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1. 发明授权

US06399899B1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US06399899B1
公开(公告)日：2002-06-04
申请号：US09712980
申请日：2000-11-16
申请人： Tadao Ohkawa , Yasuhito Ohwaki , Shigenori Morita , Toshihiko Omote
发明人： Tadao Ohkawa , Yasuhito Ohwaki , Shigenori Morita , Toshihiko Omote
IPC分类号： H01R1204
CPC分类号： H05K1/0271 , G11B5/486 , H01R4/023 , H01R13/58 , H01R2201/06 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/361 , H05K3/388 , H05K2201/0154 , H05K2201/0394
摘要： To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability, the suspension board with circuit 11 includes a suspension board 12, a base layer 13 formed on the suspension board 12, and a conductive layer 14 formed on the base layer 13 and a cover layer 18 with which the conductive layer 14 is covered, wherein external connection terminals 17 to be bonded to terminals 28 of a read/write board 29 are formed without the suspension board 12 and/or the base layer 13 being formed.
摘要翻译：为了提供具有使得其端子能够以足够的结构结合到其它端子的电路的悬挂板，为了确保足够的接合可靠性，具有电路11的悬挂板包括悬挂板12，形成在基板13上的基底层13 悬垂基板12和形成在基底层13上的导电层14和覆盖导电层14的覆盖层18，其中形成与读/写板29的端子28接合的外部连接端子17不形成形成悬挂板12和/或基层13。

2. 发明授权

US06380493B1 Circuit board 有权
标题翻译：电路板
公开(公告)号：US06380493B1
公开(公告)日：2002-04-30
申请号：US09695904
申请日：2000-10-26
申请人： Shigenori Morita , Yasuhito Ohwaki , Tadao Ohkawa , Toshihiko Omote
发明人： Shigenori Morita , Yasuhito Ohwaki , Tadao Ohkawa , Toshihiko Omote
IPC分类号： H05K302
CPC分类号： G11B5/486 , H05K1/024 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0154 , H05K2203/0597
摘要： To provide a circuit board, having a circuit pattern of adequate high-frequency characteristics, for transmitting high-frequency electric signals at high speed, a circuit board, including a base layer formed of insulating material and a conductive layer formed on the base layer in the form of a specified circuit pattern, is so constructed that an air layer is made to lie between lines of wire of the circuit pattern or is so constructed that the lines of wire are covered with the cover layer but land portions of the base layer extending between the lines of wire are not covered with the cover layer. This construction of the invention enables dielectric constant between the lines of wire to be reduced and, as a result of this, the capacitance between the lines of wire can be reduced to provide improved high-frequency characteristics of the circuit pattern.
摘要翻译：为了提供具有足够的高频特性的电路图形用于高速传输高频电信号的电路板，包括由绝缘材料形成的基底层和形成在基底层上的导电层的电路板指定电路图案的形式被构造成使得空气层位于电路图案的线之间，或者被构造成使得线的线被覆盖层覆盖，但是基底层的接地部分延伸线之间的线不被覆盖层覆盖。本发明的这种结构能够使线路线之间的介电常数降低，并且因此可减少线路之间的电容，从而提供改进的电路图案的高频特性。

3. 发明授权

US07007379B2 Production method of printed circuit board 有权
标题翻译：印刷电路板的生产方法
公开(公告)号：US07007379B2
公开(公告)日：2006-03-07
申请号：US10385172
申请日：2003-03-10
申请人： Makoto Komatsubara , Yasuhito Ohwaki , Takeshi Yoshimi , Shigenori Morita
发明人： Makoto Komatsubara , Yasuhito Ohwaki , Takeshi Yoshimi , Shigenori Morita
IPC分类号： H05K3/10
CPC分类号： H05K3/108 , H05K1/056 , H05K3/064 , H05K3/205 , H05K3/44 , H05K2201/09781 , H05K2203/0323 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layer 2 is formed in a given pattern on one surface of a supporting substrate 1, a circuit pattern 6 is formed on the insulating layer 2 while forming a dummy pattern 7 in an area free of the insulating layer 2 on the one surface of the supporting substrate 1, and an unnecessary part of the supporting substrate 1, which is free of the insulating layer 2 and the circuit pattern 6, is removed by dissolution together with the dummy pattern 7.
摘要翻译：本发明提供一种具有电路图案的印刷电路板的制造方法，该电路图案在低成本下具有小的厚度变化，而没有用于去除虚拟图案的特殊步骤。本发明的特征在于，在支撑基板1的一个表面上以给定的图案形成绝缘层2，在绝缘层2上形成电路图案6，同时在没有绝缘层的区域中形成虚设图案7 在支撑基板1的一个表面上的层2，并且不存在绝缘层2和电路图案6的支撑基板1的不需要的部分通过与虚设图案7一起溶解而被去除。

4. 发明授权

US09147861B2 Surface light-emitting object 有权
标题翻译：表面发光物体
公开(公告)号：US09147861B2
公开(公告)日：2015-09-29
申请号：US13985841
申请日：2012-01-11
申请人： Junichi Nagase , Kazuhito Hosokawa , Takahiro Nakai , Shigenori Morita
发明人： Junichi Nagase , Kazuhito Hosokawa , Takahiro Nakai , Shigenori Morita
IPC分类号： H01L29/08 , H01L51/52 , G02B3/00 , G02B5/02 , H01L27/32 , H05B33/10
CPC分类号： H01L51/5275 , G02B3/005 , G02B5/02 , H01L27/32 , H01L2251/5361 , H05B33/10
摘要： A surface light emitter according to an embodiment of the present invention, includes: a base material; a plurality of ribbon-shaped organic electroluminescent elements provided side by side on the base material; and a lenticular sheet that is attached to the base material and the ribbon-shaped organic electroluminescent elements through an adhesion layer, and that has a plurality of convex cylindrical lenses provided side by side. A direction in which the convex cylindrical lenses extend and a direction in which the ribbon-shaped organic electroluminescent elements extend are substantially parallel to each other.
摘要翻译：根据本发明实施例的面光发射器包括：基材; 在基材上并排设置的多个带状有机电致发光元件; 以及通过粘合层附接到基材和带状有机电致发光元件的双凸透镜片，并且具有并排设置的多个凸柱面透镜。凸出的圆柱形透镜延伸的方向和带状有机电致发光元件延伸的方向基本上彼此平行。

5. 发明申请

US20140216519A1 METHOD FOR PRODUCING SOLAR BATTERY CELL AND SOLAR BATTERY MODULE 审中-公开
标题翻译：生产太阳能电池和太阳能电池模块的方法
公开(公告)号：US20140216519A1
公开(公告)日：2014-08-07
申请号：US14346174
申请日：2012-08-24
申请人： Taichi Watanabe , Seiki Teraji , Kazunori Kawamura , Hiroto Nishii , Shigenori Morita
发明人： Taichi Watanabe , Seiki Teraji , Kazunori Kawamura , Hiroto Nishii , Shigenori Morita
IPC分类号： H01L31/042 , H01L31/18
CPC分类号： H01L31/042 , B26D1/08 , B26D3/06 , B26F3/002 , H01L31/03926 , H01L31/0463 , H01L31/0504 , Y02E10/541 , Y02P70/521
摘要： A method for producing a solar battery cell which hardly causes an electric short circuit at the cut end surface of a solar battery element is provided. A method for producing a solar battery cell in which a solar battery cell is obtained from an elongated solar battery element including an elongated flexible base material, a first electrode layer, a light absorbing layer, and a second electrode layer in this order, and the method includes a partial removal step of forming one or more partial removal portion each extending like a belt at a plurality of parts in the surface of the solar battery element by partially removing layers of the second electrode layer through to the light absorbing layer or the second electrode layer through to the first electrode layer, and a cutting step of cutting the solar battery element at the partial removal portion.
摘要翻译：提供了一种太阳能电池单元的切割端面很难引起电短路的制造方法。一种太阳能电池单元的制造方法，其中太阳能电池单元是从包括细长柔性基材，第一电极层，光吸收层和第二电极层的细长太阳能电池元件获得的，并且方法包括：部分去除步骤，其形成一个或多个部分去除部分，每个部分去除部分通过部分地去除第二电极层的层通过光吸收层或第二部分去除而在太阳能电池元件的表面中的多个部分处的带状延伸电极层通过第一电极层，以及在部分去除部分切割太阳能电池元件的切割步骤。

6. 发明申请

US20060201161A1 Cooling device for electronic component using thermo-electric conversion material 审中-公开
标题翻译：使用热电转换材料的电子部件冷却装置
公开(公告)号：US20060201161A1
公开(公告)日：2006-09-14
申请号：US10540523
申请日：2003-12-26
申请人： Shinji Hirai , Toshiyuki Nishimura , Yoichiro Uemura , Shigenori Morita , Kazumasa Igarashi
发明人： Shinji Hirai , Toshiyuki Nishimura , Yoichiro Uemura , Shigenori Morita , Kazumasa Igarashi
IPC分类号： F25B21/02 , H01L35/28 , F25D23/12
CPC分类号： H01L23/38 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for a heat-generating electronic component such as a semiconductor integrated circuit element is provided. In particular, a cooling device using a thermoelectric conversion material is provided. A cooling device for an electronic component includes a thermoelectric conversion material disposed between two electrodes that function as a cathode and an anode and are electrically short-circuited. The thermoelectric conversion material is either a p-type material or an n-type material or a combination of p-type and n-type materials arranged alternately in series. This cooling device is brought into contact with an electronic component requiring cooling so that one electrode side in contact with the thermoelectric conversion material becomes a low-temperature side and the other electrode side becomes a high-temperature side. A temperature difference between the two electrodes causes the thermoelectric conversion material to produce a thermoelectromotive force which generates current to cool the high-temperature side.
摘要翻译：提供了一种用于诸如半导体集成电路元件的发热电子部件的冷却装置。特别地，提供了使用热电转换材料的冷却装置。电子部件的冷却装置包括设置在两个电极之间的热电转换材料，该电极用作阴极和阳极并且电短路。热电转换材料是p型材料或n型材料，或者是串联交替布置的p型和n型材料的组合。该冷却装置与需要冷却的电子部件接触，使得与热电转换材料接触的一个电极侧成为低温侧，另一个电极侧成为高温侧。两个电极之间的温差导致热电转换材料产生产生电流以冷却高温侧的热电动势。

7. 发明申请

US20140051198A1 METHOD AND APPARATUS FOR MANUFACTURING ORGANIC EL DEVICE 有权
标题翻译：制造有机EL器件的方法和装置
公开(公告)号：US20140051198A1
公开(公告)日：2014-02-20
申请号：US14114142
申请日：2012-04-06
申请人： Ryohei Kakiuchi , Shigenori Morita , Kanako Hida
发明人： Ryohei Kakiuchi , Shigenori Morita , Kanako Hida
IPC分类号： H01L51/50 , H01L51/00 , H01L51/56
CPC分类号： H01L51/5012 , C23C14/12 , C23C14/24 , C23C14/562 , H01L51/0002 , H01L51/0004 , H01L51/56 , H01L2251/55 , H05B33/10
摘要： Provided is a method for manufacturing an organic EL device, including: a vapor deposition step of forming an organic layer over a substrate moving relative to a nozzle by discharging a vaporized organic layer-forming material through the nozzle. The vapor deposition step is performed so that a light emitting region formed of the organic layer and having a width A (mm) in a direction perpendicular to a direction in which the substrate is moving is formed, and so that W≧A+2×h (where h≦5 mm) is satisfied, where a length of an opening of the nozzle in the direction perpendicular to the direction in which the substrate is moving is denoted by W (mm), and a distance between the opening and the substrate is denoted by h (mm).
摘要翻译：本发明提供一种制造有机EL器件的方法，包括：蒸镀步骤，通过经由喷嘴排出蒸发的有机层形成材料，在相对于喷嘴移动的基板上形成有机层。进行气相沉积步骤，使得形成有机层形成的发光区域，并且在与基板移动方向垂直的方向上形成宽度A（mm），从而W> = A + 2 ×h（其中h≤5mm），其中喷嘴在与基板移动方向垂直的方向上的开口长度用W（mm）表示，并且开口与衬底由h（mm）表示。

8. 发明授权

US08609236B2 Adhesive for polarizing plate, polarizing plate, manufacturing method therefor, optical film and image display 有权
公开(公告)号：US08609236B2
公开(公告)日：2013-12-17
申请号：US11808255
申请日：2007-06-07
申请人： Tetsurou Ikeda , Masakatsu Urairi , Akinobu Souma , Shigenori Morita , Chieko Kitaura , Junichi Fujisawa , Reiko Akari , Shigeki Kawabe , Masayuki Satake
发明人： Tetsurou Ikeda , Masakatsu Urairi , Akinobu Souma , Shigenori Morita , Chieko Kitaura , Junichi Fujisawa , Reiko Akari , Shigeki Kawabe , Masayuki Satake
IPC分类号： B01F17/00 , C08K3/10 , B32B5/16
CPC分类号： G02B5/30 , B29D11/0073 , C08K3/22 , C08K7/18 , C09J11/04 , C09J129/04 , C09J2429/00 , G02B1/105 , G02B1/14 , G02F2202/28 , Y10T428/1041 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/2878
摘要： An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.

9. 发明申请

US20120171359A1 ORGANIC EL DEVICE MANUFACTURING METHOD AND APPARATUS 有权
标题翻译：有机EL器件制造方法和装置
公开(公告)号：US20120171359A1
公开(公告)日：2012-07-05
申请号：US13332864
申请日：2011-12-21
申请人： Takahiro Nakai , Shigenori Morita
发明人： Takahiro Nakai , Shigenori Morita
IPC分类号： B05D5/06 , C23C16/04 , B05D5/12
CPC分类号： H01L51/0011 , C23C14/042 , C23C14/12 , C23C14/562 , H01L51/0012 , H01L51/56
摘要： An organic EL device manufacturing method includes a step of supplying a substrate, and while moving the substrate with a non-electrode-layer side thereof in contact with a surface of a can roller, the non-electrode-layer provided with no electrode layer, discharging a material from a nozzle of a vapor deposition source to form an organic layer on an electrode-layer side of the substrate, the electrode-layer side provided with an electrode layer. The vapor deposition step includes supplying a shadow mask including an opening portion to interpose the shadow mask between the substrate contacting the can roller, and the nozzle; and forming the organic layer corresponding to the opening portion on the electrode-layer side of the substrate while moving the substrate and the shadow mask with through holes included at each of the substrate and the shadow mask engaged with projections included in the can roller.
摘要翻译：一种有机EL器件制造方法包括：提供衬底的步骤，并且在使非电极层侧的基板与罐辊的表面接触的同时移动基板，设置不具有电极层的非电极层，从蒸镀源的喷嘴排出材料，在基板的电极层侧形成有机层，电极层侧设置有电极层。气相沉积步骤包括：提供包括开口部分的荫罩，以将荫罩插入到与罐辊接触的基板与喷嘴之间; 在基板和荫罩的基板和荫罩中包含的通孔中移动基板和荫罩的同时，形成与基板的电极层侧的开口部相对应的有机层，并与包含在筒辊中的突起配合。

10. 发明授权

US08183093B2 Method of manufacturing a semiconductor device by lamination 有权
标题翻译：通过层压制造半导体器件的方法
公开(公告)号：US08183093B2
公开(公告)日：2012-05-22
申请号：US12732767
申请日：2010-03-26
申请人： Naoko Yoshida , Takashi Oda , Shigenori Morita
发明人： Naoko Yoshida , Takashi Oda , Shigenori Morita
IPC分类号： H01L21/00
CPC分类号： H01L24/03 , H01L21/6835 , H01L2221/68372 , H01L2224/02319 , H01L2224/0401 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.
摘要翻译：具有至少布线部分和绝缘部分的布线电路层2，其顶表面和底表面（20A，20B）是粘合表面，以使得层2可以从金属支撑基板1上剥离的方式形成在金属支撑基板1上基板1.暴露在布线电路层2的第一粘合面20A中的是第一连接导体部21，其与晶片状态的第一半导体元件3的电极31连接。在将电路层2层压并连接到元件3之后，金属支撑基板1从布线电路层2剥离，得到半导体器件4.另一个元件可以连接到暴露在元件3上的另一个粘合表面20B 剥皮

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