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    • 8. 发明授权
    • Method of measuring electrical characteristics of semiconductor wafer
    • 测量半导体晶片电气特性的方法
    • US08610450B2
    • 2013-12-17
    • US13273781
    • 2011-10-14
    • Noboru FukuharaMasahiko Hata
    • Noboru FukuharaMasahiko Hata
    • G01R31/26
    • G01R31/025G01R31/129
    • There is provided a method of measuring a leakage current or a dielectric breakdown voltage of a semiconductor wafer that has a base wafer and a buffer layer formed on the base wafer. The method includes providing, on the buffer layer, a plurality of electrodes including a hole injection electrode made of a material that injects a hole into the buffer layer when an electric field is applied thereto, measuring an electric current flowing through a pair of electrodes or a voltage between the electrodes when a voltage or an electric current is applied to the pair of electrodes, the electrodes including at least one hole injection electrode, and measuring a leakage current or a dielectric breakdown voltage caused by hole migration in the semiconductor wafer based on the current flowing through the pair of electrodes or the voltage generated between the pair of the electrodes.
    • 提供了一种测量半导体晶片的漏电流或介电击穿电压的方法,该半导体晶片具有形成在基底晶片上的基底晶片和缓冲层。 该方法包括在缓冲层上设置多个电极,该多个电极包括由施加电场的空穴注入到缓冲层中的材料制成的空穴注入电极,测量流过一对电极的电流或 当对一对电极施加电压或电流时,电极之间的电压,所述电极包括至少一个空穴注入电极,并且测量基于半导体晶片中的空穴迁移引起的漏电流或介电击穿电压,基于 流过该对电极的电流或在一对电极之间产生的电压。