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1. 发明专利

JP2008108847A Composite semiconductor device, semiconductor package and spacer sheet employed therein, and manufacturing method of composite semiconductor device 有权
标题翻译：复合半导体器件，半导体封装和其使用的间隔片，以及复合半导体器件的制造方法
公开(公告)号：JP2008108847A
公开(公告)日：2008-05-08
申请号：JP2006289070
申请日：2006-10-24
申请人： Lintec Corp , Senju Metal Ind Co Ltd , リンテック株式会社 , 千住金属工業株式会社
发明人： SHINODA TOMONORI , SHIZUHATA HIRONORI , SHINODA HIROFUMI , KAWAMATA YUJI , TAJIMA TAKESHI , SHIMAMURA MASAHITO , WATANABE MASAKO , AMAMI MASAZUMI
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06568 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a method for ensuring wiring connection between both semiconductor packages by ensuring an installation space between an upper semiconductor package and a lower semiconductor package in a POP type semiconductor package and preventing a short circuit of adjoining connection terminals, and to provide a semiconductor device. SOLUTION: The composite semiconductor device comprises a spacer sheet 100 having the wiring connection substrate 12 of an upper semiconductor package having a lower surface on which electrodes 122 for conducting between the packages are arranged, the wiring connection substrate 13 of a lower semiconductor package having an upper surface on which electrodes 132 for conducting between the packages are arranged, and through holes 104 arranged around an air gap for interconnecting the electrodes which are arranged oppositely between the substrates and bonded to the substrates while being sandwiched, connection terminals 141 and 142 provided in the through hole of the spacer sheet in order to conduct between the substrates, and a terminal 140 for external connection formed on the lower surface of the wiring connection substrate of a semiconductor package located at the lowest portion. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过确保在POP型半导体封装中的上半导体封装和下半导体封装之间的安装空间来确保两个半导体封装之间的布线连接的方法，并防止邻接的连接端子的短路并提供半导体器件。解决方案：复合半导体器件包括具有上半导体封装的布线连接基板12的间隔片100，下布置有用于在封装之间导电的电极122，下半导体的布线连接基板13 具有上表面的封装，其上布置有用于在封装之间导电的电极132;以及通孔104，布置在气隙周围，用于互连电极，这些电极相互布置在基板之间并被夹在基板之间，连接端子141和 142，其设置在间隔片的通孔中以便在基板之间导通，以及形成在位于最下部的半导体封装的布线连接基板的下表面上的外部连接用端子140。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008108846A Spacer sheet for composite semiconductor device, manufacturing method of semiconductor package and composite semiconductor device employing it, and composite semiconductor device 有权
标题翻译：用于复合半导体器件的间隔片，半导体封装的制造方法和使用它的复合半导体器件以及复合半导体器件
公开(公告)号：JP2008108846A
公开(公告)日：2008-05-08
申请号：JP2006289066
申请日：2006-10-24
申请人： Lintec Corp , Senju Metal Ind Co Ltd , リンテック株式会社 , 千住金属工業株式会社
发明人： SHINODA TOMONORI , SHIZUHATA HIRONORI , SHINODA HIROFUMI , KAWAMATA YUJI , TAJIMA TAKESHI , SHIMAMURA MASAHITO , WATANABE MASAKO , AMAMI MASAZUMI
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/105 , H01L24/73 , H01L25/0657 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a wiring connection method by a spacer sheet which ensures the height of connection terminal distance and narrow pitch simultaneously in a POP type semiconductor package, and to provide a POP type composite semiconductor device of high mounting density. SOLUTION: The spacer sheet for composite semiconductor device arranged between the semiconductor packages of the composite semiconductor device formed by laminating a plurality of semiconductor packages comprises through holes arranged in correspondence with electrodes formed on a substrate which can be bonded to the substrate of one semiconductor package and connecting/wiring the one semiconductor package with the other semiconductor package, the main portion of one semiconductor package being mounted on the substrate, and an air gap portion corresponding to the main portion of the other semiconductor package opposing the substrate. A method for manufacturing the composite semiconductor device employing the spacer sheet is also provided. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种隔离片的布线连接方法，其在POP型半导体封装中同时确保了连接端子距离和窄间距的高度，并且提供了高安装密度的POP型复合半导体器件。解决方案：配置在通过层叠多个半导体封装形成的复合半导体器件的半导体封装之间的复合半导体器件用间隔片包括与形成在基板上的电极对应地布置的通孔，该基板可以结合到基板上一个半导体封装，并且将一个半导体封装与另一个半导体封装连接/布线，一个半导体封装的主要部分安装在基板上，以及对应于与该基板相对的另一个半导体封装的主要部分的气隙部分。还提供了使用间隔片的复合半导体器件的制造方法。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007122965A Insulation sheet for conductive junction sheet, conductive junction sheet, method of manufacturing conductive junction sheet and method of manufacturing electronic composite component 有权
标题翻译：导电连接片绝缘片，导电连接片，制造导电连接片的方法及制造电子复合组件的方法
公开(公告)号：JP2007122965A
公开(公告)日：2007-05-17
申请号：JP2005311379
申请日：2005-10-26
申请人： Lintec Corp , Senju Metal Ind Co Ltd , リンテック株式会社 , 千住金属工業株式会社
发明人： SHINODA TOMONORI , YAMAZAKI OSAMU , SAEKI NAOYA , KOYAKATA MASAHIRO , KAWAMATA YUJI , TAJIMA TAKESHI , SHIMAMURA MASAHITO , WATANABE MASAKO , AMAMI MASAZUMI
IPC分类号： H01B17/56 , B32B7/02 , H01B5/14 , H01B13/00 , H01L21/60 , H05K3/32
CPC分类号： H05K3/3478 , C09J7/29 , C09J2433/00 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K2201/10424 , H05K2203/041 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulation sheet for a conductive junction sheet capable of solidly holding arranged conductive particles and of preventing loss thereof; to provide a conductive junction sheet and its manufacturing method; and to provide a manufacturing method of an electronic composite component using the conductive junction sheet. SOLUTION: This insulation sheet for the conductive junction sheet is characterized by having at least one adhesive layer capable of holding conductive particles. This conductive junction sheet using it and this method of manufacturing an electronic composite component using the conductive junction sheet are also provided. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够牢固地保持布置的导电颗粒并防止其损失的导电接合片的绝缘片; 提供导电接合片及其制造方法; 并提供使用导电性接合片的电子复合元件的制造方法。解决方案：用于导电接合片的绝缘片的特征在于具有至少一个能够保持导电颗粒的粘合剂层。还提供了使用它的导电接合片和使用导电接合片制造电子复合元件的方法。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004261863A Lead-free solder 有权
公开(公告)号：JP2004261863A
公开(公告)日：2004-09-24
申请号：JP2003112287
申请日：2003-04-17
申请人： Senju Metal Ind Co Ltd , Texas Instr Japan Ltd , 千住金属工業株式会社 , 日本テキサス・インスツルメンツ株式会社
发明人： AMAMI MASAZUMI , WATANABE MASAKO , MURATA KENSHIYOU , TOYODA YOSHITAKA , UEJIMA MINORU , ONISHI TSUKASA , TAJIMA TAKESHI , SOMA DAISUKE , ROPPONGI TAKAHIRO , OKADA HIROSHI
IPC分类号： B23K35/26
摘要： PROBLEM TO BE SOLVED: To solve problems that, though Sn-Ag-Cu lead-free solder has excellent resistance against impact and heat cycle if a soldering area is large, the resistance is not sufficient if a soldered part in BGA or the like is small, and Sn-Ag-Cu lead-free solder is discolored yellow on surface in a high-temperature shelf test, and correct inspection cannot be carried out in the image processing.
SOLUTION: The Sn-Ag-Cu lead-free solder has a composition consisting, by mass, of 0.05 to 5% Ag, 0.01 to 0.3% Cu, 0.001 to 0.05% one or two or more kinds of P, Ge, Ga, Al and Si, and the balance Sn. In addition, transition elements, elements such as Bi, In and Zn, and elements such as Sb are added thereto to enhance heat-cycle resistance, to drop the melting point, and to enhance the impact resistance.
COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004214468A Leadless parts and lead-free solder 审中-公开
公开(公告)号：JP2004214468A
公开(公告)日：2004-07-29
申请号：JP2003000787
申请日：2003-01-07
申请人： Senju Metal Ind Co Ltd , Texas Instr Japan Ltd , 千住金属工業株式会社 , 日本テキサス・インスツルメンツ株式会社
发明人： AMAMI MASAZUMI , WATANABE MASAKO , MURATA KENSHIYOU , TOYODA YOSHITAKA , UEJIMA MINORU , ONISHI TSUKASA , TAJIMA TAKESHI
IPC分类号： B23K35/26 , C22C12/00 , C22C13/02 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide leadless parts with reduced voids and heat cycle resistance by forming a bump using a lead-free solder involving a proper amount of Cu added thereinto.
SOLUTION: The leadless electronic parts are adapted such that the bump is formed using the lead-free solder containing Cu of 0.001 to 0.1 mass % added to a bump having a diameter of 30 to 700 μm.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2004141910A Lead-free solder alloy 审中-公开
标题翻译：无铅焊接合金
公开(公告)号：JP2004141910A
公开(公告)日：2004-05-20
申请号：JP2002308849
申请日：2002-10-23
申请人： Senju Metal Ind Co Ltd , Texas Instr Japan Ltd , 千住金属工業株式会社 , 日本テキサス・インスツルメンツ株式会社
发明人： AMAMI MASAZUMI , WATANABE MASAKO , MURATA KENSHIYOU , TAGUCHI NARUTOSHI , TOYODA YOSHITAKA , UEJIMA MINORU , ONISHI TSUKASA , TAJIMA TAKESHI
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder alloy having excellent impact resistance and heat cycle resistance of bumps by solving such a problem that the conventional Sn-Ag type lead-free solder has not satisfactory impact resistance and heat cycle resistance in a microscopic part of solder bump etc. with respect to the debonding of a soldered part of a mobile electronic appliance due to the shock on the falling of the electronic mobile often encountered during use or conveyance and the heat-cycling of the electronic appliance that, in use, the temperature of the soldered part is raised due to the heat generation of coils and resistors etc. inside the appliance and, in nonuse, it is cooled. SOLUTION: The lead-free solder alloy consists of Sb 0.01∼1wt.%, Ni 0.01∼0.5wt.% and remainder of Sn. Further, Ag and/or Cu is preferably added to the solder alloy and, furthermore, P, Ge, Ga and Co are preferably added thereto. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过解决传统的Sn-Ag型无铅焊料不具有令人满意的耐冲击性和热循环性的问题，提供具有优异的耐冲击性和耐冲击循环性的无铅焊料合金由于在使用或运输过程中经常遇到的电子移动器的坠落以及电子设备的热循环的冲击，相对于移动电子设备的焊接部分的剥离，焊料凸起的微观部分中的电阻在使用中，由于器具内部的线圈和电阻器等的发热，焊接部件的温度升高，并且在不使用中被冷却。
解决方案：无铅焊料合金由Sb 0.01〜1重量％，Ni 0.01〜0.5重量％和Sn余量组成。此外，Ag和/或Cu优选添加到焊料合金中，此外，优选添加P，Ge，Ga和Co。版权所有（C）2004，JPO

7. 发明专利

JPH08301370A PACKAGING DEVICE 失效
公开(公告)号：JPH08301370A
公开(公告)日：1996-11-19
申请号：JP11452395
申请日：1995-05-12
申请人： TOTAL PACK KK , LINTEC CORP
发明人： TAJIMA TAKESHI , SAKURAI ISAO
IPC分类号： B65D85/57 , B65D85/00
摘要： PURPOSE: To provide a packaging device being suitable for the packaging of disk-shaped articles, wherein the taking out or putting in of an article to be packaged or the attaching or removing of a verse card or explanation slip can be easily done, and a stable packaging can be performed so that an abrasion may not generate inside. CONSTITUTION: A leaf paper is folded into a flat form of a polygonal shape which is flat and triangular or more, and a paper package 2 is constituted by exposing one part of the folded line 6 at least to one surface of the flat surface, and the package 2 is inserted between a folded face paper 1. By doing so, the opening/closing is easy, and a disk-form article can be contained while being prevented from freely moving. In addition, the disk-form article can be well kept from dropping, and by making the whole body with paper, the package can be manufactured at a low cost, and the disposal is facilitated as well.

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