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    • 2. 发明授权
    • Manufacturing method for micromechanical component
    • 微机械部件的制造方法
    • US06187607B1
    • 2001-02-13
    • US09292282
    • 1999-04-15
    • Michael OffenbergUdo BischofMarkus Lutz
    • Michael OffenbergUdo BischofMarkus Lutz
    • H01L21302
    • G01C19/5769B81B2201/025B81B2203/0136B81C1/00571B81C2201/014B81C2201/053
    • A manufacturing method for a micromechanical component, and in particular for a micromechanical rotation rate sensor, which has a supporting first layer, an insulating second layer that is arranged on the first layer, and a conductive third layer that is arranged on the second layer. The method includes the following steps: provide the second layer, in the form of patterned first and second insulation regions, on the first layer; provide a first protective layer on an edge region of the first insulation regions and on a corresponding boundary region of the first layer; provide the third layer on the structure resulting from the previous steps; pattern out a structure of conductor paths running on the first insulation regions, and a functional structure of the micromechanical component above the second insulation regions, from the third layer; and remove the second layer in the second insulation regions, the second layer being protected in the first insulation regions by the first protective layer in such a way that it is essentially not removed there.
    • 具有支撑第一层,布置在第一层上的绝缘第二层和布置在第二层上的导电第三层的微机械组件的制造方法,特别是用于微机械转速传感器的制造方法。 该方法包括以下步骤:在第一层上提供呈图案化的第一和第二绝缘区域的形式的第二层; 在所述第一绝缘区域的边缘区域和所述第一层的对应边界区域上提供第一保护层; 提供由上述步骤导致的结构上的第三层; 形成在第一绝缘区域上运行的导体路径的结构以及来自第三层的第二绝缘区域上方的微机械部件的功能结构; 并且在所述第二绝缘区域中移除所述第二层,所述第二层在所述第一绝缘区域中被所述第一保护层保护,使得其基本上不被去除。