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1. 发明授权

US08134080B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US08134080B2
公开(公告)日：2012-03-13
申请号：US11477935
申请日：2006-06-30
申请人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
IPC分类号： H05K1/09
CPC分类号： H05K3/38 , H05K1/056 , H05K3/06 , H05K3/205 , H05K3/44 , H05K2201/0379 , H05K2201/0969 , H05K2201/09781 , H05K2201/2072 , H05K2203/0323
摘要： A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.
摘要翻译：一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

2. 发明申请

US20070017695A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20070017695A1
公开(公告)日：2007-01-25
申请号：US11477935
申请日：2006-06-30
申请人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
IPC分类号： H05K1/09
CPC分类号： H05K3/38 , H05K1/056 , H05K3/06 , H05K3/205 , H05K3/44 , H05K2201/0379 , H05K2201/0969 , H05K2201/09781 , H05K2201/2072 , H05K2203/0323
摘要： A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.
摘要翻译：一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

3. 发明申请

US20050161775A1 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US20050161775A1
公开(公告)日：2005-07-28
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： G11B5/60 , G11B5/31 , G11B5/39 , G11B21/21 , G11B33/12 , H01L23/58 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/46
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

4. 发明授权

US07084493B2 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US07084493B2
公开(公告)日：2006-08-01
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H01L23/14 , H01L51/40
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1–5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

5. 发明申请

US20060269730A1 Wired circuit board and production method thereof 有权
公开(公告)号：US20060269730A1
公开(公告)日：2006-11-30
申请号：US11439307
申请日：2006-05-24
申请人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
发明人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
IPC分类号： B32B3/00 , B32B17/00 , B05D5/12
CPC分类号： H05K1/0259 , H05K1/056 , H05K1/167 , H05K3/28 , H05K2201/0317 , H05K2203/0315 , Y10T428/24917 , Y10T428/24926
摘要： A wired circuit board that can remove static electricity not only from an insulating base layer and an insulating cover layer but also from a terminal portion, to effectively prevent an electronic component mounted from being damaged by static electricity and also prevent stripping of a semi-conductive layer. In a suspension board with circuit including an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, and an insulating cover layer, formed on the insulating cover layer, to cover the conductive pattern and form an opening, semi-conductive layer is formed in succession on an upper surface of the insulating base layer covered with the insulating cover layer, on a lateral side surface and an upper surface of the conductive pattern, and on a lateral side surface of the insulating base layer adjacent to the metal supporting board.

6. 发明授权

US07501581B2 Wired circuit board and producing method thereof 有权
公开(公告)号：US07501581B2
公开(公告)日：2009-03-10
申请号：US11634868
申请日：2006-12-07
申请人： Yasuhito Funada , Jun Ishii
发明人： Yasuhito Funada , Jun Ishii
IPC分类号： H05K1/00
CPC分类号： H05K1/0269 , H05K1/056 , H05K3/44 , H05K2201/0338 , H05K2201/0347 , H05K2201/09781 , H05K2201/09918 , H05K2203/0723
摘要： A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark layer, and the insulating layer to improve the adhesion therebetween and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board. A resist is formed in a pattern and a ground layer and a positioning mark layer are formed on the first metal thin film exposed from the resist at the same time. A second metal thin film is formed over the ground layer and the positioning mark layer, then the resist is removed. An insulating base layer is formed on the first metal thin film including the upper surface of the second metal thin film, thereafter, a conductive pattern is formed on the insulating base layer.

7. 发明申请

US20070131449A1 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US20070131449A1
公开(公告)日：2007-06-14
申请号：US11634868
申请日：2006-12-07
申请人： Yasuhito Funada , Jun Ishii
发明人： Yasuhito Funada , Jun Ishii
IPC分类号： H05K1/00
CPC分类号： H05K1/0269 , H05K1/056 , H05K3/44 , H05K2201/0338 , H05K2201/0347 , H05K2201/09781 , H05K2201/09918 , H05K2203/0723
摘要： A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark layer, and the insulating layer to improve the adhesion therebetween and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board. A resist is formed in a pattern and a ground layer and a positioning mark layer are formed on the first metal thin film exposed from the resist at the same time. A second metal thin film is formed over the ground layer and the positioning mark layer, then the resist is removed. An insulating base layer is formed on the first metal thin film including the upper surface of the second metal thin film, thereafter, a conductive pattern is formed on the insulating base layer.
摘要翻译：提供一种布线电路板及其制造方法，其可以精确地形成绝缘层，并且以简单的层结构减小传输损耗，并且还通过防止接地层和接地层之间的离子迁移现象的发生而具有优异的长期可靠性定位标记层和绝缘层，以改善其间的粘附性和导体的导电性。制备金属支撑板，在金属支撑板上形成第一金属薄膜。在图案中形成抗蚀剂，同时在从抗蚀剂暴露的第一金属薄膜上形成接地层和定位标记层。在接地层和定位标记层上形成第二金属薄膜，然后除去抗蚀剂。在包括第二金属薄膜的上表面的第一金属薄膜上形成绝缘基底层，之后在绝缘基底层上形成导电图案。

8. 发明授权

US07638873B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07638873B2
公开(公告)日：2009-12-29
申请号：US11606021
申请日：2006-11-30
申请人： Jun Ishii , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Funada
IPC分类号： H01L23/04
CPC分类号： H05K1/056 , H05K3/388 , H05K3/44 , H05K2201/0317 , H05K2201/0338 , H05K2201/09845 , H05K2203/0723 , Y10T428/24917
摘要： A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating layer and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board by sputtering or electrolytic plating. A metal foil is formed on the first metal thin film by electrolytic plating. A second metal thin film is formed over the metal foil and the metal supporting board by electroless plating or sputtering. An insulating base layer is formed on the second metal thin film. A conductive pattern is formed as a wired circuit pattern on the insulating base layer. An insulating cover layer is formed on the insulating base layer to cover the conductive pattern.
摘要翻译：提供一种布线电路板，其可以通过简单的层结构降低传输损耗，并且还通过防止金属箔和绝缘层之间的离子迁移现象的发生而具有优异的长期可靠性，以提高金属箔和绝缘层之间的粘附性绝缘层和导体的导电性。制备金属支撑板，并且通过溅射或电解电镀在金属支撑板上形成第一金属薄膜。通过电解电镀在第一金属薄膜上形成金属箔。通过无电镀或溅射在金属箔和金属支撑板上形成第二金属薄膜。在第二金属薄膜上形成绝缘基层。导电图案形成为绝缘基底层上的布线电路图案。绝缘覆盖层形成在绝缘基底层上以覆盖导电图案。

9. 发明申请

US20070051534A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20070051534A1
公开(公告)日：2007-03-08
申请号：US11514963
申请日：2006-09-05
申请人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
发明人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
IPC分类号： H05K1/00
CPC分类号： H05K3/28 , H05K1/0259 , H05K1/056 , H05K1/167 , H05K3/16 , H05K2201/0769
摘要： The invention provides a wired circuit board that can prevent deterioration of a conductive pattern and short-circuiting of the conductive pattern. The wired circuit board is presented herein in the form of a suspension board with circuit which comprises an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, a metal oxide layer formed on a surface of the conductive pattern and on a surface of the insulating base layer by sputtering, and an insulating cover layer, formed on the metal oxide layer, to cover the conductive pattern. According to this suspension board with circuit, since the metal oxide layer to cover the conductive pattern is formed by the sputtering, the metal oxide layer can be formed with a uniform thickness. Hence, the metal oxide layer can fully function as a barrier layer to the conductive pattern and, accordingly, deterioration of the conductive pattern and the short-circuiting of the conductive pattern can be prevented effectively.
摘要翻译：本发明提供一种布线电路板，其可以防止导电图案的劣化和导电图案的短路。布线电路板在这里以具有电路的悬挂板的形式呈现，该电路包括形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在导电的表面上的金属氧化物层通过溅射形成在绝缘基底层的表面上，以及形成在金属氧化物层上的覆盖导电图案的绝缘覆盖层。根据具有电路的该悬挂板，由于通过溅射形成覆盖导电图案的金属氧化物层，所以可以形成均匀的厚度的金属氧化物层。因此，金属氧化物层可以充分发挥导电图案的阻挡层的作用，因此可以有效地防止导电图案的劣化和导电图案的短路。

10. 发明申请

US20060199402A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060199402A1
公开(公告)日：2006-09-07
申请号：US11365845
申请日：2006-03-02
申请人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
发明人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
IPC分类号： H01R12/00
CPC分类号： H05K1/056 , H05K2201/0317 , H05K2201/0338 , H05K2203/0723
摘要： A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.
摘要翻译：一种布线电路板，其能够以简单的层状结构提供降低的传输损耗和改善金属悬挂板和金属箔之间的粘附强度，从而确保改善的长期可靠性。布线电路板1包括金属悬挂板2，通过溅射或电解电镀形成在金属悬挂板2上的薄金属膜3，通过电解电镀形成在金属薄膜3上的金属箔4，绝缘基底层形成在金属箔4和金属悬挂板2上的导电图案6和形成在绝缘基底层5上的布线电路图案的导电图案6。布线电路板1可以包括形成在绝缘基底层5上以覆盖导电图案6的绝缘覆盖层7。

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