28
    • Brian J. GrenonRichard A. HaightDennis M. HaydenMichael S. HibbsJ. Peter LevinTimothy E. NearyRaymond E. RochefortDennis A. SchmidtJacek G. SmolinskiAlfred Wagner
    • Brian J. GrenonRichard A. HaightDennis M. HaydenMichael S. HibbsJ. Peter LevinTimothy E. NearyRaymond E. RochefortDennis A. SchmidtJacek G. SmolinskiAlfred Wagner
    • G03C500
    • G03F1/74B23K26/0624
    • A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
    • 修复掩模上的缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射,激光烧蚀引起的石英点蚀,激光沉积染色和FIB引起的镓染色而对掩模的清晰区域的损害的步骤。 涂层是金属,聚合物或碳材料。 涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。 包含薄铜层的涂层显着地改善了用离子束的成像,同时保护掩模的清除区域不受FIB染色。 由光敏聚合物形成的涂层用于蚀刻不透明缺陷。 虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域,然后在随后的FIB沉积步骤中修复这些产生的明确缺陷,而铜涂层保护相邻的清晰区域免受FIB染色。 在另一个实施例中,用短脉冲持续时间激光修复不透明缺陷,而不损害下面的石英或相邻的透明区域,同时避免了涂层的需要。