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1. 发明授权

US07007379B2 Production method of printed circuit board 有权
标题翻译：印刷电路板的生产方法
公开(公告)号：US07007379B2
公开(公告)日：2006-03-07
申请号：US10385172
申请日：2003-03-10
申请人： Makoto Komatsubara , Yasuhito Ohwaki , Takeshi Yoshimi , Shigenori Morita
发明人： Makoto Komatsubara , Yasuhito Ohwaki , Takeshi Yoshimi , Shigenori Morita
IPC分类号： H05K3/10
CPC分类号： H05K3/108 , H05K1/056 , H05K3/064 , H05K3/205 , H05K3/44 , H05K2201/09781 , H05K2203/0323 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layer 2 is formed in a given pattern on one surface of a supporting substrate 1, a circuit pattern 6 is formed on the insulating layer 2 while forming a dummy pattern 7 in an area free of the insulating layer 2 on the one surface of the supporting substrate 1, and an unnecessary part of the supporting substrate 1, which is free of the insulating layer 2 and the circuit pattern 6, is removed by dissolution together with the dummy pattern 7.
摘要翻译：本发明提供一种具有电路图案的印刷电路板的制造方法，该电路图案在低成本下具有小的厚度变化，而没有用于去除虚拟图案的特殊步骤。本发明的特征在于，在支撑基板1的一个表面上以给定的图案形成绝缘层2，在绝缘层2上形成电路图案6，同时在没有绝缘层的区域中形成虚设图案7 在支撑基板1的一个表面上的层2，并且不存在绝缘层2和电路图案6的支撑基板1的不需要的部分通过与虚设图案7一起溶解而被去除。

2. 发明授权

US06399899B1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US06399899B1
公开(公告)日：2002-06-04
申请号：US09712980
申请日：2000-11-16
申请人： Tadao Ohkawa , Yasuhito Ohwaki , Shigenori Morita , Toshihiko Omote
发明人： Tadao Ohkawa , Yasuhito Ohwaki , Shigenori Morita , Toshihiko Omote
IPC分类号： H01R1204
CPC分类号： H05K1/0271 , G11B5/486 , H01R4/023 , H01R13/58 , H01R2201/06 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/361 , H05K3/388 , H05K2201/0154 , H05K2201/0394
摘要： To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability, the suspension board with circuit 11 includes a suspension board 12, a base layer 13 formed on the suspension board 12, and a conductive layer 14 formed on the base layer 13 and a cover layer 18 with which the conductive layer 14 is covered, wherein external connection terminals 17 to be bonded to terminals 28 of a read/write board 29 are formed without the suspension board 12 and/or the base layer 13 being formed.
摘要翻译：为了提供具有使得其端子能够以足够的结构结合到其它端子的电路的悬挂板，为了确保足够的接合可靠性，具有电路11的悬挂板包括悬挂板12，形成在基板13上的基底层13 悬垂基板12和形成在基底层13上的导电层14和覆盖导电层14的覆盖层18，其中形成与读/写板29的端子28接合的外部连接端子17不形成形成悬挂板12和/或基层13。

3. 发明授权

US06380493B1 Circuit board 有权
标题翻译：电路板
公开(公告)号：US06380493B1
公开(公告)日：2002-04-30
申请号：US09695904
申请日：2000-10-26
申请人： Shigenori Morita , Yasuhito Ohwaki , Tadao Ohkawa , Toshihiko Omote
发明人： Shigenori Morita , Yasuhito Ohwaki , Tadao Ohkawa , Toshihiko Omote
IPC分类号： H05K302
CPC分类号： G11B5/486 , H05K1/024 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0154 , H05K2203/0597
摘要： To provide a circuit board, having a circuit pattern of adequate high-frequency characteristics, for transmitting high-frequency electric signals at high speed, a circuit board, including a base layer formed of insulating material and a conductive layer formed on the base layer in the form of a specified circuit pattern, is so constructed that an air layer is made to lie between lines of wire of the circuit pattern or is so constructed that the lines of wire are covered with the cover layer but land portions of the base layer extending between the lines of wire are not covered with the cover layer. This construction of the invention enables dielectric constant between the lines of wire to be reduced and, as a result of this, the capacitance between the lines of wire can be reduced to provide improved high-frequency characteristics of the circuit pattern.
摘要翻译：为了提供具有足够的高频特性的电路图形用于高速传输高频电信号的电路板，包括由绝缘材料形成的基底层和形成在基底层上的导电层的电路板指定电路图案的形式被构造成使得空气层位于电路图案的线之间，或者被构造成使得线的线被覆盖层覆盖，但是基底层的接地部分延伸线之间的线不被覆盖层覆盖。本发明的这种结构能够使线路线之间的介电常数降低，并且因此可减少线路之间的电容，从而提供改进的电路图案的高频特性。

4. 发明授权

US06797888B2 Junction flexible wiring circuit board 有权
标题翻译：接线柔性布线电路板
公开(公告)号：US06797888B2
公开(公告)日：2004-09-28
申请号：US10053555
申请日：2002-01-24
申请人： Tadao Ookawa , Yasuhito Ohwaki , Toshihiko Omote
发明人： Tadao Ookawa , Yasuhito Ohwaki , Toshihiko Omote
IPC分类号： H05K103
CPC分类号： G11B5/4853 , H05K1/0218 , H05K3/361
摘要： In a junction flexible wiring circuit board used for performing junction between a suspension board for mounting a magnetic head of a hard disk drive thereon and a control circuit board for operating the magnetic head, a metal layer is formed on at least one of a surface of an electrically insulating base layer and a surface of an electrically insulating cover layer.
摘要翻译：在用于在其上安装硬盘驱动器的磁头的悬挂板和用于操作磁头的控制电路板之间的连接处的接合柔性布线电路板中，金属层形成在至少一个电绝缘基层和电绝缘覆盖层的表面。

5. 发明授权

US07482800B2 Wired circuit board and connecting structure thereof 有权
标题翻译：有线电路板及其连接结构
公开(公告)号：US07482800B2
公开(公告)日：2009-01-27
申请号：US11295520
申请日：2005-12-07
申请人： Yasunari Ooyabu , Yasuhito Ohwaki
发明人： Yasunari Ooyabu , Yasuhito Ohwaki
IPC分类号： G01R31/28 , H05K1/00 , H05K1/18 , H05K7/00 , H05K1/03 , H01R12/00
CPC分类号： H05K3/363 , H05K1/056 , H05K3/3442 , H05K3/366 , H05K2201/0394 , H05K2201/09181 , H05K2203/167
摘要： A wired circuit board that can allow precise connection between wired circuit boards with respect to a direction orthogonal to each other with a simple structure, while allowing reduction in size of the wired circuit boards, and a connecting structure of the wired circuit board comprising two wired circuit boards connected to each other with respect to a direction orthogonal to each other. Relay terminals 9 of the circuit suspension board 1 are arranged along one widthwise edge of the circuit suspension board 1, and terminal cutouts 10 cut in a generally semicircular arc shape from one edge thereof toward an widthwise inside thereof are formed in the relay terminals 9. In addition, insulating base layer cutouts 12 are formed in the first insulating base layer 3 to correspond to the terminal cutouts 10. The circuit suspension board 1 and a flexible wired circuit board for relay 21 are electrically connected to each other by fitting bumps 29 formed on suspension terminals 26 of the flexible wired circuit board for relay 21 in the terminal cutouts 10.
摘要翻译：一种布线电路板，其可以允许布线电路板相对于彼此正交的方向以简单的结构精确连接，同时允许布线电路板的尺寸减小，并且布线电路板的连接结构包括两个有线电路板相对于彼此正交的方向彼此连接。电路悬挂板1的继电器端子9沿着电路悬挂板1的一个宽度方向的边缘布置，并且在中继端子9中形成从其一个边缘向其宽度方向内侧切割成大致半圆弧形的端子切口10。此外，在第一绝缘基底层3中形成绝缘基底层切口12以对应于端子切口10.电路悬挂板1和用于继电器21的柔性布线电路板通过形成的凸块29彼此电连接在终端切口10中用于继电器21的柔性布线电路板的悬挂端子26上。

6. 发明授权

US07351914B2 Flexible printed circuit board for catheter, catheter using same, and production method of catheter 失效
标题翻译：用于导管的柔性印刷电路板，使用其的导管以及导管的制造方法
公开(公告)号：US07351914B2
公开(公告)日：2008-04-01
申请号：US11405587
申请日：2006-04-18
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： A61B5/03 , A61B5/01 , A61B5/6852 , A61B2562/222 , A61M25/00 , A61M25/0105 , H05K1/028 , H05K3/0061 , H05K2201/055
摘要： The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.
摘要翻译：本发明提供了一种柔性印刷电路板，其具有整体上的带状曲折图案，该柔性印刷电路板包括彼此平行配置的多个直线部分，以及连接到两个相邻直线部分的纵向方向上的一端的折叠边缘多个线性部分，并且当折叠边缘在其中心附近被折叠时，可以变成具有不小于300mm的总长度的单个线性产品，并且在折叠边缘处，两个直线部分连接到折叠边缘的方向与180度相反的方向折回。结果，可以使用通用生产设备来制造用于导管的用于导管的信号线的足够细长的用于导管的柔性印刷电路板。

7. 发明授权

US07067912B2 Wired circuit board 失效
标题翻译：有线电路板
公开(公告)号：US07067912B2
公开(公告)日：2006-06-27
申请号：US10860493
申请日：2004-06-04
申请人： Yoshihiko Takeuchi , Yasuhito Ohwaki , Yuichi Takayoshi
发明人： Yoshihiko Takeuchi , Yasuhito Ohwaki , Yuichi Takayoshi
IPC分类号： H01L23/48 , H01L23/02 , H01L23/04 , H05K1/03
CPC分类号： H01L23/49833 , H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K1/0237 , H05K1/056 , H05K1/141 , H05K1/147 , H05K3/108 , H05K3/363 , H05K2201/0367 , H05K2201/0715 , H05K2201/093 , H05K2201/0969 , H01L2924/00
摘要： A wired circuit board can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signals. The wired circuit board includes a relay flexible wiring circuit board formed by a first wired circuit board including a first metal substrate, a first insulating base layer, a first conductor layer and a first insulating cover layer which is substantially identical in layer structure with the suspension board with circuit and a second wired circuit board connected with the first wired circuit board for connecting with a control circuit board. Since the suspension board with circuit and the first wired circuit board are rendered substantially identical in layer structure, both characteristic impedances at these connection points can be matched.
摘要翻译：布线电路板可以通过简单的结构来控制悬挂板的导线之间的连接点处的特性阻抗，其电路和与其连接的布线电路板的端子部分，以便即使对于细间距布线或高频信号来提高信号传输效率。布线电路板包括由第一布线电路板形成的中继柔性布线电路板，第一布线电路板包括第一金属基板，第一绝缘基底层，第一导体层和第一绝缘覆盖层，其与悬浮液的层结构基本相同与第一布线电路板连接的第二布线电路板用于与控制电路板连接。由于具有电路的悬架板和第一布线电路板的层结构基本相同，所以这些连接点的两个特性阻抗都可以匹配。

8. 发明申请

US20050161775A1 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US20050161775A1
公开(公告)日：2005-07-28
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： G11B5/60 , G11B5/31 , G11B5/39 , G11B21/21 , G11B33/12 , H01L23/58 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/46
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

9. 发明授权

US06717059B2 Circuit board and connection structure of terminal portion of the same 失效
标题翻译：电路板及其端子部分的连接结构
公开(公告)号：US06717059B2
公开(公告)日：2004-04-06
申请号：US09974048
申请日：2001-10-11
申请人： Toshio Shintani , Yasuhito Ohwaki
发明人： Toshio Shintani , Yasuhito Ohwaki
IPC分类号： H05K109
CPC分类号： H05K3/244 , G11B5/484 , G11B5/4846 , H01R4/02 , H01R13/03 , H05K3/3463
摘要： A nickel plating layer having a thickness within a range of 1.0 to 4.0 &mgr;m is formed in a terminal portion of a circuit board as an underlying plating layer. After a soldering bump is formed on the underlying plating layer, the soldering bump is connected to an external terminal formed in an external circuit.
摘要翻译：在作为下面的镀层的电路板的端子部分中形成厚度在1.0至4.0μm范围内的镀镍层。在下面的镀层上形成焊接凸块之后，焊接凸块连接到形成在外部电路中的外部端子。

10. 发明授权

US08134080B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US08134080B2
公开(公告)日：2012-03-13
申请号：US11477935
申请日：2006-06-30
申请人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
IPC分类号： H05K1/09
CPC分类号： H05K3/38 , H05K1/056 , H05K3/06 , H05K3/205 , H05K3/44 , H05K2201/0379 , H05K2201/0969 , H05K2201/09781 , H05K2201/2072 , H05K2203/0323
摘要： A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.
摘要翻译：一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

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