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    • 7. 发明申请
    • Treatment processes for a batch ALD reactor
    • 批量ALD反应器的处理工艺
    • US20070065578A1
    • 2007-03-22
    • US11232455
    • 2005-09-21
    • Brendan McDougall
    • Brendan McDougall
    • C23C16/00
    • C23C16/45546C23C16/4404C23C16/4408C23C16/45527
    • Embodiments of the invention provide treatment processes to reduce substrate contamination during a fabrication process within a vapor deposition chamber. A treatment process may be conducted before, during or after a vapor deposition process, such as an atomic layer deposition (ALD) process. In one example of an ALD process, a process cycle, containing an intermediate treatment step and a predetermined number of ALD cycles, is repeated until the deposited material has a desired thickness. The chamber and substrates may be exposed to an inert gas, an oxidizing gas, a nitriding gas, a reducing gas or plasmas thereof during the treatment processes. In some examples, the treatment gas contains ozone, water, ammonia, nitrogen, argon or hydrogen. In one example, a process for depositing a hafnium oxide material within a batch process chamber includes a pretreatment step, an intermediate step during an ALD process and a post-treatment step.
    • 本发明的实施例提供了在气相沉积室内的制造过程中减少基底污染的处理过程。 处理过程可以在诸如原子层沉积(ALD)工艺的气相沉积工艺之前,期间或之后进行。 在ALD过程的一个实例中,重复包含中间处理步骤和预定数量的ALD循环的处理循环,直到沉积材料具有期望的厚度。 在处理过程中,室和衬底可以暴露于惰性气体,氧化气体,氮化气体,还原气体或等离子体中。 在一些实例中,处理气体含有臭氧,水,氨,氮,氩或氢。 在一个实例中,用于在间歇处理室内沉积氧化铪材料的方法包括预处理步骤,ALD工艺期间的中间步骤和后处理步骤。