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1. 发明专利

JP2014135336A Semiconductor wafer processing sheet and manufacturing method of the same 审中-公开
标题翻译： SEMICONDUCTOR WAFER PROCESSING SHEET AND MANUFACTURING METHOD OF THE SAME
公开(公告)号：JP2014135336A
公开(公告)日：2014-07-24
申请号：JP2013001514
申请日：2013-01-09
申请人： Lintec Corp , リンテック株式会社
发明人： AZUMA YUICHIRO , ICHIKAWA ISAO , SHINODA HIROFUMI , WATANABE KENICHI
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To reduce damages on an adhesive resin layer at the time of manufacturing a semiconductor wafer processing sheet including the adhesive resin layer and at the time of attachment to a wafer.SOLUTION: A semiconductor wafer processing sheet according to the present embodiment comprises an adhesive resin layer which is laminated in a peelable manner on an adhesive layer of a nearly circular pressure sensitive adhesive sheet having a base material and the adhesive layer provided on one surface of the base material, in which a planar shape of the adhesive resin layer is polygonal.
摘要翻译：要解决的问题：减少在制造包括粘合树脂层的半导体晶片处理片材时以及在附着到晶片时对粘合树脂层的损伤。解决方案：根据本实施例的半导体晶片处理片包括粘合树脂层，其以可剥离的方式层压在具有基材的近似圆形的压敏粘合剂片的粘合剂层上，并且在基材的一个表面上设置粘合剂层，其中粘合剂树脂的平面形状层是多边形。

2. 发明专利

JP2009160869A Laminated sheet, laminated sheet roll and their production process 审中-公开
标题翻译：层压板，层压板及其生产工艺
公开(公告)号：JP2009160869A
公开(公告)日：2009-07-23
申请号：JP2008002049
申请日：2008-01-09
申请人： Lintec Corp , リンテック株式会社
发明人： FUJIMOTO YASUSHI , MURAYAMA KENICHI , HAYAKAWA MOTOYUKI , SHINODA HIROFUMI
IPC分类号： B32B27/00 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a laminated sheet, a laminated sheet roll and their production process; wherein the laminated sheet can reduce protrusion of an adhesive from a pressure sensitive adhesion sheet when the laminated sheet is rolled up.
SOLUTION: A groove 30A is prepared between an adhesive sheet 10A and an auxiliary sheet 20A, in a laminated sheet 1A equipped with a long length release sheet 2A, long length auxiliary sheets 20A arranged on a release surface in both side regions in width direction of the release sheet 2A, and the long length pressure sensitive adhesive sheet 10A comprising a substrate 3A and an adhesive layer 4A and being prepared between the auxiliary sheets 20A on the release sheet 2A.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供层压片材，层压片材卷及其制造方法; 其中，当层压片材卷起时，层压片材可以减少粘合剂从压敏粘合片材的突出。解决方案：在具有长长度剥离片2A的层叠片1A中，在粘合片10A和辅助片20A之间制备槽30A，在长度方向上的两侧区域中布置在释放表面上的长长度辅助片20A 剥离片2A的宽度方向以及包含基材3A和粘合剂层4A的长
度压敏粘合片10A，并且被制备在剥离片2A上的辅助片20A之间。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2014094995A Blade die, adhesive sheet manufacturing apparatus, peeling method and manufacturing method of adhesive sheet 有权
标题翻译：胶片，粘合片制造装置，胶粘方法和胶粘剂的制造方法
公开(公告)号：JP2014094995A
公开(公告)日：2014-05-22
申请号：JP2012245770
申请日：2012-11-07
申请人： Lintec Corp , リンテック株式会社
发明人： NAKADA MIKI , HAYASAKA TAKUYA , SHINODA HIROFUMI , YAMADA TADATOMO
IPC分类号： C09J7/02 , C09J5/00 , G09F3/00
摘要： PROBLEM TO BE SOLVED: To provide a blade die, adhesive manufacturing apparatus, a peeling method and a manufacturing method of the adhesive sheet capable of preventing generation of residual adhesion phenomenon when an unnecessary part of one of two sheets laminated through an adhesive agent layer is peeled off with the adhesive agent layer.SOLUTION: A blade die 21 forms a first notch with closed area shape at least to a frist sheet and an adhesive agent layer of a laminate R1 having the adhesive agent layer on one side face of the first sheet and obtained by laminating a second sheet through the adhesive agent layer and peels an outside region from the first notch of the first sheet together with the first sheet and the adhesive agent layer to make an inner region from the first notch the adhesive sheet, and has a base plate 210, a first incised blade 211 with the closed area shape supported by the base plate 210 and forming the first notch from the first sheet side of the laminate R1, and a second incised blade 212 supported by the base plate 210 at the outer region of the incised blade 211 and of which a plurality are arranged along a direction intersected with a peeling direction along which the outer region of the first sheet is peeled.
摘要翻译：要解决的问题：为了提供一种当通过粘合剂层层压的两片不需要的部分之间的片材时，能够防止产生残留粘附现象的粘合片的刮片，粘合剂制造装置，剥离方法和制造方法是用粘合剂层剥离。解决方案：刀片模具21形成至少具有四边形片材的封闭区域形状的第一凹口和在第一片材的一个侧面上具有粘合剂层的层压体R1的粘合剂层并且通过层叠第二片材并通过粘合剂层将第一片材的第一切口的外部区域与第一片材和粘合剂层一起剥离，以从第一切口形成粘合片的内部区域，并且具有基板210，具有由基板210支撑的封闭区域形状的第一切割刀片211，并且从层叠体R1的第一片材侧形成第一切口以及由切割刀片211的外部区域处的基板210支撑的第二切口刀片212，并且沿着与第一片材的外部区域剥离的剥离方向相交的方向配置多个刀片。

4. 发明专利

JP2013209495A Base material-less two-sided adhesive tape, method for manufacturing the same, adhesive roll and method for producing the same 有权
标题翻译：基底材料两面胶粘带，其制造方法，粘合辊及其制造方法
公开(公告)号：JP2013209495A
公开(公告)日：2013-10-10
申请号：JP2012080157
申请日：2012-03-30
申请人： Lintec Corp , リンテック株式会社
发明人： KURATA YUICHI , SHINODA HIROFUMI , OHASHI HITOSHI
IPC分类号： C09J7/00
摘要： PROBLEM TO BE SOLVED: To provide a base material-less two-sided adhesive tape reduced in remaining of adhesive (peeling failure).SOLUTION: A lengthy base material-less two-sided adhesive tape 10 includes: a light-to-release sheet 1, a base material-less adhesive layer 2 and a heavy-to-release sheet 3, in which a peeling surface of the light-to-release sheet is in contact with one main surface of the base material-less adhesive layer, and a peeling surface of the heavy-to-release sheet is in contact with the other main surface. The peeling force Fof the light-to-release sheet and the peeling force Fof the heavy-to-release sheet satisfy the following expression (1), F-F≥10 mN/50 mm (1). The main surface on a remover layer side in the light-to-release sheet includes pasteless areas 1d, 1e, that are area in which the base material-less adhesive layer is not laminated, at both ends in the width direction.
摘要翻译：要解决的问题：提供减少残留粘合剂的基底材料的双面胶带（剥离故障）。解决方案：长基材无双面胶带10包括：光释放片 1，无光剥离片的剥离面与不含基底材料的粘合剂层的一个主面接触的无基材无粘合剂层2和重离开片3，以及重型剥离片的剥离面与另一主面接触。 F-F≥10mN/ 50mm（1）中，剥离片的剥离力F和重型剥离片的剥离力F满足下式（1）。在光剥离片的移除层一侧的主表面在宽度方向的两端具有作为不层叠无基材的粘合剂层的区域的无水区域1d，1e。

5. 发明专利

JP2014135337A Semiconductor wafer processing sheet and manufacturing method of the same 有权
标题翻译： SEMICONDUCTOR WAFER PROCESSING SHEET AND MANUFACTURING METHOD OF THE SAME
公开(公告)号：JP2014135337A
公开(公告)日：2014-07-24
申请号：JP2013001515
申请日：2013-01-09
申请人： Lintec Corp , リンテック株式会社
发明人： AZUMA YUICHIRO , ICHIKAWA ISAO , SHINODA HIROFUMI , WATANABE KENICHI
IPC分类号： H01L21/52 , C09J7/02 , C09J201/00 , H01L21/301 , H01L21/56 , H01L23/00 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To reduce damages on an adhesive resin layer at the time of manufacturing a semiconductor wafer processing sheet including the adhesive resin layer and at the time of attachment to a wafer.SOLUTION: A semiconductor wafer processing sheet 10 according to the present embodiment comprises an adhesive resin layer which is laminated in a peelable manner on an adhesive layer of a nearly circular pressure sensitive adhesive sheet having a base material and the adhesive layer provided on one surface of the base material, in which a planar shape of the adhesive resin layer is polygonal, and a tensile strength of the adhesive resin layer is 10 MPa and under.
摘要翻译：要解决的问题：为了减少在制造包括粘合树脂层的半导体晶片处理片材时以及在附着于晶片时的粘合树脂层的损伤。解决方案：根据本发明的半导体晶片处理片材实施方案包括粘合树脂层，其以可剥离的方式层压在具有基材的近似圆形压敏粘合剂的粘合剂层上，并且粘合层设置在基材的一个表面上，其中粘合剂的平面形状树脂层为多边形，粘合树脂层的拉伸强度为10MPa以下。

6. 发明专利

JP2008108847A Composite semiconductor device, semiconductor package and spacer sheet employed therein, and manufacturing method of composite semiconductor device 有权
标题翻译：复合半导体器件，半导体封装和其使用的间隔片，以及复合半导体器件的制造方法
公开(公告)号：JP2008108847A
公开(公告)日：2008-05-08
申请号：JP2006289070
申请日：2006-10-24
申请人： Lintec Corp , Senju Metal Ind Co Ltd , リンテック株式会社 , 千住金属工業株式会社
发明人： SHINODA TOMONORI , SHIZUHATA HIRONORI , SHINODA HIROFUMI , KAWAMATA YUJI , TAJIMA TAKESHI , SHIMAMURA MASAHITO , WATANABE MASAKO , AMAMI MASAZUMI
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06568 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a method for ensuring wiring connection between both semiconductor packages by ensuring an installation space between an upper semiconductor package and a lower semiconductor package in a POP type semiconductor package and preventing a short circuit of adjoining connection terminals, and to provide a semiconductor device. SOLUTION: The composite semiconductor device comprises a spacer sheet 100 having the wiring connection substrate 12 of an upper semiconductor package having a lower surface on which electrodes 122 for conducting between the packages are arranged, the wiring connection substrate 13 of a lower semiconductor package having an upper surface on which electrodes 132 for conducting between the packages are arranged, and through holes 104 arranged around an air gap for interconnecting the electrodes which are arranged oppositely between the substrates and bonded to the substrates while being sandwiched, connection terminals 141 and 142 provided in the through hole of the spacer sheet in order to conduct between the substrates, and a terminal 140 for external connection formed on the lower surface of the wiring connection substrate of a semiconductor package located at the lowest portion. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过确保在POP型半导体封装中的上半导体封装和下半导体封装之间的安装空间来确保两个半导体封装之间的布线连接的方法，并防止邻接的连接端子的短路并提供半导体器件。解决方案：复合半导体器件包括具有上半导体封装的布线连接基板12的间隔片100，下布置有用于在封装之间导电的电极122，下半导体的布线连接基板13 具有上表面的封装，其上布置有用于在封装之间导电的电极132;以及通孔104，布置在气隙周围，用于互连电极，这些电极相互布置在基板之间并被夹在基板之间，连接端子141和 142，其设置在间隔片的通孔中以便在基板之间导通，以及形成在位于最下部的半导体封装的布线连接基板的下表面上的外部连接用端子140。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008108846A Spacer sheet for composite semiconductor device, manufacturing method of semiconductor package and composite semiconductor device employing it, and composite semiconductor device 有权
标题翻译：用于复合半导体器件的间隔片，半导体封装的制造方法和使用它的复合半导体器件以及复合半导体器件
公开(公告)号：JP2008108846A
公开(公告)日：2008-05-08
申请号：JP2006289066
申请日：2006-10-24
申请人： Lintec Corp , Senju Metal Ind Co Ltd , リンテック株式会社 , 千住金属工業株式会社
发明人： SHINODA TOMONORI , SHIZUHATA HIRONORI , SHINODA HIROFUMI , KAWAMATA YUJI , TAJIMA TAKESHI , SHIMAMURA MASAHITO , WATANABE MASAKO , AMAMI MASAZUMI
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/105 , H01L24/73 , H01L25/0657 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a wiring connection method by a spacer sheet which ensures the height of connection terminal distance and narrow pitch simultaneously in a POP type semiconductor package, and to provide a POP type composite semiconductor device of high mounting density. SOLUTION: The spacer sheet for composite semiconductor device arranged between the semiconductor packages of the composite semiconductor device formed by laminating a plurality of semiconductor packages comprises through holes arranged in correspondence with electrodes formed on a substrate which can be bonded to the substrate of one semiconductor package and connecting/wiring the one semiconductor package with the other semiconductor package, the main portion of one semiconductor package being mounted on the substrate, and an air gap portion corresponding to the main portion of the other semiconductor package opposing the substrate. A method for manufacturing the composite semiconductor device employing the spacer sheet is also provided. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种隔离片的布线连接方法，其在POP型半导体封装中同时确保了连接端子距离和窄间距的高度，并且提供了高安装密度的POP型复合半导体器件。解决方案：配置在通过层叠多个半导体封装形成的复合半导体器件的半导体封装之间的复合半导体器件用间隔片包括与形成在基板上的电极对应地布置的通孔，该基板可以结合到基板上一个半导体封装，并且将一个半导体封装与另一个半导体封装连接/布线，一个半导体封装的主要部分安装在基板上，以及对应于与该基板相对的另一个半导体封装的主要部分的气隙部分。还提供了使用间隔片的复合半导体器件的制造方法。版权所有（C）2008，JPO＆INPIT

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