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1. 发明授权

US07891090B2 Method for manufacturing an interposer 有权
标题翻译：中介层制造方法
公开(公告)号：US07891090B2
公开(公告)日：2011-02-22
申请号：US11884075
申请日：2006-02-09
申请人： Masami Yakabe , Tomohisa Hoshino
发明人： Masami Yakabe , Tomohisa Hoshino
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： G01R3/00 , G01R1/07378 , H01R12/714 , H01R13/2464 , Y10T29/49147 , Y10T29/49165 , Y10T29/49204 , Y10T29/49609
摘要： A method for manufacturing an interposer including a body and a plurality of probes connected to said body is disclosed. The method includes a step of manufacturing said body including the sub-steps of preparing a first substrate having one surface side and the other surface side and being capable of being processed by dry etching, forming a plurality of through holes in said first substrate by dry etching, and making said through holes into conductive holes capable of conducting electricity through a bottom-up fill process. The method also includes a step of manufacturing said plurality of probes and connecting the ends of said plurality of conductive holes on one surface side of said first substrate and a plurality of first probes on said second substrate.
摘要翻译：公开了一种用于制造包括主体和连接到所述主体的多个探针的插入件的方法。该方法包括制造所述主体的步骤，其包括准备具有一个表面侧和另一个表面侧的第一基板的子步骤，并且能够通过干蚀刻加工，在所述第一基板中通过干燥形成多个通孔蚀刻，并使所述通孔成为能够通过自底向上填充工艺导电的导电孔。该方法还包括制造所述多个探针并将所述多个导电孔的端部连接在所述第一基底的一个表面侧上的步骤和在所述第二基底上的多个第一探针。

2. 发明申请

US20100077597A1 PROBE NEEDLE, METHOD FOR MANUFACTURING THE PROBE NEEDLE AND METHOD FOR CONSTRUCTING A THREE-DIMENSIONAL STRUCTURE 失效
标题翻译：探针，制造探针的方法和构造三维结构的方法
公开(公告)号：US20100077597A1
公开(公告)日：2010-04-01
申请号：US12576111
申请日：2009-10-08
申请人： Tomohisa HOSHINO , Hiroyuki HASHIMOTO , Muneo HARADA
发明人： Tomohisa HOSHINO , Hiroyuki HASHIMOTO , Muneo HARADA
IPC分类号： H01R43/00
CPC分类号： G01R1/06716 , G01R1/06727 , Y10T29/49002
摘要： A method for manufacturing a probe needle having beams and a contactor placed on tips of the beams comprises preparing a Si wafer 20, forming a seed layer 21 on the Si wafer 20, and forming grooves in a desired shape of the beams on the seed layer 21 by patterning a photoresist 23. Subsequently, the grooves are filled up with metal-plated layers 24a, 24b to form the desired shape of beams.
摘要翻译：用于制造具有光束的探针的方法和放置在光束的尖端上的接触器包括准备Si晶片20，在Si晶片20上形成晶种层21，并且在晶种层上形成期望形状的光束的凹槽接着，用金属镀层24a，24b填充凹槽以形成所需的光束形状。

3. 发明授权

US07619424B2 Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure 失效
标题翻译：探针，探针的制造方法以及构造三维结构的方法
公开(公告)号：US07619424B2
公开(公告)日：2009-11-17
申请号：US11661349
申请日：2005-08-29
申请人： Tomohisa Hoshino , Hiroyuki Hashimoto , Muneo Harada
发明人： Tomohisa Hoshino , Hiroyuki Hashimoto , Muneo Harada
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R1/06716 , G01R1/06727 , Y10T29/49002
摘要： A method for manufacturing a probe needle having beams and a contactor placed on tips of the beams comprises preparing a Si wafer 20, forming a seed layer 21 on the Si wafer 20, and forming grooves in a desired shape of the beams on the seed layer 21 by patterning a photoresist 23. Subsequently, the grooves are filled up with metal-plated layers 24a, 24b to form the desired shape of beams.
摘要翻译：用于制造具有光束的探针的方法和放置在光束的尖端上的接触器包括准备Si晶片20，在Si晶片20上形成晶种层21，并且在晶种层上形成期望形状的光束的凹槽接着，用金属镀层24a，24b填充凹槽以形成所需的光束形状。

4. 发明申请

US20070194395A1 Capacity type sensor 审中-公开
标题翻译：容量型传感器
公开(公告)号：US20070194395A1
公开(公告)日：2007-08-23
申请号：US10589350
申请日：2005-02-14
申请人： Tomohisa Hoshino
发明人： Tomohisa Hoshino
IPC分类号： H01L29/82
CPC分类号： G01L9/0073 , G01D5/24 , G01F1/28 , G01L9/0016 , G01L9/0019
摘要： In a capacity type sensor including a guard electrode which is disposed between a first electrode and a second electrode, an alternating current potential difference between the first electrode and the guard electrode is made substantially close to zero by a potential equalizing means, and impedance change between the first electrode and the second electrode is detected by a capacity type sensor detecting means, parasitic capacity does not function as capacitor, and the effect of the parasitic capacity to detected capacity can be cancelled in appearance, by making the potential difference at both ends of the parasitic capacity which arises between the first electrode and the guard electrode, smaller in appearance or substantially zero, resultantly, only amount of capacity change can be detected.
摘要翻译：在包括设置在第一电极和第二电极之间的保护电极的容量型传感器中，通过电位均衡装置使第一电极和保护电极之间的交流电位差基本接近于零，并且阻抗变化在第一电极和第二电极由容量型传感器检测装置检测，寄生电容不起电容器的作用，并且通过使两端的电位差在外观上能够消除寄生电容对检测电容的影响在第一电极和保护电极之间产生的寄生电容在外观上较小或基本上为零，因此可以仅检测出容量变化量。

5. 发明申请

US20130033282A1 CONTACT STRUCTURE AND METHOD OF MANUFACTURING CONTACT STRUCTURE 审中-公开
标题翻译：接触结构和制造接触结构的方法
公开(公告)号：US20130033282A1
公开(公告)日：2013-02-07
申请号：US13641305
申请日：2011-04-06
申请人： Yohei Sato , Tomohisa Hoshino
发明人： Yohei Sato , Tomohisa Hoshino
IPC分类号： G01R1/067 , C25D1/00
CPC分类号： G01R3/00 , G01R1/06722
摘要： A contact structure has a probe and a housing disposed on an outer circumference thereof. The housing has a housing main body in which a hollow section vertically penetrating the same is formed, and a conductive coat film with which an inner wall surface of the hollow section is coated. The probe has a base end portion fixed in place on one end side of the housing, a conductive leading end portion that is movable in the hollow section while being in contact with the coat film and has, on a leading end thereof, a contact that comes into contact with a subject to be inspected, and an elastic portion that connects together the base end portion and the leading end portion, is disposed in the hollow section, and has elasticity.
摘要翻译：接触结构具有探针和设置在其外周上的壳体。壳体具有壳体主体，其中形成有垂直贯穿其的中空部分，以及涂覆有中空部分的内壁表面的导电涂膜。该探针具有固定在壳体的一端侧上的基端部，导电性前端部与导电接触部可在中空部中移动，并且在其前端具有接触部与待检查对象接触，并且将基端部和前端部连接在一起的弹性部设置在中空部中，具有弹性。

6. 发明授权

US07692434B2 Probe and method for fabricating the same 失效
标题翻译：探针及其制造方法
公开(公告)号：US07692434B2
公开(公告)日：2010-04-06
申请号：US11665918
申请日：2005-10-20
申请人： Tomohisa Hoshino , Yoshiki Yamanishi , Hiroyuki Hashimoto
发明人： Tomohisa Hoshino , Yoshiki Yamanishi , Hiroyuki Hashimoto
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/07342 , G01R3/00
摘要： A probe needle 20 includes a cantilever 21, a column 22 and a tip 23. The column 22 is cantilevered from an end of the cantilever 21. The tip 23 is formed on a top end of the column 22. The column 22 is formed so as to be longer than the tip 23. The heights of the column 22 and tip 23 are chosen so that their sum is twice or more than twice the width of the columnar 22.
摘要翻译：探针20包括悬臂21，柱22和尖端23.柱22从悬臂21的一端悬臂悬垂。顶端23形成在柱22的顶端。柱22形成为比顶端23长。柱22和尖端23的高度被选择为使得它们的和是柱形22的宽度的两倍或更多倍。

7. 发明申请

US20090015281A1 METHOD OF POSITIONING AN ANISOTROPIC CONDUCTIVE CONNECTOR, METHOD OF POSITIONING THE ANISOTROPIC CONDUCTIVE CONNECTOR AND A CIRCUIT BOARD FOR INSPECTION, ANISOTROPIC CONDUCTIVE CONNECTOR, AND PROBE CARD 审中-公开
标题翻译：用于定位各向异性导电连接器的方法，用于定位各向异性导电连接器的方法和用于检查的电路板，各向异性导电连接器和探针卡
公开(公告)号：US20090015281A1
公开(公告)日：2009-01-15
申请号：US12170746
申请日：2008-07-10
申请人： Mutsuhiko Yoshioka , Akira Matsuura , Masaya Naoi , Takashi Amemiya , Syuichi Tsukada , Tomohisa Hoshino
发明人： Mutsuhiko Yoshioka , Akira Matsuura , Masaya Naoi , Takashi Amemiya , Syuichi Tsukada , Tomohisa Hoshino
IPC分类号： G01R31/28
CPC分类号： G01R31/2891 , G01R1/07342 , G01R31/2808 , H05K1/0269 , H05K3/303 , H05K2201/0108 , H05K2201/09918 , H05K2201/10378 , H05K2203/166 , Y02P70/613
摘要： The method is a method for positioning a three-layered rectangular frame-like anisotropic conductive connector in order to inspect the electrical properties of an object for inspection. The positioning is carried out in the following manner. The three-layered anisotropic conductive sheet is composed of a first anisotropic conductive sheet, a center substrate and a second anisotropic conductive sheet. Markings and through-holes are formed on the center substrate, and semi-transparent protrusions and through-holes are formed on each of the first anisotropic conductive sheet and the second anisotropic conductive sheet. The markings are identified through the semi-transparent protrusions by detecting means disposed on the side of the first anisotropic conductive sheet and the second anisotropic conductive sheet and thereby the positioning of the semi-transparent protrusions to the markings is carried out, whereby performing the positioning of the first anisotropic conductive sheet, the center substrate and the second anisotropic conductive sheet.
摘要翻译：该方法是用于定位三层矩形框状的各向异性导电连接器以便检查被检查物体的电气特性的方法。定位如下进行。三层各向异性导电片由第一各向异性导电片，中心基片和第二各向异性导电片构成。在中心基板上形成标记和通孔，并且在第一各向异性导电片和第二各向异性导电片之间形成半透明突起和通孔。通过设置在第一各向异性导电片和第二各向异性导电片侧的检测装置通过半透明突起来识别标记，由此执行半透明突起到标记的定位，由此执行定位的第一各向异性导电片，中心基片和第二各向异性导电片。

8. 发明申请

US20070259506A1 Probe Needle, Method for Manufacturing the Probe Needle and Method for Constructing a Three-Dimensional Structure 失效
标题翻译：探针，制造探针的方法及构造三维结构的方法
公开(公告)号：US20070259506A1
公开(公告)日：2007-11-08
申请号：US11661349
申请日：2005-08-29
申请人： Tomohisa Hoshino , Hiroyuki Hashimoto , Muneo Harada
发明人： Tomohisa Hoshino , Hiroyuki Hashimoto , Muneo Harada
IPC分类号： G01R1/067 , H01L21/76
CPC分类号： G01R1/06716 , G01R1/06727 , Y10T29/49002
摘要： A method for manufacturing a probe needle having beams and a contactor placed on tips of the beams comprises preparing a Si wafer 20, forming a seed layer 21 on the Si wafer 20, and forming grooves in a desired shape of the beams on the seed layer 21 by patterning a photoresist 23. Subsequently, the grooves are filled up with metal-plated layers 24a, 24b to form the desired shape of beams.
摘要翻译：用于制造具有光束的探针的方法和放置在光束的尖端上的接触器包括准备Si晶片20，在Si晶片20上形成晶种层21，并且在晶种层上形成期望形状的光束的凹槽通过图案化光致抗蚀剂23。随后，用金属镀层24a，24b填充凹槽以形成所需的梁形状。

9. 发明申请

US20070257692A1 Probe 审中-公开
标题翻译：探测
公开(公告)号：US20070257692A1
公开(公告)日：2007-11-08
申请号：US11664807
申请日：2005-10-31
申请人： Masami Yakabe , Tomohisa Hoshino , Naoki Ikeuchi
发明人： Masami Yakabe , Tomohisa Hoshino , Naoki Ikeuchi
IPC分类号： G01R31/02
CPC分类号： G01R1/06727 , G01R1/07342
摘要： A probe, wherein a beam 3 is cantilevered by a supporter 2 with a predetermined space from a probe substrate 1, and a contact 4 extending in a direction away from the probe substrate 1 is attached to the beam 3. A projection 5 extending toward the probe substrate 1 is formed on the beam 3. Since the projection 5 is brought into contact with the probe substrate 1 when a load is applied to the probe substrate 1, stress imposed on the beam 3 can be dispersed.
摘要翻译：探针，其中梁3由支撑件2以探针基板1的预定空间悬臂，并且沿远离探针基板1的方向延伸的接触件4附接到梁3。在梁3上形成有朝向探针基板1延伸的突起5。由于当将负载施加到探针基板1时突出部5与探针基板1接触，所以能够分散施加在光束3上的应力。

10. 发明申请

US20070246253A1 Through Substrate, Interposer and Manufacturing Method of Through Substrate 有权
标题翻译：通过基板，内插和基板的制造方法
公开(公告)号：US20070246253A1
公开(公告)日：2007-10-25
申请号：US11631638
申请日：2005-07-05
申请人： Masami Yakabe , Kenichi Kagawa , Tomohisa Hoshino
发明人： Masami Yakabe , Kenichi Kagawa , Tomohisa Hoshino
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L23/552 , H01L2223/6622 , H01L2924/0002 , H05K1/0222 , H05K1/0306 , H05K3/423 , H05K2201/09809 , H05K2203/0733 , Y10T29/49165 , H01L2924/00
摘要： A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.
摘要翻译：一种贯穿基板，包括具有贯通前表面（11）和后表面（12）的通孔（19）的硅基板（10），沿着贯通孔的内壁表面设置的氧化硅膜（13）分别形成在氧化硅膜（13）的内壁面上的包含Zn和Cu的层（14,15），以及从Cu种子生长的Cu镀层（18）层（17）分别经由它们之间的绝缘层（16）沿着包括Zn和Cu的层（14,15）的内壁表面。上述通过基板可以提供能够避免由于串扰引起的噪声的通孔电极。

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