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    • 8. 发明授权
    • Atomic layer deposition processes for non-volatile memory devices
    • 用于非易失性存储器件的原子层沉积工艺
    • US07659158B2
    • 2010-02-09
    • US12059782
    • 2008-03-31
    • Yi MaShreyas S. KherKhaled AhmedTejal GoyaniMaitreyee MahajaniJallepally RaviYi-Chiau Huang
    • Yi MaShreyas S. KherKhaled AhmedTejal GoyaniMaitreyee MahajaniJallepally RaviYi-Chiau Huang
    • H01L21/8238H01L29/788
    • H01L29/42324H01L21/28273H01L29/7881
    • Embodiments of the invention provide memory devices and methods for forming memory devices. In one embodiment, a memory device is provided which includes a floating gate polysilicon layer disposed over source/drain regions of a substrate, a silicon oxynitride layer disposed over the floating gate polysilicon layer, a first aluminum oxide layer disposed over the silicon oxynitride layer, a hafnium silicon oxynitride layer disposed over the first aluminum oxide layer, a second aluminum oxide layer disposed over the hafnium silicon oxynitride layer, and a control gate polysilicon layer disposed over the second aluminum oxide layer. In another embodiment, a memory device is provided which includes a control gate polysilicon layer disposed over an inter-poly dielectric stack disposed over a silicon oxide layer disposed over the floating gate polysilicon layer. The inter-poly dielectric stack contains two silicon oxynitride layers separated by a silicon nitride layer.
    • 本发明的实施例提供了用于形成存储器件的存储器件和方法。 在一个实施例中,提供了一种存储器件,其包括设置在衬底的源极/漏极区域上的浮置栅极多晶硅层,设置在浮置栅极多晶硅层上的氧氮化硅层,设置在氧氮化硅层上的第一氧化铝层, 设置在所述第一氧化铝层上的铪硅氮化物层,设置在所述铪硅氮氧化物层上的第二氧化铝层,以及设置在所述第二氧化铝层上的控制栅极多晶硅层。 在另一个实施例中,提供了一种存储器件,其包括设置在布置在浮置多晶硅层上方的氧化硅层上的多晶硅介质叠层之间的控制栅极多晶硅层。 多晶硅间介质堆叠包含由氮化硅层分隔的两个氮氧化硅层。