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1. 发明申请

US20120085655A1 INTERPOSER AND MANUFACTURING METHOD FOR THE SAME 审中-公开
标题翻译：其相关的制程和制造方法
公开(公告)号：US20120085655A1
公开(公告)日：2012-04-12
申请号：US13328710
申请日：2011-12-16
申请人： Kenichi Kagawa , Tomohisa Hoshino , Masami Yakabe
发明人： Kenichi Kagawa , Tomohisa Hoshino , Masami Yakabe
IPC分类号： C25D5/02 , B05D5/12
CPC分类号： H01L23/49827 , H01L21/486 , H01L2924/0002 , H01L2924/00
摘要： In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.
摘要翻译：在中介层的制造方法中，在基板的背面侧的通孔的开口部形成种子层，基于种子层形成电镀用电极层，形成电镀覆盖层以将电镀层用电极层的贯通孔填充到前表面侧。结果，提供了一种用于插入器的制造方法，其中制造工艺简单并且在通孔内部不产生空隙。

2. 发明授权

US07866038B2 Through substrate, interposer and manufacturing method of through substrate 有权
标题翻译：通过基板，内插器和通过基板的制造方法
公开(公告)号：US07866038B2
公开(公告)日：2011-01-11
申请号：US11631638
申请日：2005-07-05
申请人： Masami Yakabe , Kenichi Kagawa , Tomohisa Hoshino
发明人： Masami Yakabe , Kenichi Kagawa , Tomohisa Hoshino
IPC分类号： H01K3/10
CPC分类号： H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L23/552 , H01L2223/6622 , H01L2924/0002 , H05K1/0222 , H05K1/0306 , H05K3/423 , H05K2201/09809 , H05K2203/0733 , Y10T29/49165 , H01L2924/00
摘要： A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.
摘要翻译：一种贯穿基板，包括具有贯通前表面（11）和后表面（12）的通孔（19）的硅基板（10），沿着贯通孔的内壁表面设置的氧化硅膜（13）分别形成在氧化硅膜（13）的内壁面上的包含Zn和Cu的层（14,15），以及从Cu种子生长的Cu镀层（18）层（17）分别经由它们之间的绝缘层（16）沿着包括Zn和Cu的层（14,15）的内壁表面。上述通过基板可以提供能够避免由于串扰引起的噪声的通孔电极。

3. 发明申请

US20080067073A1 Interposer And Manufacturing Method For The Same 审中-公开
标题翻译：内插和制造方法相同
公开(公告)号：US20080067073A1
公开(公告)日：2008-03-20
申请号：US11631635
申请日：2005-07-05
申请人： Kenichi Kagawa , Tomohisa Hoshino , Masami Yakabe
发明人： Kenichi Kagawa , Tomohisa Hoshino , Masami Yakabe
IPC分类号： C25D5/02
CPC分类号： H01L23/49827 , H01L21/486 , H01L2924/0002 , H01L2924/00
摘要： In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.
摘要翻译：在中介层的制造方法中，在基板的背面侧的通孔的开口部形成种子层，基于种子层形成电镀用电极层，形成电镀覆盖层以将电镀层用电极层的贯通孔填充到前表面侧。结果，提供了一种用于插入器的制造方法，其中制造工艺简单并且在通孔内部不产生空隙。

4. 发明申请

US20070246253A1 Through Substrate, Interposer and Manufacturing Method of Through Substrate 有权
标题翻译：通过基板，内插和基板的制造方法
公开(公告)号：US20070246253A1
公开(公告)日：2007-10-25
申请号：US11631638
申请日：2005-07-05
申请人： Masami Yakabe , Kenichi Kagawa , Tomohisa Hoshino
发明人： Masami Yakabe , Kenichi Kagawa , Tomohisa Hoshino
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L23/552 , H01L2223/6622 , H01L2924/0002 , H05K1/0222 , H05K1/0306 , H05K3/423 , H05K2201/09809 , H05K2203/0733 , Y10T29/49165 , H01L2924/00
摘要： A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.
摘要翻译：一种贯穿基板，包括具有贯通前表面（11）和后表面（12）的通孔（19）的硅基板（10），沿着贯通孔的内壁表面设置的氧化硅膜（13）分别形成在氧化硅膜（13）的内壁面上的包含Zn和Cu的层（14,15），以及从Cu种子生长的Cu镀层（18）层（17）分别经由它们之间的绝缘层（16）沿着包括Zn和Cu的层（14,15）的内壁表面。上述通过基板可以提供能够避免由于串扰引起的噪声的通孔电极。

5. 发明申请

US20070278650A1 Semiconductor Device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20070278650A1
公开(公告)日：2007-12-06
申请号：US10590358
申请日：2005-02-28
申请人： Kenichi Kagawa , Masami Yakabe
发明人： Kenichi Kagawa , Masami Yakabe
IPC分类号： H01L21/301 , H01L23/48
CPC分类号： B81C1/00896 , G01P15/0802 , G01P15/125 , G01P2015/0828 , H01L2924/0002 , H01L2924/00
摘要： In a semiconductor device a substrate is formed in a rectangular shape having four edges along dicing lines, and a jetty portion is formed so as to surround an actuator element and an electrode pad for signal input and output. The jetty portion is a rectangular shape having four sides and each side continuously extends along each edge of the substrate in parallel. A foreign object generated when dicing process is performed, is prevented from attaching onto the actuator element and the electrode pad because close adhesion of a protecting tape is improved by the jetty portion.
摘要翻译：在半导体装置中，基板沿着切割线形成为具有四个边缘的矩形形状，并且形成了围绕致动器元件的码元部分和用于信号输入和输出的电极焊盘。码头部分是具有四个边的矩形形状，并且每个侧面平行地沿着基板的每个边缘连续地延伸。当执行切割处理时产生的异物被防止附着到致动器元件和电极垫上，因为通过喷射部分提高了保护带的密合性。

6. 发明申请

US20070193358A1 Capacity detection type sensor element 审中-公开
标题翻译：容量检测型传感器元件
公开(公告)号：US20070193358A1
公开(公告)日：2007-08-23
申请号：US10589352
申请日：2005-02-14
申请人： Kenichi Kagawa , Masami Yakabe , Shinichi Saeki , Takahisa Ohtsuji
发明人： Kenichi Kagawa , Masami Yakabe , Shinichi Saeki , Takahisa Ohtsuji
IPC分类号： G01L9/12
CPC分类号： H04R19/005 , H04R19/04
摘要： A capacity detection type sensor element includes a rectangular vibrating plate, a flat back electrode which are provided opposedly with each other, and fixing portions which are provided adjoining to the vibrating plate, and has a predetermined length A of edge at a side adjoining to the vibrating plate. The back electrode is held by the fixing portions in a state that space is provided between the back electrode and the vibrating plate. Outer edges of the back electrode which are not held by the adjoining fixing portions, are straight lines and the straight lines define an octagonal shape as a whole.
摘要翻译：容量检测型传感器元件包括彼此相对设置的矩形振动板，扁平背面电极和与振动板相邻设置的固定部，并且在与该振动板相邻的一侧具有预定长度A的边缘振动板在背面电极和振动板之间设置有空间的状态下，由固定部保持背面电极。没有被相邻的固定部分保持的背面电极的外边缘是直线，并且直线整体形成八边形。

7. 发明授权

US07570773B2 Sound detecting mechanism 失效
标题翻译：声音检测机构
公开(公告)号：US07570773B2
公开(公告)日：2009-08-04
申请号：US10565059
申请日：2004-07-14
申请人： Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Masatsugu Komai , Kenichi Kagawa
发明人： Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Masatsugu Komai , Kenichi Kagawa
IPC分类号： H04R25/00
CPC分类号： H04R19/016 , H04R19/04
摘要： A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrode and the diaphragm.
摘要翻译：能够通过简单的工艺在基板上形成隔膜和背面电极的声音检测机构包括对应于形成在基板前表面上的穿孔的声孔。第二保护膜，牺牲层和金属膜层叠在与声孔对应的部分的前表面上。衬底从其后表面被蚀刻到到达声孔的深度以形成声学开口。随后，通过通过声孔从衬底的背面进行蚀刻，除去牺牲层，并且在由金属膜，衬底和形成的穿孔构成的隔膜之间形成空隙区域。蚀刻后残留的牺牲层用作用于保持背电极和隔膜之间的间隙的间隔物。

8. 发明申请

US20090122379A1 Optical Deflecting Element 审中-公开
标题翻译：光学偏转元件
公开(公告)号：US20090122379A1
公开(公告)日：2009-05-14
申请号：US11920820
申请日：2006-05-18
申请人： Kenichi Kagawa , Norihiro Asada
发明人： Kenichi Kagawa , Norihiro Asada
IPC分类号： G02B26/08
CPC分类号： G02B26/085 , G02B26/105
摘要： The present invention can provide a downsized optical deflecting element having less operating fluctuations at low cost and further it can be actuated at lower frequencies and at wider deflecting angles. The optical deflecting element comprises a base component having magnets therein; a soft resin component comprising a fixed part adhered to the base component and a movable part having a coil therein supported by the fixed part via a pair of beams; and a reflector plate 3 adhered on to the movable part. The soft resin component consists of a first insulating resin part 2-1 and second conductive resin part 2-2 for electrical wiring.
摘要翻译：本发明可以以低成本提供具有较少工作波动的小尺寸的光学偏转元件，并且还可以在较低频率和较宽的偏转角度下被致动。光学偏转元件包括其中具有磁体的基座部件; 软树脂部件，其包括固定部分，所述固定部分粘附到所述基部部件;以及可移动部件，其具有线圈，所述可动部分经由所述一对梁由所述固定部分支撑; 以及附着在可动部上的反射板3。软树脂部件由用于电线的第一绝缘树脂部分2-1和第二导电树脂部分2-2组成。

9. 发明授权

US4709708A Control system for humidity controller of tobacco leaves 失效
标题翻译：烟叶湿度控制器控制系统
公开(公告)号：US4709708A
公开(公告)日：1987-12-01
申请号：US630064
申请日：1984-07-12
申请人： Kenichi Kagawa
发明人： Kenichi Kagawa
IPC分类号： A24B3/02 , A24B3/04 , A24B3/12 , A24B5/00 , A24B9/00 , G05D22/00 , G05D23/19 , G05D27/00
CPC分类号： A24B9/00 , A24B3/04 , A24B5/00
摘要： A system for controlling the water content and temperature of tobacco leaves in a humidity controller is provided. Said system comprises means for measuring the water content, temperature and flow rate of the tobacco leaves conveyed to the humidity controller which provides the tobacco leaves with the water content and temperature necessary for rib removal to maintain the quality of the tobacco leaves; operation means for calculating the amount of water and steam to be added upon the basis of the measurements of said measuring means and the preset values representative of the water content and temperature provided to the tobacco leaves and for compensating for the deviation between the spraying position of water and steam and the position of measuring the water content and the temperature of the tobacco leaves which have been provided with water and steam and the time lag of rise up and fall of the water content and temperature when the preset values are changed; and control means for controlling means for supplying the water and steam in response to the values calculated by the operation means and for correcting the deviation between the measurements of the water content and temperature of the tobacco leaves provided with water content and steam and the preset values.
摘要翻译：提供了一种用于控制湿度控制器中烟叶的含水量和温度的系统。所述系统包括用于测量输送到湿度控制器的烟叶的含水量，温度和流速的装置，其为烟叶提供了除去叶片所需的水含量和温度以保持烟叶的质量; 操作装置，用于根据所述测量装置的测量值和表示提供给烟草叶片的水含量和温度的预设值计算要添加的水和蒸汽的量，并补偿喷雾位置之间的偏差水和蒸汽以及测量已经提供水和蒸汽的烟叶的水含量和温度以及当预设值改变时含水量和温度上升和下降的时间的位置; 以及控制装置，用于响应于由操作装置计算出的值来控制水和蒸汽的供给装置，并且用于校正具有水含量和蒸汽的烟叶的含水量和温度的测量值之间的偏差以及预设值。

10. 发明授权

US5388091A Communications system for communications between an electronic control apparatus and a test apparatus 失效
标题翻译：用于电子控制装置和测试装置之间的通信的通信系统
公开(公告)号：US5388091A
公开(公告)日：1995-02-07
申请号：US045222
申请日：1993-04-13
申请人： Kenichi Kagawa
发明人： Kenichi Kagawa
IPC分类号： B60T8/90 , B60R16/02 , B60R16/03 , B60T8/176 , H04B1/20 , H04L5/14 , H04L12/26 , H04L29/08 , H04L29/14 , H04J3/14
CPC分类号： H04L43/50 , H04B1/205 , H04L12/2697 , B60R16/0315
摘要： A communications system includes an electronic control apparatus having an asynchronous serial communications function and a test apparatus for checking the operation of the electronic control apparatus. The test apparatuses using different communications modes can be connected to a single electronic control apparatus. The test apparatus includes an identification signal generator for generating an identification signal identifying the full or half duplex communications mode of the specific test apparatus. The electronic control apparatus has both full and half duplex communications arrangements. Either the full or half duplex communications arrangement is selected according to the identification signal received from the test apparatus.
摘要翻译：通信系统包括具有异步串行通信功能的电子控制装置和用于检查电子控制装置的操作的测试装置。使用不同通信模式的测试装置可以连接到单个电子控制装置。测试装置包括识别信号发生器，用于产生识别特定测试装置的全双工或半双工通信模式的识别信号。电子控制装置具有全双工和半双工通信布置。根据从测试设备接收的识别信号来选择全双工或半双工通信布置。

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